Performance Uplift for High-End Edge Computing Platforms with the Latest Intel® Xeon® D-2800 and D-1800 Processors

Ismaning, Germany, February 26, 2024 – Kontron, a leading global provider of IoT/Embedded Computer Technology (ECT), introduces the COM-HPC^® Server Module COMh-sdID based on the Intel^® Xeon^® D-2800 processor, along with the COMh-sdIL and the COM-Express^® basic featuring the Intel^® Xeon^® D-1800 processor. These three modules offer application developers impeccable scalability and flexibility for high-end edge computing.

The COMh-sdID Server Module, measuring 160 x 160 mm with scalability ranging from 4 to 20 cores, features 4x DIMM sockets supporting up to 512 GB DDR4 memory at 3200 MT/s. Optionally, a soldered NVMe SSD onboard with up to 1 TByte storage capacity is available as a storage medium. It boasts 48x PCIe lanes (32x PCIe Gen4 plus 16x PCIe Gen3 lanes) and 2x Quad LAN interfaces, supporting up to 100 Gbit Ethernet, providing extensive interface and communication options.

In "Size D small" format, the COM-HPC® Server Module COMh-sdIL, with dimensions of 120 x 160 mm, is even more compact than the standard COM-HPC^® Size D design (160 x 160 mm). With all components soldered, the module is highly resistant to shock and vibration, making it ideal for outdoor applications. Equipped with 16x PCIe Gen4 plus 16x PCIe Gen3 lanes and a maximum of 64 GB soldered DDR4 memory at 2933 MT/s, it offers a soldered NVMe SSD onboard with up to 1 TByte storage capacity as an optional storage medium.
 
The COM-Express^® basic COMe-bID7, based on the Intel^® Xeon^® D-1800 processor, offers scalability from 4 to 10 cores in a small form factor, enabling robust and space-saving implementations in harsh environments and under extreme conditions. The module features up to 4x SO-DIMM sockets supporting a maximum of 128 GB memory. Optionally, a soldered NVMe SSD onboard with up to 1 TByte storage capacity is available. With 16x PCIe Gen4 plus 16x PCIe Gen3 lanes and 4x 10GBASE-KR interfaces, it provides ideal support for high data throughput rates in challenging I/O and network structures.
 
Robust and Scalable High-Performance Modules

All three modules are equipped with SKUs for operation in an extended industrial temperature range of -40 °C to +85 °C and ensuring 24/7 reliability for 10 years. These features guarantee highly robust implementations for harsh environments and extreme conditions within a small mechanical footprint. With scalable performance, complemented by Intel^® QuickAssist Technology (QAT) and AI acceleration with Intel^® AVX-512, the modules are perfectly suited for use in complex AI applications, high-performance network platforms, and edge servers. Featuring real-time capabilities, low latency, and determinism with Intel® Time Coordinated Computing (TCC) and Time Sensitive Networking (TSN), these platforms are ideal for high-performance IoT edge computing applications.

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Further information:
 
A photograph in high resolution is provided here: https://profil-marketing.cloud/index.php/s/xY4n7MYH542BzSQ
 
For more information please visit: https://www.kontron.com/en/products/boards-standard-form-factors/com-hpc/com-hpc-server-modules/c176423 bzw. https://www.kontron.com/en/products/come-bid7/p171588

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About Kontron

Kontron AG (www.kontron.com , ISIN AT0000A0E9W5, WKN A0X9EJ, KTN) is a leading IoT technology company. For more than 20 years, Kontron has been supporting companies from a wide range of industries to achieve their business goals with intelligent solutions. From automated industrial operations, smarter and safer transport to advanced communications, medical and energy solutions, the company delivers technologies that add value for its customers. Kontron is listed on the SDAX® and TecDAX® of the German Stock Exchange and has around 4,700 employees with subsidiaries in more than 20 countries around the world.

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Alexandra Kentros
Kontron AG - Communications
Tel: +49 151 151 9388 149
group-pr@kontron.com
 

All rights reserved. Kontron is a trademark or registered trademark of Kontron Europe GmbH. All other brand or product names are trademarks or registered trademarks or copyrights by their respective owners and are recognized. All data is for information purposes only and not guaranteed for legal purposes. Subject to change without notice. Information in this press release has been carefully checked and is believed to be accurate; however, no responsibility is assumed for inaccuracies.