COMe-bV26
COM Express® Basic V2000 with AMD Embedded V-Series high-performance “Zen2” CPU
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Specifications
- Up to 64 GByte DDR4 memory (2x 32 GByte dual-channel DDR4 SO-DIMM)
- Up to 8 PCIe lanes (4x PCIe 3.0 (up to 8 GT/s) 4x PCIe 2.0 (up to 5 GT/s))
- Optional up to 1 TByte NVMe SSD onboard
- Industrial grade versions available
Downloads
Solution Brief
Intel Solution Brief: Computer-on-Module Flexibility at the Edge
Kontron COM Express® and COM-HPC® modules with 13th Gen Intel® Core™ mobile processors deliver powerful performance, AI, and graphics with portfolio flexibility for industrial-grade deployments.
[ 18933-1-intel-rpl-p-kontron-solution-brief-v4.pdf, 1.67 MB, Mar.03.2023 ]
Use Cases
COM Express®: A RECIPE FOR IIOT SUCCESS
How Ectron is tapping into AI and machine learning to further modernize industrial baking, yielding greater efficiency for consistently delicious baked goods
[ ectron-case-study-resized.pdf, 3.93 MB, Apr.20.2023 ]
技术参数
Datasheet COMe-bV26
[ come-bv26_datasheet.pdf, 2.01 MB, Mar.02.2023 ]
参考手册
COMe-bV26 User Guide
Rev 1.2
Aug. 23, 2023
[ come-bv26_user-guide_rev-1-2_2023-08-23.pdf, 2.88 MB, Aug.23.2023 ]
General Safety Instruction
[ general-safety-instructions.pdf, 628.88 KB, Aug.02.2024 ]
白皮书
Modules and Motherboards WP [restrictions apply]
Robotic-Assisted Surgery White Paper [restrictions apply]
Computer-on-Modules for Medical Diagnostics and Surgery
[restrictions apply]
Kontron’s new COM Express® Basic, Type 6 module, with AMD Ryzen™ Embedded V2000 processor is literally made for computing applications in medical diagnostics and operating theatres: Next to impressively powerful processor-integrated graphics, they provide massive computing power to run AI algorithms in parallel thanks to their 8 cores and up to 7 AMD Radeon™ compute units. The outcome is optimized imaging for faster medical diagnostics.
应用案例
Autonomous Driving
Read how our COM Express® Module is working perfect for application from b-plus with its flexibility, bandwith, reliability and the required graphics.
[ uc_b-plus_eu.pdf, 4.78 MB, May.26.2021 ]
The tough choice of Processors
Solving challenges in selecting computer boards & modules for IIoT projects. In this article we support you to make the right choice for your application: To find the best balance of processing power, graphics capabilities and connectivity on the one hand and size, power consumption, and cost on the other.
[ artikel_processor-choice_eu-1-.pdf, 4.42 MB, Apr.20.2023 ]
COM Express® Basic for Autonomous Transportation in Rugged Environments
Implementing Kontron’s latest COMe® Basic based on Intel’s® 11th generation Xeon® processors and ECC memory provided the optimum power and performance
[ adas_en_use-case_kontron.pdf, 1.54 MB, Oct.11.2022 ]
Tech Spec Sheet
Tech Specs COM EXPRESS®
[ tech-spec_comexpress.pdf, 7.08 MB, Apr.04.2024 ]
Services
Kontron Services Brochure
[ kontron-services-brochure.pdf, 8.9 MB, Dec.17.2020 ]
Variants
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COMe-bV26 V2748 38036-0000-29-8 |
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COM Express® basic pin-out type 6 Computer-on-Module with AMD V2748, 8x2.9GHz, 2x DDR4 non-ECC/ECC SO-DIMM | |
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COMe-bV26 V2718 38036-0000-17-8 |
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COM Express® basic pin-out type 6 Computer-on-Module with AMD V2718, 8x1.7GHz, 2x DDR4 non-ECC/ECC SO-DIMM | |
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COMe-bV26 V2546 38036-0000-30-6 |
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COM Express® basic pin-out type 6 Computer-on-Module with AMD V2546, 6x3.0GHz, 2x DDR4 non-ECC/ECC SO-DIMM | |
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COMe-bV26 V2516 38036-0000-21-6 |
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COM Express® basic pin-out type 6 Computer-on-Module with AMD V2516, 6x2.1GHz, 2x DDR4 non-ECC/ECC SO-DIMM |
Accessories
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HSP COMe-bV26 Cu-core threaded 38036-0000-99-0 |
Heatspreader for COMe-bV26, Cu-core, threaded mounting holes | ||
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HSP COMe-bV26 Cu-core through 38036-0000-99-1 |
Heatspreader for COMe-bV26, Cu-core, through mounting holes | ||
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DDR4-3200 SODIMM 4GB_BV26 97020-0432-BV26 |
Memory for Computer-on-Module COMe-bV26; min. specification: DDR4-3200, 4GB, 260P, 1600MHz, PC4-3200 SODIMM; validated for: COMe-bV26 | ||
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DDR4-3200 SODIMM 8GB_BV26 97020-0832-BV26 |
Memory for Computer-on-Module COMe-bV26; min. specification: DDR4-3200, 8GB, 260P, 1600MHz, PC4-3200 SODIMM; validated for: COMe-bV26 | ||
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DDR4-3200 SODIMM 16GB_BV26 97020-1632-BV26 |
Memory for Computer-on-Module COMe-bV26; min. specification: DDR4-3200, 16GB, 260P, 1600MHz, PC4-3200 SODIMM; validated for: COMe-bV26 | ||
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DDR4-3200 SODIMM 32GB_BV26 97020-3232-BV26 |
Memory for Computer-on-Module COMe-bV26; min. specification: DDR4-3200, 32GB, 260P, 1600MHz, PC4-3200 SODIMM; validated for: COMe-bV26 | ||
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DDR4-3200 SODIMM 4GB ECC_BV26 97030-0432-BV26 |
Memory for Computer-on-Module COMe-bV26; min. specification: DDR4-3200, 4GB, 260P, 1600MHz, PC4-3200 SODIMM; validated for: COMe-bV26 | ||
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DDR4-3200 SODIMM 8GB ECC_BV26 97030-0832-BV26 |
Memory for Computer-on-Module COMe-bV26; min. specification: DDR4-3200, 8GB, 260P, 1600MHz, PC4-3200 SODIMM; validated for: COMe-bV26 | ||
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DDR4-3200 SODIMM 16GB ECC_BV26 97030-1632-BV26 |
Memory for Computer-on-Module COMe-bV26; min. specification: DDR4-3200, 16GB, 260P, 1600MHz, PC4-3200 SODIMM; validated for: COMe-bV26 | ||
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DDR4-3200 SODIMM 32GB ECC_BV26 97030-3232-BV26 |
Memory for Computer-on-Module COMe-bV26; min. specification: DDR4-3200, 32GB, 260P, 1600MHz, PC4-3200 SODIMM; validated for: COMe-bV26 | ||
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COMe Eval Carrier2 T6
38116-0000-00-5 |
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COM Express® Eval Carrier2 Type 6 with 5mm COMe connector | more |
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HSK COMe-basic active (w/o HSP) 38025-0000-99-0C05 |
Active Cooler for COMe-bxL6/bV26/bDV7/bID7 to be mounted on HSP | ||
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HSK COMe-basic passive (w/o HSP) 38025-0000-99-0C06 |
Passive Cooler for COMe-bxL6/bV26/bDV7/bID7 to be mounted on HSP |
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