IoT

One of the new challenges arising with the use of edge, fog, and cloud architectures is the connection of components to each other and to the public cloud. An important element of developing a solution capturing all pieces is the IoT framework susietec

At the field, or edge level, data is collected by industrial computers, e.g. by gateways, which process, filter, analyze and act on these data in real-time right at the device.

Edge, fog and cloud applications demand increasing computing power. The interfaces to sensors or machines often require non-standard solutions. Especially in smaller machines, space is limited or restricted in some dimension and need a special solution.

Today, the connection from the sensor device to the embedded cloud takes place via real-time data communication, on sensor and edge level - for example Industrial Ethernet or fieldbuses - and gateways , which provide the transformation of real time data into the informational area.

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COMe-cAS6 (E2)

COM Express® compact Type 6 with Intel Atom® x7000E / x7000RE

Specifications

Coming soon

Low-Power – Performance/Watt optimized form factor solution
Up to 16 GByte DDR5 4800 MT/s - In-Band ECC
Up to 4x Graphics interfaces
Up to 6x PCIe lanes, up to 4x USB 3.2/2.0, 6x USB 2.0
Up to 2.5 Gb Ethernet with TSN support
Industrial grade temperature

Download Datasheet

The COMe-cAS6 (E2) supports the broad scalability of the new Intel Atom® series x7000E/x7000RE, Intel® Processor N Series, and Intel® Core™ i3-N305 processor designed for IoT applications. The range extends from the cost-optimized 2-core to high-performance 8-core Intel® Core™ i3 solution with up to 3.8 GHz burst frequency.

The COMe-cAS6 (E2) provides up to 16 Gigabyte of DDR5-4800 memory via one SODIMM memory socket, supports up to four displays, six PCIe 3.0 lanes, up to four USB 3.2 Gen2/2.0, four USB 2.0 interfaces, two SATA ports, one 2.5 GBASE-T Ethernet with TSN and optional eMMC flash.

Downloads

Solution Brief

Intel Solution Brief: Computer-on-Module Flexibility at the Edge
Kontron COM Express® and COM-HPC® modules with 13th Gen Intel® Core™ mobile processors deliver powerful performance, AI, and graphics with portfolio flexibility for industrial-grade deployments.
[ 18933-1-intel-rpl-p-kontron-solution-brief-v4.pdf, 1.67 MB, Mar.03.2023 ]

技术参数

Datasheet COMe-cAS6 (E2)
[ come-cas6_datasheet.pdf, 1.04 MB, Oct.02.2024 ]

参考手册

General Safety Instruction
[ general-safety-instructions.pdf, 628.88 KB, Aug.02.2024 ]

白皮书

Modules and Motherboards WP [restrictions apply]

Robotic-Assisted Surgery White Paper [restrictions apply]

应用案例

Autonomous Driving
Read how our COM Express® Module is working perfect for application from b-plus with its flexibility, bandwith, reliability and the required graphics.
[ uc_b-plus_eu.pdf, 4.78 MB, May.26.2021 ]

COM Express® Basic for Autonomous Transportation in Rugged Environments
Implementing Kontron’s latest COMe® Basic based on Intel’s® 11th generation Xeon® processors and ECC memory provided the optimum power and performance
[ adas_en_use-case_kontron.pdf, 1.54 MB, Oct.11.2022 ]

The tough choice of Processors
Solving challenges in selecting computer boards & modules for IIoT projects. In this article we support you to make the right choice for your application: To find the best balance of processing power, graphics capabilities and connectivity on the one hand and size, power consumption, and cost on the other.
[ artikel_processor-choice_eu-1-.pdf, 4.42 MB, Apr.20.2023 ]

Tech Spec Sheet

COM EXPRESS® compact
[ tech-spec_comexpress.pdf, 7.08 MB, Apr.04.2024 ]

Services

Kontron Services Brochure
[ kontron-services-brochure.pdf, 8.9 MB, Dec.17.2020 ]

Variants

COMe-cAS6 E2 x7211RE 36039-0000-R1-2		COM Express® compact pin-out type 6 with Intel® Atom® x7211RE, 6W, 2 core, 1.0GHz, 1x SODIMM socket for DDR5-4800 MT/s, i226-IT, industrial temperature
COMe-cAS6 E2 x7213RE 36039-0000-R2-2		COM Express® compact pin-out type 6 with Intel® Atom® x7213RE, 9W, 2 core, 2.0GHz, 1x SODIMM socket for DDR5-4800 MT/s, i226-IT, industrial temperature
COMe-cAS6 E2 x7433RE 36039-0000-R2-4		COM Express® compact pin-out type 6 with Intel® Atom® x7433RE, 9W, 4 core, 1.5GHz, 1x SODIMM socket for DDR5-4800 MT/s, i226-IT, industrial temperature
COMe-cAS6 E2 x7835RE 36039-0000-R2-8		COM Express® compact pin-out type 6 with Intel® Atom®x7835RE, 12W, 8 core, 1.3GHz, 1x SODIMM socket for DDR5-4800 MT/s, i226-IT, industrial temperature

Accessories

COMe Eval Carrier2 T6 38116-0000-00-5	COM Express® Eval Carrier2 Type 6 with 5mm COMe connector	more
HSP COMe-cAS6 (E2) threaded 36039-0000-99-0	Heatspreader for COMe-cAS6 commercial and E2, threaded mounting holes
HSP COMe-cAS6 (E2) through 36039-0000-99-1	Heatspreader for COMe-cAS6 commercial and E2, through mounting holes

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