The new COM–Express® modules, based on 13th Gen Intel® Core™ (former codename Raptor Lake-P) offer a significant performance increase compared to the previous generation and are equipped with up to 14 cores based on Intel® performance hybrid architecture.
The COM-Express® modules provide essential, industrial-grade features such as support for in-band error correction code (IBECC) memory, Intel® Time Coordinated Computing (Intel® TCC), Time-Sensitive Networking (TSN) and extended temp. range of -40C to +85C (operating).
All features are perfect for applications in demanding areas such as Industrial Automation, Health Care and Automotive.
Compliance | COM Express® Compact Pin-out Type 6 |
Dimension (H x W) | 95 x 95 mm |
CPU | Intel® 13th Generation Core™ family For details see table (CPU variants) given below |
Chipset | Integrated SoC |
Main Memory | Dual-Channel LPDDR5 memory down up to 64 GByte |
Graphics Controller | Intel® Iris® Xe Graphics on i7/i5 processors Intel® UHD Graphics on i3/Celeron® processors |
Ethernet Controller | Intel® I226IT |
Ethernet | Up to 2.5Gb Ethernet with TSN support |
Storage | 2x SATA 6Gb/s |
Flash Onboard | Up to 1 TByte NVMe SSD (on request) |
PCI Express | 5x PCIe 3.0 (On request: 6x without Ethernet, up to 8x without Ethernet & SATA) 2x 4 PCIe 4.0 on PEG Lanes #0-7 1x 8 PCIe 4.0 on PEG Lanes #8-15 (depending on SKU) |
Display | DDI1: DP++, DDI2: DP++, DDI3: DP++, VGA: -, LVDS: Dual Channel 18/24bit |
USB | 4x USB 3.2 Gen2 (incl. USB 2.0) + 4x USB 2.0 |
Serial | 2x serial interface (RX/TX only) |
Audio | High Definition Audio interface |
Common Features | (G) SPI, LPC, SMB, Fast I²C, Staged Watchdog, RTC |
Special Features | POSCAP capacitors, Trusted Platform Module TPM 2.0 |
Power Management | ACPI 6.0 |
Power Supply | 8.5 V – 20 V Wide Range, Single Supply Power |
BIOS | AMI Aptio V |
Operating System | Windows®10, Linux, VxWorks (project based) |
Temperature | Industrial temperature: -40 °C to +85 °C operating, -40 °C to +85 °C non-operating |
Humidity | 93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78) |
Intel Solution Brief: Computer-on-Module Flexibility at the Edge
Kontron COM Express® and COM-HPC® modules with 13th Gen Intel® Core™ mobile processors deliver powerful performance, AI, and graphics with portfolio flexibility for industrial-grade deployments.
[ 18933-1-intel-rpl-p-kontron-solution-brief-v4.pdf, 1.67 MB, Mar.03.2023 ]
COMe-cRP6 E2
[ come-crp6_e2_datasheet.pdf, 514.47 KB, Feb.07.2024 ]
COMe-cRP6 User Guide
[ come-crp6_user_guide_1-0_2024_05_13.pdf, 19.08 MB, May.13.2024 ]
General Safety Instruction
[ general-safety-instructions.pdf, 628.88 KB, Aug.02.2024 ]
Modules and Motherboards WP [restrictions apply]
Robotic-Assisted Surgery White Paper [restrictions apply]
Autonomous Driving
Read how our COM Express® Module is working perfect for application from b-plus with its flexibility, bandwith, reliability and the required graphics.
[ uc_b-plus_eu.pdf, 4.78 MB, May.26.2021 ]
COM Express® Basic for Autonomous Transportation in Rugged Environments
Implementing Kontron’s latest COMe® Basic based on Intel’s® 11th generation Xeon® processors and ECC memory provided the optimum power and performance
[ adas_en_use-case_kontron.pdf, 1.54 MB, Oct.11.2022 ]
The tough choice of Processors
Solving challenges in selecting computer boards & modules for IIoT projects. In this article we support you to make the right choice for your application: To find the best balance of processing power, graphics capabilities and connectivity on the one hand and size, power consumption, and cost on the other.
[ artikel_processor-choice_eu-1-.pdf, 4.42 MB, Apr.20.2023 ]
COM EXPRESS® compact
[ tech-spec_comexpress.pdf, 7.08 MB, Apr.04.2024 ]
Kontron Services Brochure
[ kontron-services-brochure.pdf, 8.9 MB, Dec.17.2020 ]
All other downloads such as drivers, bios, drawings etc. are available on Kontron’s Customer Section
COME EVAL CARRIER2 T6 38116-0000-00-5 |
COM Express® Evaluation Carrier Type 6 | ||
HSP COME-CAP6 CU-CORE THREADED 36035-0000-99-0 |
Heatspreader for COMe-cAP6, Cu-core, threaded mounting holes | ||
HSP COME-CAP6 CU-CORE THROUGH 36035-0000-99-1 |
Heatspreader for COMe-cAP6, Cu-core, through mounting holes | ||
COME ACTIVE UNI COOLER2 (W/O HSP) 36099-0000-99-4 |
COM Express® Universal Active Cooler for Heatspreader Mounting (95 x 95 x 14.3) - 90° turnable | ||
COME PASSIVE UNI COOLER2 (W/O HSP) 36099-0000-99-5 |
COM Express® Universal Passive Cooler for Heatspreader Mounting (95 x 95 x 14.3) - 90° turnable |
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