COMe-mEL10 (E2) New
COM Express® mini Type 10 with Intel Atom® x6000E, Pentium® and Celeron® Series
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Specifications
- Low-Power – Performance/Watt optimized form factor solution
- Up to 16 GByte LPDDR4 memory down (In-Band ECC)
- 2x USB 3.1/2.0, 6x USB 2.0, USB client optional, 2x SATA, eMMC Flash
- 1GbE (optional 2.5GbE) with TSN support
- Industrial grade temperature
The COMe-mEL10 (E2) is a credit card sized Computer-on-Modules platform based on the Intel® Atom® x6000 Series, Pentium® and Celeron® processors.
The COMe-mEL10 (E2) performance range of COM Express mini modules is highly scalable and covers the entire range of Intel's latest IoT-ready embedded processors. This includes the Intel Atom x6000 series, as well as Intel Pentium and Intel Celeron processor. LPDDR4-4267 up to 16GB is offered, In-Band ECC support depends on the processor capability.
The modules combine state-of-the-art image processing and graphics capabilities with extensive real-time computing power in an energy-efficient and standardized Type 10 Computer-on-Module mini form factor. Users benefit from a significantly improved computing performance, an impressive performance-per-watt ratio and the long-term availability inherent in all Kontron embedded solutions.
The COMe-mEL10 (E2) comes with support for Windows 10, Linux and VxWorks 7.x
Features
| Compliance | COM Express® mini, Pin-out Type 10 - COM.0 R3.0 |
| Dimension (H x W) | 84 mm x 55 mm |
| CPU | COMe-mEL10: Intel® Celeron® J6413, 4C, 1.8/3.0GHz, 16EU, 10W Intel® Pentium® J6426, 4C, 2.0/3.0GHz, 32EU, 10W Intel® Celeron® N6211, 2C, 1.2/3.0GHz, 16EU, 6.5W Intel® Pentium® N6415, 4C, 1.2/3.0GHz, 16EU, 6.5W COMe-mEL10 E2: Intel® Atom® x6211E, 2C, 1.3/3.0GHz, 16EU, 6W Intel® Atom® x6413E, 4C, 1.5/3.0GHz, 16EU, 9W Intel® Atom® x6425E, 4C, 2.0/3.0GHz, 32EU, 12W Intel® Atom® x6212RE, 2C, 1.2GHz/-, 16EU, 6W Intel® Atom® x6214RE, 2C, 1.4GHz/-, 16EU, 6W Intel® Atom® x6414RE, 4C, 1.5GHz/-, 16EU, 9W Intel® Atom® x6416RE, 4C, 1.7GHz/-, 16EU, 9W Intel® Atom® x6425RE, 4C, 1.9GHz/-, 32EU, 12W |
| Chipset | Integrated in SoC |
| Main Memory | Up to 16 GByte LPDDR4-4267 memory down (In-Band ECC) |
| Graphics Controller | SOC: Intel® HD Gfx Gen11: LVDS/eDP, 1x DP++, up to 4K |
| Ethernet Controller | SOC + LAN PHY GPY115 (GPY215 on request) |
| Ethernet | 1GBit Ethernet with GPY115 (2.5GBit on request with GPY215) |
| Storage | 2x SATA 6 Gb/s |
| Flash Onboard | eMMC build option: - up to 84 GByte eMMC pSLC - up to 256 GByte eMMC TLC |
| PCI Express | PCIe Gen 3.0 - PCIe lane configurations: 4 x1, 2 x1 + 1 x2, 2 x2 |
| Display | DDI: DP++, LVDS: Single Channel 18/24 bit or eDP 1.3 |
| USB | 2x USB 3.1 (incl. USB 2.0) + 6x USB 2.0, Port 7 is dual role (Client/Host) |
| Serial | 2x serial interface (RX / TX only) |
| Audio | Intel® High Definition Audio |
| Common Features | SPI, LPC, SMB, Fast I²C, Staged Watchdog, RTC |
| Special Features | Industrial grade temperature |
| Options | eMMC Flash configuration (up to 84 GByte pSLC, up to 256 GByte TLC), eDP instead of LVDS, General Purpose SPI instead of Boot SP I, USB client, Seoarate TPM 2.0 chip, de-populated LAN PHY |
| Power Management | ACPI 6.0 |
| Power Supply | 4.75 V – 20 V Wide Range, Single Supply Power |
| BIOS | AMI Aptio V |
| Operating System | Microsoft® Windows 11 IoT LTSC, Microsoft® Windows 10 IoT LTSC, Linux, VxWorks |
| Temperature | COMe-mEL10- commercial temperature: 0° C to +60° C operating, -30° C to +85° C non-operating COMe-mEL10 E2 - industrial temperature: -40° C to +85° C operating, -40° C to +85° C non-operating |
| Humidity | 93% relative Humidity at 40°C, non-condensing (according to IEC 60068-2-78) |
| Supported Modules | commercial temperature: COMe-mEL10 (34012-xxxx-xx-x) industrial temperature: COMe-mEL10 E2 (34013-xxxx-xx-x) |
Downloads
Solution Brief
Intel Solution Brief: Computer-on-Module Flexibility at the Edge
Kontron COM Express® and COM-HPC® modules with 13th Gen Intel® Core™ mobile processors deliver powerful performance, AI, and graphics with portfolio flexibility for industrial-grade deployments.
[ 18933-1-intel-rpl-p-kontron-solution-brief-v4.pdf, 1.67 MB, Mar.03.2023 ]
技术参数
Datasheet COMe-mEL10
[ come-mel10_datasheet.pdf, 441.23 KB, Dec.02.2024 ]
参考手册
COMe-mEL10 (E2) User Guide
Rev 1.4
[ come-mel10_user-guide_rev_1-4_2024-1126.pdf, 3.85 MB, Nov.29.2024 ]
General Safety Instruction
[ general-safety-instructions.pdf, 628.88 KB, Aug.02.2024 ]
白皮书
Modules and Motherboards WP [restrictions apply]
Robotic-Assisted Surgery White Paper [restrictions apply]
应用案例
Autonomous Driving
Read how our COM Express® Module is working perfect for application from b-plus with its flexibility, bandwith, reliability and the required graphics.
[ uc_b-plus_eu.pdf, 4.78 MB, May.26.2021 ]
COM Express® Basic for Autonomous Transportation in Rugged Environments
Implementing Kontron’s latest COMe® Basic based on Intel’s® 11th generation Xeon® processors and ECC memory provided the optimum power and performance
[ adas_en_use-case_kontron.pdf, 1.54 MB, Oct.11.2022 ]
The tough choice of Processors
Solving challenges in selecting computer boards & modules for IIoT projects. In this article we support you to make the right choice for your application: To find the best balance of processing power, graphics capabilities and connectivity on the one hand and size, power consumption, and cost on the other.
[ artikel_processor-choice_eu-1-.pdf, 4.42 MB, Apr.20.2023 ]
Tech Spec Sheet
Tech Specs COM EXPRESS®
[ tech-spec_comexpress.pdf, 7.08 MB, Apr.04.2024 ]
Services
Kontron Services Brochure
[ kontron-services-brochure.pdf, 8.9 MB, Dec.17.2020 ]
More Downloads
All other downloads such as drivers, bios, drawings etc. are available on Kontron’s Customer Section
Accessories
|
COMe Eval Carrier2 T10
34101-0000-00-2 |
|
COM Express® Evaluation Carrier Type 10 | more |
|
COMe Ref.Carrier-i T10 TNIx
34105-0000-00-x |
|
COM Express® Reference Carrier Type 10 for industrial temperature | more |
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HSP COMe-mEL10 (E2) THREAD 34013-0000-99-0 |
Heatspreader for COMe-mEL10 commercial and E2, threaded mounting holes | ||
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HSP COMe-mEL10 (E2) THROUGH 34013-0000-99-1 |
Heatspreader for COMe-mEL10 commercial and E2, through holes | ||
|
HSP COMe-mEL10 (E2) SLIM THREAD 34013-0000-99-2 |
Heatspreader Slimline 6.5mm for COMe-mEL10 commercial and E2, threaded mounting holes | ||
|
HSP COMe-mEL10 (E2) SLIM THROUGH 34013-0000-99-3 |
Heatspreader Slimline 6.5mm for COMe-mEL10 commercial and E2, through holes | ||
|
COMe mini Active Uni Cooler 34099-0000-99-0 |
COM Express® mini Universal Active Cooler for Heatspreader Mounting (for CPUs <10W) | ||
|
COMe mini Passive Uni Cooler 34099-0000-99-1 |
COM Express® mini Universal Passive Cooler for Heatspreader Mounting | ||
|
COMe mini Passive Uni Cooler Slim Top Mount 34099-0000-99-3 |
COM Express® mini Universal Passive Cooler Slim for Heatspreader Top Mounting |
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