IoT

One of the new challenges arising with the use of edge, fog, and cloud architectures is the connection of components to each other and to the public cloud. An important element of developing a solution capturing all pieces is the IoT framework susietec

At the field, or edge level, data is collected by industrial computers, e.g. by gateways, which process, filter, analyze and act on these data in real-time right at the device.

Edge, fog and cloud applications demand increasing computing power. The interfaces to sensors or machines often require non-standard solutions. Especially in smaller machines, space is limited or restricted in some dimension and need a special solution.

Today, the connection from the sensor device to the embedded cloud takes place via real-time data communication, on sensor and edge level - for example Industrial Ethernet or fieldbuses - and gateways , which provide the transformation of real time data into the informational area.

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COMh-caAP

COM HPC/Client module size A with 12th Generation Intel® Core™ Processors

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Specifications

Up to 64 GByte DDR5 memory
Up to 2.5Gb Ethernet with TSN support
Optional NVMe SSD onboard

Download Datasheet Buy now

The COM-HPC^® client module with a 12th Gen Intel^® Core^™ processor and a size of 95x120mm is perfect for high-performance computing in resource-intensive areas such as networking, automation and measurement. The COMh-caAP features an optimized power-performance ratio with a power consumption of 15 to 45W TDP (Thermal Design Power); in multithreading up to 20 threads can be processed with 14 cores. The module also comes with up to 64GB of DDR5 memory and up to 2.5 Gbit Ethernet, including TSN support. As storage medium, an NVME SSD up to one terabyte can be optionally integrated onboard. The COM-HPC^® module also supports Thunderbolt (display and PCIe 5.0 via USB).

Downloads

Solution Brief

Intel Solution Brief: Computer-on-Module Flexibility at the Edge
Kontron COM Express® and COM-HPC® modules with 13th Gen Intel® Core™ mobile processors deliver powerful performance, AI, and graphics with portfolio flexibility for industrial-grade deployments.
[ 18933-1-intel-rpl-p-kontron-solution-brief-v4.pdf, 1.67 MB, Mar.03.2023 ]

技术参数

COMh-caAP
[ comh-caap_datasheet.pdf, 760.86 KB, Jul.07.2023 ]

参考手册

COMh-caAP User Guide
[ comh-caap_userguide_0-2.pdf, 1.47 MB, Jul.10.2023 ]

General Safety Instruction
[ general-safety-instructions.pdf, 628.88 KB, Aug.02.2024 ]

白皮书

Modules and Motherboards WP [restrictions apply]

Robotic-Assisted Surgery White Paper [restrictions apply]

The new Standard COM-HPC – Delivering future proofed power and connectivity [restrictions apply]
In response to the growing high performance computing requirements and to ensure Computer-on-Modules remain fit-for-purpose long into the future, a new High Performance Computing standard for Modules has been defined by the PICMG: COM-HPC®. This enables more powerful COMs that extend beyond the limits and capabilities of COM Express® (Type 6 and 7) and other COM standards. While complementary, COM-HPC® is distinct from COM Express®, directly supporting the growing need for more powerful future-proofed compute, scalability, transmission, and network performance.

Tech Spec Sheet

COM-HPC Tech Specs
[ techspec_com-hpc.pdf, 2.02 MB, Apr.04.2024 ]

Services

Kontron Services Brochure
[ kontron-services-brochure.pdf, 8.9 MB, Dec.17.2020 ]

More Downloads

All other downloads such as drivers, bios, drawings etc. are available on Kontron’s Customer Section

Accessories

COMh Mounting Kit
HXX17-0000-00-0

COM-HPC Universal Mounting Kit

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