IoT

One of the new challenges arising with the use of edge, fog, and cloud architectures is the connection of components to each other and to the public cloud. An important element of developing a solution capturing all pieces is the IoT framework susietec

At the field, or edge level, data is collected by industrial computers, e.g. by gateways, which process, filter, analyze and act on these data in real-time right at the device.

Edge, fog and cloud applications demand increasing computing power. The interfaces to sensors or machines often require non-standard solutions. Especially in smaller machines, space is limited or restricted in some dimension and need a special solution.

Today, the connection from the sensor device to the embedded cloud takes place via real-time data communication, on sensor and edge level - for example Industrial Ethernet or fieldbuses - and gateways , which provide the transformation of real time data into the informational area.

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COMh Eval Carrier Client New

COMh Eval Carrier Client

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Specifications

Support of 48 PCIe lanes via various PCIe and m.2 slots
2x 10/1GBase-T interface
2x USB Gen 4 + 2x USB 3.2 Gen 2x1, 2x SATA
3x DisplayPort, 1x eDP, 2x MIPI-CSI
BIOS POST-Code display

Download Datasheet

The Kontron COMh-Client Eval Carrier offers a complete set of standard interfaces, such as USB, SATA and DisplayPort, as well as many PCIe interfaces; thus supporting and optimizing the design-in phase of COMh-ccAS, COMh-caAP and COMh-caRP

Downloads

Solution Brief

Intel Solution Brief: Computer-on-Module Flexibility at the Edge
Kontron COM Express® and COM-HPC® modules with 13th Gen Intel® Core™ mobile processors deliver powerful performance, AI, and graphics with portfolio flexibility for industrial-grade deployments.
[ 18933-1-intel-rpl-p-kontron-solution-brief-v4.pdf, 1.67 MB, Mar.03.2023 ]

技术参数

COMh Eval Carrier Client Datasheet
[ comh-client-carrier_datasheet.pdf, 665.15 KB, Jun.06.2024 ]

参考手册

COM-HPC/Client Eval-Carrier User Guide
[ com-hpc_client_eval_carrier_user_guide_rev_1-0_2024-07-16_w2016.pdf, 5.48 MB, Jul.18.2024 ]

General Safety Instruction
[ general-safety-instructions.pdf, 628.88 KB, Aug.02.2024 ]

白皮书

Modules and Motherboards WP [restrictions apply]

Robotic-Assisted Surgery White Paper [restrictions apply]

The new Standard COM-HPC – Delivering future proofed power and connectivity [restrictions apply]
In response to the growing high performance computing requirements and to ensure Computer-on-Modules remain fit-for-purpose long into the future, a new High Performance Computing standard for Modules has been defined by the PICMG: COM-HPC®. This enables more powerful COMs that extend beyond the limits and capabilities of COM Express® (Type 6 and 7) and other COM standards. While complementary, COM-HPC® is distinct from COM Express®, directly supporting the growing need for more powerful future-proofed compute, scalability, transmission, and network performance.

Tech Spec Sheet

COM-HPC Tech Specs
[ techspec_com-hpc.pdf, 2.02 MB, Apr.04.2024 ]

Services

Kontron Services Brochure
[ kontron-services-brochure.pdf, 8.9 MB, Dec.17.2020 ]

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