IoT

One of the new challenges arising with the use of edge, fog, and cloud architectures is the connection of components to each other and to the public cloud. An important element of developing a solution capturing all pieces is the IoT framework susietec

At the field, or edge level, data is collected by industrial computers, e.g. by gateways, which process, filter, analyze and act on these data in real-time right at the device.

Edge, fog and cloud applications demand increasing computing power. The interfaces to sensors or machines often require non-standard solutions. Especially in smaller machines, space is limited or restricted in some dimension and need a special solution.

Today, the connection from the sensor device to the embedded cloud takes place via real-time data communication, on sensor and edge level - for example Industrial Ethernet or fieldbuses - and gateways , which provide the transformation of real time data into the informational area.

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COMh-sdID (E2) New

COM-HPC®/Server with Intel® Xeon® D-2700 / D-2800 processor family

Specifications

Size D form factor – 160 x 160 mm
Intel Xeon D-2700 / D-2800 Server platform
Up to 20 cores, processor TDP up to 125W
32x PCIe Gen 4.0 lanes + 16x PCIe Gen 3.0 lanes
8x LAN Ports for various configurations - up to 100GbE
Memory: Max 512GB DDR4-DIMM with 4x DIMM sockets
Optional onboard storage NVMe
Industrial temperature versions
Embedded management controller

Download Datasheet Buy now

The COMh-sdID with scalability from 4 to 20 cores and SKUs for an extended temperature range and 24x7 / 10 years reliability allows very robust implementations for harsh environments and extreme conditions in a small mechanical footprint.

The module accommodates 4x DIMM sockets for a max. of 512GB DDR4 memory at 3200 MT/s. As storage medium, a soldered NVMe SSD onboard with up to 1 TByte storage capacity is optionally available.

With 48x PCIe lanes (32x PCIe Gen4 plus 16x PCIe Gen3 lanes) and 2x Quad LAN interfaces supporting 100Gb Ethernet, the COMh-sdID is an ideal platform for high data throughput requirements in demanding I/O and network structures.

Downloads

技术参数

Datasheet COMh-sdID
[ comh-sdid_datasheet.pdf, 320.59 KB, Feb.19.2024 ]

参考手册

COMh-sdID User Guide
[ comh-sdid_user_guide_rev1-0.pdf, 1.49 MB, Jul.04.2023 ]

General Safety Instruction
[ general-safety-instructions.pdf, 628.88 KB, Aug.02.2024 ]

白皮书

Modules and Motherboards WP [restrictions apply]

Robotic-Assisted Surgery White Paper [restrictions apply]

The new Standard COM-HPC – Delivering future proofed power and connectivity [restrictions apply]
In response to the growing high performance computing requirements and to ensure Computer-on-Modules remain fit-for-purpose long into the future, a new High Performance Computing standard for Modules has been defined by the PICMG: COM-HPC®. This enables more powerful COMs that extend beyond the limits and capabilities of COM Express® (Type 6 and 7) and other COM standards. While complementary, COM-HPC® is distinct from COM Express®, directly supporting the growing need for more powerful future-proofed compute, scalability, transmission, and network performance.

Tech Spec Sheet

COM-HPC Tech Specs
[ techspec_com-hpc.pdf, 2.02 MB, Apr.04.2024 ]

Services

Kontron Services Brochure
[ kontron-services-brochure.pdf, 8.9 MB, Dec.17.2020 ]

More Downloads

All other downloads such as drivers, bios, drawings etc. are available on Kontron’s Customer Section

Variants

COMh-sdID E2 D-2796TE HSD02-0000-96-1		COM-HPC Server size D, Intel® D-2796TE, 20 cores, 118W, 8x LAN ports configured as 4x 25G CEI, 4x DDR4-DIMM sockets, industrial temperature
COMh-sdID E2 D-2775TE HSD02-0000-75-1		COM-HPC Server size D, Intel® D-2775TE, 16 cores, 100W , 8x LAN ports configured as 4x 25G CEI, 4x DDR4-DIMM sockets, industrial temperature
COMh-sdID E2 D-2752TER HSD02-0000-52-1		COM-HPC Server size D, Intel® D-2752TER, 12 cores, 77W, 8x LAN ports configured as 4x 10G CEI, 4x DDR4-DIMM sockets, industrial temperature
COMh-sdID D-2796NT HSD01-0000-96-2		COM-HPC Server size D, Intel® D-2796NT, 20 cores, 120W, 8x LAN ports configured as 4x 25G CEI, 4x DDR4-DIMM sockets
COMh-sdID D-2776NT HSD01-0000-76-2		COM-HPC Server size D, Intel® D-2776NT, 16 cores, 117W, 8x LAN ports configured as 4x 25G CEI, 4x DDR4-DIMM sockets
COMh-sdID D-2753NT HSD01-0000-53-2		COM-HPC Server size D, Intel® D-2753NT, 12 cores, 87W, 8x LAN ports configured as 4x 25G CEI, 4x DDR4-DIMM sockets

Accessories

COMh Eval Carrier Server HST01-0000-10-0	COMh Eval Carrier Server	more
HSP COMh-sdID (E2) thread HSD01-0000-99-0	Heatspreader for COMh-sdID commercial and E2, threaded mounting holes
HSP COMh-sdID (E2) through HSD01-0000-99-1	Heatspreader for COMh-sdID commercial and E2, through holes
COMh Size D Active Uni Cooler (w/o HSP) HSD99-0000-99-0	COM-HPC Size D Universal Active Cooler for Heatspreader Mounting (160 x 100 x 46 mm)
COMh Size D Passive Uni Cooler (w/o HSP) HSD99-0000-99-1	COM-HPC Size D Universal Passive Cooler for Heatspreader Mounting (160 x 100 x 46 mm)
COMh Mounting Kit HXX17-0000-00-0	COM-HPC Universal Mounting Kit
DDR4-3200 LRDIMM 128GB ECC_SDID 97102-1232-SDID	DDR4-3200, 128GB, 288P, PC4-3200 LRDIMM, ECC
DDR4-3200 RDIMM 64GB ECC_SDID 97100-6432-SDID	DDR4-3200, 64GB, 288P, PC4-3200 RDIMM, ECC
DDR4-3200 RDIMM 32GB ECC_SDID 97100-3232-SDID	DDR4-3200, 32GB, 288P, PC4-3200 RDIMM, ECC
DDR4-3200 RDIMM 16GB ECC_SDID 97100-1632-SDID	DDR4-3200, 16GB, 288P, PC4-3200 RDIMM, ECC
DDR4-3200 LRDIMM 128GB ECC E2_SDID 97103-1232-SDID	DDR4-3200, 128GB, 288P, PC4-3200 LRDIMM, ECC, industrial temperature
DDR4-3200 RDIMM 64GB ECC E2_SDID 97101-6432-SDID	DDR4-3200, 64GB, 288P, PC4-3200 RDIMM, ECC, industrial temperature
DDR4-3200 RDIMM 32GB ECC E2_SDID 97101-3232-SDID	DDR4-3200, 32GB, 288P, PC4-3200 RDIMM, ECC, industrial temperature
DDR4-3200 RDIMM 16GB ECC E2_SDID 97101-1632-SDID	DDR4-3200, 16GB, 288P, PC4-3200 RDIMM, ECC, industrial temperature

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