IoT

One of the new challenges arising with the use of edge, fog, and cloud architectures is the connection of components to each other and to the public cloud. An important element of developing a solution capturing all pieces is the IoT framework susietec

At the field, or edge level, data is collected by industrial computers, e.g. by gateways, which process, filter, analyze and act on these data in real-time right at the device.

Edge, fog and cloud applications demand increasing computing power. The interfaces to sensors or machines often require non-standard solutions. Especially in smaller machines, space is limited or restricted in some dimension and need a special solution.

Today, the connection from the sensor device to the embedded cloud takes place via real-time data communication, on sensor and edge level - for example Industrial Ethernet or fieldbuses - and gateways , which provide the transformation of real time data into the informational area.

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SMARC-sAM67

SMARC® Module with TI AM67x Jacinto™ Processor

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Specifications

Coming soon

TI dual/quad AM67x Jacinto™ Processor
Up to 8 GByte LPDDR4
Up to 2x 10/100/1000 MBit Ethernet
Up to 64GB eMMC 5.1
1x PCIe up to Gen3 x1
1x USB 2.0 OTG, 1x USB 3.2 (optional up to 2x USB 2.0, 2x USB 3.2)
Dual Channel LVDS up to 24bit, DSI
Temperature support for -40 °C to +85 °C

Download Datasheet

The new SMARC module, based on the AM67x processor from Texas Instruments, enables high-resolution 3D rendering with low latency, high throughput with up to 8GB LPDDR4 memory access and flash storage with up to 32 GB eMMC, as well as USB3, PCIe Gen 3 and two Gigabit Ethernet channels for enhanced system-level connectivity for Linux-based systems. It supports applications such as robotic teach pendants, factory automation, medical, and test and measurement. The AM67x is a device that targets both the analytics and non-analytics markets, with end devices ranging from HMI and single board computers up to multi-camera vision systems with integrated AI.

The AM67x provides high-performance computing technology for both traditional and deep learning algorithms with an industry-leading power-to-performance ratio and a high level of system integration to enable scalability and lower costs for advanced vision camera applications. Key cores include the latest Arm^® and GPU processors for general purpose computing, next-generation DSP with scalar and vector cores, dedicated deep learning and traditional algorithm accelerators, an integrated next-generation imaging subsystem (ISP), video codec, and MCU cores, all protected by industrial-grade security hardware accelerators.

Features

Compliance

SMARC 2.2

Dimensions (H x W x D)

82 x 50 mm

CPU	TI dual/quad AM67x Jacinto™ processor (Standard AM67, optional AM67A or AM67D)

Main Memory

up to 8 GByte LPDDR4

Ethernet

up to 2x 10/100/1000 MBit Ethernet

Storage

1x SD-Card (SDIO capable)

Flash Onboard

up to 64GB eMMC 5.1

PCI Express / PCI support

1x PCIe up to Gen3 x1

Panel signal

Dual Channel LVDS up to 24bit, DSI

Display

1x DP (optional, instead of DSI)

USB	1x USB 2.0 OTG, 1x USB 3.2 (optional up to 2x USB 2.0, 2x USB 3.2)

Serial

4x UART ( 2x RX/TX only)

Other Features

2x I2S, 1x SPI, 4x I2C, 14x GPIO, 2x CAN, 4x MIPI CSI, 1x QSPI, 1x MDIO (optional)

Special Features

Failsafe Update, ultra low Power Consumption high accuracy RTC

Bootloader

u-boot, TF-a, OPTEE

Operating System

Yocto Linux, Buildroot

Power Supply

3 V – 5.25 V operates directly from single level Lithium Ion cells or fixed 3.3 V – 5 V power supplies

Temperature

Operating: extended consumer -40 °C to + 85 °C Non-Operating: -40 °C to +85 °C

Humidity

93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78)

Downloads

技术参数

SMARC-sAM67 Datasheet
[ smarc-sam67_data-sheet_kontron_20241112.pdf, 464.19 KB, Nov.13.2024 ]

参考手册

General Safety Instruction
[ general-safety-instructions.pdf, 628.88 KB, Aug.02.2024 ]

白皮书

SMARC™ module 2.1 [restrictions apply]
This paper discusses how SMARC™ module is continuing to evolve to ensure system designers, SIs and OEMs can meet the ongoing challenges of cost-effectively deve-loping next generation small form factor IoT- andAI-enabled embedded systems.

Modules and Motherboards WP [restrictions apply]

Robotic-Assisted Surgery White Paper [restrictions apply]

应用案例

The tough choice of Processors
Solving challenges in selecting computer boards & modules for IIoT projects. In this article we support you to make the right choice for your application: To find the best balance of processing power, graphics capabilities and connectivity on the one hand and size, power consumption, and cost on the other.
[ artikel_processor-choice_eu-1-.pdf, 4.42 MB, Apr.20.2023 ]

A SMARC Approach to Medical Device Life Extension
A medical manufacturer maximizes investment in essential system with retrofit Kontron Computer on Module solution upgrade.
[ uc_medical-smarc_final.pdf, 8.69 MB, Apr.20.2023 ]

Tech Spec Sheet

Tech Specs SMARC
[ tech-spec_smarc.pdf, 5.3 MB, Apr.04.2024 ]

Services

Kontron Services Brochure
[ kontron-services-brochure.pdf, 8.9 MB, Dec.17.2020 ]

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