IoT

One of the new challenges arising with the use of edge, fog, and cloud architectures is the connection of components to each other and to the public cloud. An important element of developing a solution capturing all pieces is the IoT framework susietec

At the field, or edge level, data is collected by industrial computers, e.g. by gateways, which process, filter, analyze and act on these data in real-time right at the device.

Edge, fog and cloud applications demand increasing computing power. The interfaces to sensors or machines often require non-standard solutions. Especially in smaller machines, space is limited or restricted in some dimension and need a special solution.

Today, the connection from the sensor device to the embedded cloud takes place via real-time data communication, on sensor and edge level - for example Industrial Ethernet or fieldbuses - and gateways , which provide the transformation of real time data into the informational area.

资源

We provide our customers with additional material enhancing their knowledge. Find all White Papers, Use Cases and brochures here.

Learn more about how Kontron supports its customers by improving their products and solutions. Read our Use Cases. Contact us for further information.

Learn more about our solutions for various industries by downloading our Whitepapers.

We provide our customers with additional material enhancing their knowledge. Find all White Papers, Use Cases and brochures here.

Get extended insights into our products and solutions by participating in our webcasts. You can find all webcasts here. Contact us for further information.

Kontron Computer-on-Modules for Infotainment

COM计算机模块作为系统的核心部件，可以同其它组件一样进行集成，从而实现在一块载板上完成诸多领域的应用需求。CPU模块提供核心处理功能，面对应用的特殊功能由底板完成，从而组成半定制化的嵌入式解决方案。

嵌入式计算机模块

COMe-bCL6

COM Express® Basic Type 6 with 8th/9th Generation Intel® Core™ / Xeon® Processors

Download Datasheet View Product

COM Express®

The standard includes the mini form factor (84 x 55mm), the compact form factor (95 x 95mm) and the basic form factor (125 x 95mm).

COMe-bCL6

COM Express® Basic Type 6 with 8th/9th Generation Intel® Core™ / Xeon® Processors

Download Datasheet View Product

COM Express® basic

Kontron offers a broad product range for the COM Express® basic form factor (125 x 95 mm).

View Selection

COM Express® compact

COM Express® compact modules have a mechanical footprint of just 95 x 95mm.

View Selection

COM Express® mini

COMe Mini modules with a 84x55 mm footprint and pin-out type 10

View Selection

ETX®

ETX® - Highly integrated, PC-compatible embedded modules based on x86 CPU architecture – all that on a footprint of 95 x 114 mm

SMARC™

Low-power embedded architecture platform for Computer-on-Modules based on ARM and X86 technology

SMARC-sXEL E2

Latest Generation Intel Atom®, Pentium® and Celeron® Processor Series

Download Datasheet View Product

SMARC-sAL28

SMARC module with NXP LS1028A in short size

Download Datasheet View Product

SMARC-sAMX8X

Smarc Module with Low Power i.MX8X Series processor

Download Datasheet View Product

SMARC-sXAL (E2) / SMARC-sXAL4 (E2)

SMARC 2.0 module based on Intel® Atom™ E3900, Pentium® and Celeron® processor series

Download Datasheet View Product

SMARC-sAMX7

SMARC Module with extremely low power NXP i.MX7 series processor, Solo / Dual Core

Download Datasheet View Product

SMARC-sXBTi

SMARC module with Intel® Atom™ processor E3800 series with extremely low-profile and high graphics performance

Download Datasheet View Product

SMARC-sAMX6i

Ultra-low power ARM and SoC-based SMARC Module based on NXP i.MX6 family Solo - Dual - Quad Core.

Download Datasheet View Product

back

Contact Sales 1-888-294-4558 / 858-623-3094 Contact Sales Support 888-835-6676 / +1 450-437-5682 Contact Support

More Contact Options