产品目录
行业应用
IoT
One of the new challenges arising with the use of edge, fog, and cloud architectures is the connection of components to each other and to the public cloud. An important element of developing a solution capturing all pieces is the IoT framework susietec
At the field, or edge level, data is collected by industrial computers, e.g. by gateways, which process, filter, analyze and act on these data in real-time right at the device.
Edge, fog and cloud applications demand increasing computing power. The interfaces to sensors or machines often require non-standard solutions. Especially in smaller machines, space is limited or restricted in some dimension and need a special solution.
Today, the connection from the sensor device to the embedded cloud takes place via real-time data communication, on sensor and edge level - for example Industrial Ethernet or fieldbuses - and gateways , which provide the transformation of real time data into the informational area.
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About Kontron
Computer-on-Modules (COMs)
Computer on Modules (COMs) are highly integrated component SBCs that support system expansion and application-specific customization. The CPU module delivers the core functionality while all of the application-specific features are designed into the baseboard creating a semi-custom embedded pc solution.
COMe-bCL6
COM Express® Basic Type 6 with 8th/9th Generation Intel® Core™ / Xeon® Processors
Download Datasheet View ProductCOM Express®
COM Express® defines standardized form factors and pin-outs for Computer-on-Modules. The standard includes the mini form factor (84 x 55mm), the compact form factor (95 x 95mm) and the basic form factor (125 x 95mm).
COMe-bCL6
COM Express® Basic Type 6 with 8th/9th Generation Intel® Core™ / Xeon® Processors
Download Datasheet View ProductCOM Express® mini
Formerly known as nanoETXexpress: The COM Express® mini is designed to deliver power-saving Computer-on-Modules on a footprint of55 x 84 mm.
COM Express® basic
Formerly also known as ETXexpress®, Kontron offers a broad product range for the COM Express® basic form factor (125 x 95 mm).
COM Express® compact
Formerly also known as microETXexpress®: They have a mechanical footprint of just 95 x 95mm.
ETX®
Highly integrated, PC-compatible embedded modules based on advanced X86 CPUs (95 x 114 mm). Full featured Multimedia PC from STPC to Pentium® M on 95x114mm - the standard for custom designs
