Kontron's Single Board Computer 3.5”-SBC-RPL with 13th Gen Intel® Core™ U-Series Processors

A High-performance & High-efficiency Platform for AI-enabled IoT Edge Applications

Ismaning, Germany, October 15, 2024 – Kontron, a global leader in IoT/Embedded Computing Technology (ECT), is excited to present the latest generation of its 3.5”-SBC product family, named 3.5”-SBC-RPL. The 3.5”-SBC-RPL is a single board computer driven by hybrid-core 13th Gen Intel^® Core™ U-Series and Intel^® U-Series Processors (codenamed Raptor Lake U) which enable an optimal synergy between performance and efficiency. With integrated Intel^® Iris^® Xe Graphics, AI acceleration features and real-time computing capability on the same chip, the board can help system developers build a compact edge system that requires excellent graphics, efficient computing, real-time processing and / or AI acceleration for a variety of applications, such as smart manufacturing, healthcare, retail and smart city. Samples will be available to customers in January 2025.
 
The 3.5”-SBC-RPL leverages hybrid computing architecture, combining performance and efficiency cores within the 13th Gen Intel^® Core™ U-Series processors. This enables intelligent workload management by assigning demanding tasks to performance cores and energy-efficient tasks to efficiency cores, optimizing performance per watt. The design allows smaller thermal solutions and is ideal for compact systems. The new 3.5”-SBC-RPL Single Board Computer offer multiple embedded controller features and uses advanced technology components.

With integrated Intel^® Iris^® Xe Graphics, the 3.5”-SBC-RPL supports 8K resolution at 60 fps via two DisplayPort connectors. It can extend to four displays through additional ports, ideal for video walls and control rooms. An eDP/LVDS combo connector is available for all-in-one systems. The GPU supports up to 96 execution units, enabling AI acceleration for edge devices, alongside Intel® Deep Learning Boost and Intel® Gaussian & Neural Accelerator 3.0, delivering cost- and power-efficient AI computing.
 
Next-Gen Low-Latency Data Transfer and Enhanced Scalability
The board incorporates two DDR5 SO-DIMM sockets (up to 5200 MHz), dual 2.5 GbE LAN Intel^® i226 controllers, and four USB 3.2 Gen 2 connectors (10 Gbps). Certain variants feature Intel^® Time Coordinated Computing (TCC) and IEEE 802.1 Time-Sensitive Networking (TSN), ensuring real-time, low-latency communication within and between systems, critical for real-time AI processing. The configurable TDP (12 W to 28 W) allows flexibility in system design based on cooling solutions.
The 3.5”-SBC-RPL offers three M.2 slots for SSD, WLAN, Bluetooth, WWAN, and other expansions. A board-to-board connector allows developers to add one of the expansion boards, named 3.5"-eIO, for extra I/O ports or features, including additional display (DP & HDMI) connectors and LAN ports. The 3.5"-eIOs support both standard and industrial operating temperature ranges and are compatible with the 3.5”-SBC-RPL, 3.5”-SBC-ADN, 3.5”-SBC-AML as well as previous generations the 3.5"-SBC-EKL and the 3.5"-SBC-TGL. 3.5”-eIO Series expansion boards enable faster time-to-market and reduced development costs.

Rugged and Secure
Designed for harsh environments, the 3.5”-SBC-RPL supports a wide input voltage range (9 V to 36 V) for unstable power conditions and integrates a TPM 2.0 security chip for enhanced hardware-level security, protecting user data, network access, and ensuring operational integrity against cyber threats. Some variants are designed for continuous operation (24/7) under harsh operating conditions and on high system load.
Seven variants are available, in both industrial-grade (-40 °C to 85 °C) and commercial-grade (0 °C to 60 °C) temperature ranges, using Intel^® Core™ i7, i5, i3, and U300E processors.

Long-Term Availability
3.5”-SBC-RPL ensures an extended long-term availability of up to 10 years from the release date, due to embedded key components and is CE, FCC, ICES, UKCA & UR (UL Recognized) compliant.

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Further information:

For more information, please visit: https://www.kontron.com/en/products/3.5--sbc-rpl/p182552

A printable image is provided here: https://cloud.profil-pr.com/index.php/s/5Fa3fCzpsWRognw

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About Kontron

Kontron AG (www.kontron.com, ISIN AT0000A0E9W5, WKN A0X9EJ, KTN) is a leading IoT technology company. For more than 20 years, Kontron has been supporting companies from a wide range of industries to achieve their business goals with intelligent solutions. From automated industrial operations, smarter and safer transport to advanced communications, connectivity, medical, and energy solutions, the company delivers technologies that add value for its customers. With the acquisition of Katek SE in early 2024, Kontron significantly strengthens its portfolio with the new GreenTec division, focusing on solar energy and eMobility, and grows to around 8,000 employees in over 20 countries worldwide. Kontron is listed on the SDAX^® and TecDAX^® of the German Stock Exchange.

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· News about Kontron can also be found in the official Kontron blog
 

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Media Contacts:

Global
Alexandra Kentros
Kontron AG - Communications
Tel: +49 151 151 9388 1
group-pr@kontron.com

EMEA
Jan Lauer
Profil PR
Tel: +49 531 387 33-18
kontron@profil-pr.com

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All rights reserved. Kontron is a trademark or registered trademark of Kontron Europe GmbH. All other brand or product names are trademarks or registered trademarks or copyrights by their respective owners and are recognized. All data is for information purposes only and not guaranteed for legal purposes. Subject to change without notice. Information in this press release has been carefully checked and is believed to be accurate; however, no responsibility is assumed for inaccuracies.