IoT

One of the new challenges arising with the use of edge, fog, and cloud architectures is the connection of components to each other and to the public cloud. An important element of developing a solution capturing all pieces is the IoT framework susietec

At the field, or edge level, data is collected by industrial computers, e.g. by gateways, which process, filter, analyze and act on these data in real-time right at the device.

Edge, fog and cloud applications demand increasing computing power. The interfaces to sensors or machines often require non-standard solutions. Especially in smaller machines, space is limited or restricted in some dimension and need a special solution.

Today, the connection from the sensor device to the embedded cloud takes place via real-time data communication, on sensor and edge level - for example Industrial Ethernet or fieldbuses - and gateways , which provide the transformation of real time data into the informational area.

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3.5"-SBC-AML/ADN

3.5" Single Board Computer with Intel® Atom® x7000(R)E Series, Intel® Core™ i3 N-Series & Intel® N-Series Processors

Specifications

Coming soon

Upgraded processing and graphics performance + faster AI inference capability
Next-gen DDR5 memory support with up to 4800 MT/s data transfer rate
Additional Rear I/O expansion via board-to-board connector
DP Alt Mode over USB-C support to carry video / audio, data & power over a single port
Hardware-based security for data protection and reliable authentication

Download Datasheet

Ideal for IoT, IIoT and AIoT Applications

3.5"-SBC-AML/ADN is a 3.5" single board computer powered by Intel® Atom® x7000RE Series (codenamed Amston Lake), Intel® Atom® x7000E Series, Intel® Core™ i3 N-Series and Intel® N-Series (codenamed Alder Lake N) processors integrated with Intel® UHD Graphics Gen12 as well as support for a next-gen high-speed DDR5 memory. Thus, it can deliver upgraded performance, enhanced media transcoding and faster AI inference, making it an ideal baseboard to be integrated into a compact IoT edge system or an all-in-one solution for a variety of applications, such as smart retail, industrial automation, healthcare, video processing and office automation.

Features

Processor

[Standard]
Intel® Atom® x7211RE (2C, 6M, 1.0/3.2GHz, 6W)
Intel® Atom® x7433RE (4C, 6M, 1.5/3.4GHz, 9W)
Intel® Core™ i3-N305 (8C, 6M, 1.8/3.8GHz, 9←15W)
Intel® N97 (4C, 6M, 2.0/3.6GHz, 12W)
[Project]
Intel® Atom® x7213RE (2C, 6M, 2.0/3.4GHz, 9W)
Intel® Atom® x7835RE (8C, 6M, 1.3/3.6GHz, 12W)
Intel® Atom® x7211E (2C, 6M, 1.0/3.2GHz, 6W)
Intel® Atom® x7213E (2C, 6M, 1.7/3.2GHz, 10W)
Intel® Atom® x7425E (4C, 6M, 1.5/3.4GHz, 12W)
Intel® N50 (2C 6M, 1.0/3.4GHz, 6W)
Intel® N200 (4C, 6M, 1.0/3.7GHz, 6W)

Main Memory

1x DDR5 4800 SO-DIMM up to 16 GByte

Graphics Controller

Intel® UHD Graphics Gen12

Display

Intel® UHD Graphics Gen12
1x LVDS / eDP (24-bit, 2-ch, 1920 x 1200 @ 60 Hz / 4096 x 2160 @ 60 Hz)
3x DP (4096 x 2160 @ 60 Hz, 2x Full-size DP on rear, 1x DP USB-C on rear)
Triple Display Support

Audio CODEC

TSI 92HD91B

Audio Interface

1x Speaker-out (Stereo, 3 W, by header)
1x Line-in (by header)
1x Line-out (by header)
1x Mic-in (by header)
1x S/PDIF Out (by header)

Ethernet

2x 2.5 GbE LAN (RJ45 on rear, Intel® I226-V/IT)
TSN support models with Atom® processors

USB	2x USB 3.2 Gen 2 Type A (on rear) 1x USB 3.2 Gen 2 Type C (on rear, w/ DP & PD 5 V / 3 A, except Atom® x7000RE) 1x USB 3.2 Gen 1 Type C (on rear, w/ DP & PD 5 V / 3 A, only Atom® x7000RE) 3x USB 2.0 (1x Type A on rear, 2x by header (optl. routed to B2B connector))

Serial Ports

4x RS232/422/485 (2x Tx/Rx only in RS232 signal, by header)

DIO	4x DI (by wafer) 4x DO (by wafer)

SATA	1x SATA 3.0

Expansion Slots

1x M.2 Key B (2242 / 3042 / 3052 / 2280, w/ PCIe x1 / USB 2.0 / UIM)
1x M.2 Key E (Type 2230, w/ PCIe x1 (optl. routed to B2B conenctor) / USB 2.0 / CNVi (Atom® x7000RE does not support CNVi))
1x M.2 Key M (Type 2280, w/ SATA 3.0 (default) / PCIe x1 (optional))
1x SIM Card Holder (by header)
1x Board-to-board Connector (w/ 1x PCIe x1 (2x optional, replacing PCIe in M.2 Key E) / 1x SM Bus / 1x I2C / 1x UART / 1x GSPI / 2x USB 2.0 (optional, replacing the route to 2x internal USB 2.0))

Input Voltage

DC 9 V ~ 36 V

Power connector

1x4-pin pitch 3.0 mm Wafer

BIOS	AMI uEFI BIOS w/ 256 Mb SPI Flash

Watchdog

Programmable WDT to generate system reset event

System Monitoring

Voltages, Temperatures

Real Time Clock

Processor integrated RTC

Security

TPM 2.0 Support (Infineon SLB 9672)

Cooling

1x Wafer for Smart Fan

Operating System

Windows 11, Windows 10, Linux

Dimensions. (LxW)

ECX (146 mm x 105 mm / 5.75" x 4.13")

Operating Temperature

0 °C~ 60 °C / 32 °F ~ 140 °F (Standard)
-40 °C ~ 85 °C / -40 °F ~ 185 °F (Extreme)

Storage Temperature

-20 °C ~ 80 °C / -4 °F ~ 176 °F (Standard)
-55 °C ~ 85 °C / -67 °F ~ 185 °F (Extreme)

Humidity

0 % ~ 95 %

Compliance

CE Class B, FCC Class B, ICES Class B, UKCA, UR (UL Recognized)

Downloads

Datasheets

3.5"-SBC-AML/ADN Datasheet
Revision 20241029, October 29, 2024
[ 3d5-sbc-aml-adn-datasheet-20241029.pdf, 1.92 MB, Oct.29.2024 ]

Manuals

General Safety Instruction
[ general-safety-instructions.pdf, 628.88 KB, Aug.02.2024 ]

Tech Spec Sheet

Tech Specs SBC (Release Candidate)
Revision 20241014, October 14, 2024
[ 3d5-sbc-tech-spec-sheet-20241014.pdf, 19.83 MB, Nov.04.2024 ]

Services

Kontron Services Brochure
[ kontron-services-brochure.pdf, 8.9 MB, Dec.17.2020 ]

Variants

3.5"-SBC-ADN-0-N97		Intel® N97, Intel® I226-V, Operating Temperature: 0 °C ~ 60 °C
3.5"-SBC-ADN-3-i3-N305		Intel® Core™ i3-N305, Intel® I226-V, Operating Temperature: 0 °C ~ 60 °C
3.5"-SBC-AML-0-x7211RE-XT		Intel® Atom® x7211RE, Intel® I226-IT, Operating Temperature: -40 °C ~ 85 °C
3.5"-SBC-AML-1-x7433RE-XT		Intel® Atom® x7433RE, Intel® I226-IT, Operating Temperature: -40 °C ~ 85 °C
3.5"-SBC-AML-2-x7835RE-XT		Intel® Atom® x7835RE, Intel® I226-IT, Operating Temperature: -40 °C ~ 85 °C

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