COMe-bEP7 New

COM Express® Basic Type 7 with AMD EPYC™ Embedded 3000 SoC Processors

Specifications

Supports Single-Die SP4r2 (up to 8 cores) and Dual-Die SP4 (up to 16 core) processors
Quad 10GbE interfaces
4 x SODIMM sockets (up to 128GB DDR4 memory) on request
Industrial grade versions

Download Datasheet Buy now

The COM Express® module COMe-bEP7 based on AMD EPYC™ 3000 series processors extends Kontron’s product family of server-grade COM platforms. The COMe-bEP7 is headless and a cost efficient option for applications requiring high processing power such as Medical Imaging and Servers.

The COMe-bEP7 is a high performance module with scalable performance up to 16 cores. The module supports an optional four SODIMM sockets with up to 128GB memory as well as four 10Gb Ethernet ports. The COMe-bEP7 is offered for either commercial or extended temperature ranges.

Features

Compliance

COM Express® Basic, Pin-out Type 7 - COM.0 R3.0

Dimension (H x W)

95 x 125 mm

CPU

Commercial Temperature:
AMD E3101 4C/4T, 35W TDP, 2.1GHz (2.9GHz)
AMD E3151 4C/8T, 45W TDP, 2.7GHz (2.9GHz)
AMD E3201 8C/8T, 30W TDP, 1.5GHz (3.1GHz)
AMD E3251 8C/16T, 55W TDP, 2.5GHz (3.1GHz)
AMD E3351 12C/24T, 65-80W TDP, 1.9GHz (3.0GHz)
AMD E3451 16C/32T, 85-100W TDP, 2.45GHz (3.0GHz)

Industrial Temperature:
AMD E3255 8C/16T, 30-55W TDP, 2.0/2.5GHz (3.1GHz)

Main Memory

SP4r2 (single-die):
2x DDR4 SODIMM for up to 64GB non-ECC/ECC memory

SP4 (dual-die):
2x DDR4 SODIMM for up to 64GB non-ECC/ECC memory
4x DDR4 SODIMM for up to 128GB on request

Ethernet Controller

Internet i210

Ethernet

4x 10GbE KR/SFI

Hard Disk

2x SATA

PCI Express / PCI support

SP4r2 (single-die):
24x PCIe Gen 3.0

SP4 (dual-die):
32s PCIe

USB	4x USB 3.1, 4x USB 2.0

Serial

2x serial interface

Common Features

SPI Flash, LPC, SMB, Dual Staged Watchdog, RTC
On request for SP4 (dual-die): NVMe Support

Power Management

OS ACPI PM support for Critical Shutdown

Power Supply

ATX, 8.5V- 20 V Wide Range Single Supply

Special Features

TPM

Humidity

93% relative Humidity at 40°C, non-condensing

Temperature

Commercial Grade Version: 0°C to 60°C
Industrial Grade Version: -40°C to 85°C

BIOS

AMI UEFI

Operating System

Linux x64 – Ubuntu
Windows Server x64 2016

Supported Modules

COMe-bEP7 xxxxx commercial grade
COMe-bEP7 E2 xxxxx industrial grade

Downloads

Solution Brief

Intel Solution Brief: Computer-on-Module Flexibility at the Edge
Kontron COM Express® and COM-HPC® modules with 13th Gen Intel® Core™ mobile processors deliver powerful performance, AI, and graphics with portfolio flexibility for industrial-grade deployments.
[ 18933-1-intel-rpl-p-kontron-solution-brief-v4.pdf, 1.67 MB, Mar.03.2023 ]

Use Cases

Autonomous Driving
Read how our COM Express® Module is working perfect for application from b-plus with its flexibility, bandwith, reliability and the required graphics.
[ uc_b-plus_eu.pdf, 4.78 MB, May.26.2021 ]

COM Express®: A RECIPE FOR IIOT SUCCESS
How Ectron is tapping into AI and machine learning to further modernize industrial baking, yielding greater efficiency for consistently delicious baked goods
[ ectron-case-study-resized.pdf, 3.93 MB, Apr.20.2023 ]

The tough choice of Processors
Solving challenges in selecting computer boards & modules for IIoT projects. In this article we support you to make the right choice for your application: To find the best balance of processing power, graphics capabilities and connectivity on the one hand and size, power consumption, and cost on the other.
[ artikel_processor-choice_eu-1-.pdf, 4.42 MB, Apr.20.2023 ]

COM Express® Basic for Autonomous Transportation in Rugged Environments
Implementing Kontron’s latest COMe® Basic based on Intel’s® 11th generation Xeon® processors and ECC memory provided the optimum power and performance
[ adas_en_use-case_kontron.pdf, 1.54 MB, Oct.11.2022 ]

Datasheets

Datasheet COMe-bEP7
[ come-bep7_datasheet.pdf, 2.41 MB, Sep.06.2023 ]

Manuals

COMe-bEP7 User Manual
[ come-bep7_user_manual_5-19-2022.pdf, 3.39 MB, Oct.18.2024 ]

General Safety Instruction
[ general-safety-instructions.pdf, 628.88 KB, Aug.02.2024 ]

White Papers

Modules and Motherboards WP [restrictions apply]

Robotic-Assisted Surgery White Paper [restrictions apply]

Tech Spec Sheet

Tech Specs COM EXPRESS®
[ tech-spec_comexpress.pdf, 7.08 MB, Apr.04.2024 ]

Services

Kontron Services Brochure
[ kontron-services-brochure.pdf, 8.9 MB, Dec.17.2020 ]

Variants

COMe-bEP7 E3101 68010-0000-01-1		COMe-bEP7 E3101
COMe-bEP7 E3151 68010-0000-51-1		COMe-bEP7 E3151
COMe-bEP7 E3201 68010-0000-01-2		COMe-bEP7 E3201
COMe-bEP7 E3251 68010-0000-51-2		COMe-bEP7 E3251
COMe-bEP7 E3351 68010-0000-51-3		COMe-bEP7 E3351
COMe-bEP7 E3451 68010-0000-51-4		COMe-bEP7 E3451
COMe-bEP7 E3451 with 4 SODIMM sockets 68010-0000-61-4		COMe-bEP7 E3451 with 4 SODIMM sockets

Accessories

COMe Mount Kit 5mm 1set 38017-0000-00-5	COM Express® Mounting Kit 5mm 1set for threaded HSP and Cooling Solutions
COMe Mount Kit 5mm 100sets 38017-0100-00-5	COM Express® Mounting Kit 5mm 100 sets
COMe Mount KIT 8mm 1set 38017-0000-00-0	COM Express® Mounting Kit 8mm 1set for threaded HSP and Cooling Solutions
COMe Mount Kit 8mm 100sets 38017-0100-00-0	COM Express® Mounting Kit 8mm 100sets
ADA-COMe-Height-dua 38019-0000-00-0	ADA-COMe-Height-dua
KAB-HSP 200mm 96079-0000-00-0	Fan cable adapter for 3pin standard FAN connector to 3pin molex connector, cable length 200mm
COMe Eval Carrier T7 Gen2	COM Express® Eval Carrier Type 7	more
COMe Eval Carrier T7 68300-0000-00-0	COM Express® Eval Carrier Type 7	more
HSP COMe-bEP7 THREADED 68010-0000-99-0	Heatspreader for COMe-bEP7, threaded mounting holes
HSP COMe-bEP7 THROUGH 68010-0000-99-1	Heatspreader for COMe-bEP7, through mounting holes
DDR4-2666 8 GB non-ECC 97020-0827-BEP7	Memory: DDR4-2666, 8 GByte, non-ECC Operating Temperature: 0°C- 60 °C
DDR4-2666 16 GB non-ECC 97020-1627-BEP7	Memory: DDR4-2666, 16 GByte, non-ECC Operating Temperature: 0°C- 60 °C
DDR4-2666 32 GB non-ECC 97020-3227-BEP7	Memory: DDR4-2666, 32 GByte, non-ECC Operating Temperature: 0°C- 60 °C
DDR4-2666 16 GB non-ECC 97021-1627-BEP7	Memory: DDR4-2666, 16 GByte, non-ECC Operating Temperature: -40 °C - 85 °C
DDR4-2666 8 GB non-ECC 97021-0827-BEP7	Memory: DDR4-2666, 8 GByte, non-ECC Operating Temperature: -40 °C - 85 °C
DDR4-2666 32 GB non-ECC 97021-3227-BEP7	Memory: DDR4-2666, 32 GByte, non-ECC Operating Temperature: -40 °C - 85 °C
DDR4-2666 8 GB ECC 97030-0827-BEP7	Memory: DDR4-2666, 8 GByte, ECC Operating Temperature: 0°C- 60 °C
DDR4-2666 16 GB ECC 97030-1627-BEP7	Memory: DDR4-2666, 16 GByte, ECC Operating Temperature: 0°C- 60 °C
DDR4-2666 32 GB ECC 97030-3227-BEP7	Memory: DDR4-2666, 32 GByte, ECC Operating Temperature: 0°C- 60 °C
DDR4-2666 8 GB ECC 97031-0827-BEP7	Memory: DDR4-2666, 8 GByte, ECC Operating Temperature: -40 °C - 85 °C
DDR4-2666 16 GB ECC 97031-1627-BEP7	Memory: DDR4-2666, 16 GByte, ECC Operating Temperature: -40 °C - 85 °C
DDR4-2666 32 GB ECC 97031-3227-BEP7	Memory: DDR4-2666, 32 GByte, ECC Operating Temperature: -40 °C - 85 °C

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