COMe-bTL6 (E2)

COM Express® Basic Type 6 with 11th Generation Intel® Core™ / Xeon® Processors

Specifications

Up to 128 GByte DDR4 memory
Up to 2.5 Gb Ethernet with TSN support
Optional NVMe SSD onboard
Industrial grade versions

Download Datasheet Buy now

The COM Express® COMe bTL6-H (Tiger Lake-H) CPUs are featuring up to 8 cores and are specifically suited for demanding Edge workloads and high-end, high-bandwidth applications. Intel® Iris® XeGraphics supports up to four independent 4K displays or one 8K HDR display. AI-workloads in machine vision or medical applications reach new levels of performance with the GPU and Intel® Deep Learning Boost. Integrated TSN- and Intel® TCC-functionality enable deterministic networks in Industry 4.0 as well as various real-time applications.

The TDP of the processor chips ranges from 25 to 45 watts, with eight processing cores enabling clock frequencies of up to 5.0 GHz. A maximum of three DDR4 SO-DIMM sockets allow a memory expansion of up to 96 GBytes (non-ECC/ECC). With integrated Intel® UHD graphics supporting up to four independent 4K displays, up to 40 HD video streams can be processed and analyzed in parallel at 1080p/30fps resolution. In addition, fast 2.5 GBit Ethernet with Time Sensitive Networking (TSN) and Intel® Time Coordinated Computing (Intel® TCC) predestines the module for demanding real-time applications.

As storage medium, a soldered NVMe SSD onboard with up to 1 TByte storage capacity is optionally used, which enables highly effective data processing even under harsh conditions. The COMe-bTL6 (E2) module guarantees full computing power even in extreme industrial environments with temperatures ranging from -40 °C to +85 °C and offers a higher number of application-ready integrated features and more powerful cooling compared to alternative smaller form factor designs.

Features

Compliance

COM Express® basic, Pin-out Type 6

Dimensions (H x W x D)

125 x 95 mm

CPU	Intel® 11th Generation CoreTM / Xeon® family For details see table (CPU variants) given below

Chipset

HM570E, QM580E and RM590E

Main Memory

2x DDR4 SODIMM dual channel up to 64 GByte ECC or non ECC (optional 3rd SODIMM socket for 96 GByte)

Graphics Controller

Intel® Iris®Xe Graphics on i7/i5 processors Intel® xxx Graphics on i3/Xeon® processors

Ethernet Controller

Intel® I225LM/I225IT

Ethernet

Up to 2.5Gb Ethernet with TSN & WOL support (depending on SKU)

Storage

4x SATA 6Gb/s

Flash Onboard

Up to 1 TByte NVMe SSD (on request)

PCI Express

8x PCIe 3.0 (8GT/s), Default configuration 8x1, optional 1x4 + 4x1, 2x4 etc. 1x16 PCIe 4.0 on PEG Lanes #0-3

Display

DDI1: DP++, DDI2: DP++, DDI3: DP++, VGA: -, LVDS: Dual Channel 18/24bit

USB	4x USB 3.2; 8x USB 2.0

Serial

2x serial interface (RX/TX only)

Audio

High Definition Audio interface

Special Features

Trusted Platform Module TPM 2.0

(G)SPI, LPC, SMB, Fast I2C, Staged Watchdog, RTC, support of Intel® OptaneTM memory technology via PCIe

ON REQUEST:
vPRO (AMT/TXT/AES Support), eDP instead of LVDS, up to 3x PCIe x1 additional w/o Ethernet & SATA, NVMe SSD, Fail Save via 2nd SPI Flash

Power Management

ACPI 6.0

Power Supply

8.5 V – 20 V Wide Range, Single Supply Power

BIOS

AMI UEFI

Operating System

Windows® 10, Linux, VxWorks

Temperature

Commercial temperature: 0 °C to +60 °C operating, -30 °C to +85 °C non-operating Extended temperature: -25 °C to +75 °C operating, -30 °C to +85 °C non-operating Industrial temperature: -40 °C to +85 °C operating, -40 °C to +85 °C non-operating

Humidity

93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78)

Downloads

Solution Brief

Intel Solution Brief: Computer-on-Module Flexibility at the Edge
Kontron COM Express® and COM-HPC® modules with 13th Gen Intel® Core™ mobile processors deliver powerful performance, AI, and graphics with portfolio flexibility for industrial-grade deployments.
[ 18933-1-intel-rpl-p-kontron-solution-brief-v4.pdf, 1.67 MB, Mar.03.2023 ]

Datasheets

COMe-bTL6 (E2) Datasheet
[ come-btl6_datasheet.pdf, 2.58 MB, Jul.25.2023 ]

Manuals

COMe-bTL6 User Guide
Rev. 2.3 May. 24, 2024
[ come-btl6_user-guide_rev-2-3_2024-05-24.pdf, 2.71 MB, May.24.2024 ]

General Safety Instruction
[ general-safety-instructions.pdf, 628.88 KB, Aug.02.2024 ]

White Papers

Modules and Motherboards WP [restrictions apply]

Robotic-Assisted Surgery White Paper [restrictions apply]

Use Cases

Autonomous Driving
Read how our COM Express® Module is working perfect for application from b-plus with its flexibility, bandwith, reliability and the required graphics.
[ uc_b-plus_eu.pdf, 4.78 MB, May.26.2021 ]

COM Express®: A RECIPE FOR IIOT SUCCESS
How Ectron is tapping into AI and machine learning to further modernize industrial baking, yielding greater efficiency for consistently delicious baked goods
[ ectron-case-study-resized.pdf, 3.93 MB, Apr.20.2023 ]

The tough choice of Processors
Solving challenges in selecting computer boards & modules for IIoT projects. In this article we support you to make the right choice for your application: To find the best balance of processing power, graphics capabilities and connectivity on the one hand and size, power consumption, and cost on the other.
[ artikel_processor-choice_eu-1-.pdf, 4.42 MB, Apr.20.2023 ]

COM Express® Basic for Autonomous Transportation in Rugged Environments
Implementing Kontron’s latest COMe® Basic based on Intel’s® 11th generation Xeon® processors and ECC memory provided the optimum power and performance
[ adas_en_use-case_kontron.pdf, 1.54 MB, Oct.11.2022 ]

Tech Spec Sheet

Tech Specs COM EXPRESS®
[ tech-spec_comexpress.pdf, 7.08 MB, Apr.04.2024 ]

Services

Kontron Services Brochure
[ kontron-services-brochure.pdf, 8.9 MB, Dec.17.2020 ]

More Downloads

All other downloads such as drivers, bios, drawings etc. are available on Kontron’s Customer Section

Variants

COMe-bTL6 E2 W-11865MRE RM590E 38039-0000-47-8		COM Express® basic pin-out type 6 Computer-on-Module with Intel® Xeon® W-11865MRE, 8x4.7GHz, RM590E PCH, GT2, 2x DDR4 non-ECC/ECC SO-DIMM
COMe-bTL6 E2 W-11555MRE RM590E 38039-0000-46-6		COM Express® basic pin-out type 6 Computer-on-Module with Intel® Xeon® W-11555MRE, 6x4.6GHz, RM590E PCH, GT2, 2x DDR4 non-ECC/ECC SO-DIMM
COMe-bTL6 E2 W-11155MRE RM590E 38039-0000-44-4		COM Express® basic pin-out type 6 Computer-on-Module with Intel® Xeon® W-11155MRE, 4x4.4GHz, RM590E PCH, GT2, 2x DDR4 non-ECC/ECC SO-DIMM
COMe-bTL6 W-11865MLE RM590E 38038-0000-45-8		COM Express® basic pin-out type 6 Computer-on-Module with Intel® Xeon® W-11865MRE, 8x4.7GHz, RM590E PCH, GT2, 2x DDR4 non-ECC/ECC SO-DIMM
COMe-bTL6 i7-i7-11850HE QM580E 38038-0000-47-7		COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i7-11850HE, 8x4.7GHz, QM580E PCH, GT2, 2x DDR4 non-ECC/ECC SO-DIMM
COMe-bTL6 W-11555MLE RM590E 38038-0000-44-6		COM Express® basic pin-out type 6 Computer-on-Module with Intel® Xeon® W-11555MLE, 6x4.4GHz, RM590E PCH, GT2, 2x DDR4 non-ECC/ECC SO-DIMM
COMe-bTL6 i5-11500HE QM580E 38038-0000-46-5		COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i5-11500HE, 6x4.6GHz, QM580E PCH, GT2, 2x DDR4 non-ECC/ECC SO-DIMM
COMe-bTL6 i3-11100HE RM590E 38038-0000-44-4		COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i3-11100HE, 4x4.4GHz, RM590E PCH, GT2, 2x DDR4 non-ECC/ECC SO-DIMM
COMe-bTL6 i3-11100HE QM580E 38038-0000-44-3		COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i3-11100HE, 4x4.4GHz, QM580E PCH, GT2, 2x DDR4 non-ECC/ECC SO-DIMM
COMe-bTL6 W-11155MLE RM590E 38038-0000-31-4		COM Express® basic pin-out type 6 Computer-on-Module with Intel® Xeon® W-11155MLE, 4x4.4GHz, RM590E PCH, GT2, 2x DDR4 non-ECC/ECC SO-DIMM
COMe-bTL6 Celeron 6600HE HM570E 38038-0000-26-2		COM Express® basic pin-out type 6 Computer-on-Module with Intel® Celeron® 6600HE, 2x2.6GHz, HM570E PCH, GT2, 2x DDR4 non-ECC SO-DIMM

Accessories

COMe Eval Carrier2 T6 38116-0000-00-5	COM Express® Eval Carrier2 Type 6 with 5mm COMe connector	more
HSP COMe-bTL6 Cu-core threaded 38038-0000-99-0	Heatspreader for COMe-bTL6 Cu-core threaded mounting holes
HSP COMe-bTL6 Cu-core through 38038-0000-99-1	Heatspreader for COMe-bTL6 Cu-core through holes
HSK COMe-basic active (w/o HSP) 38025-0000-99-0C05	Active Cooler for COMe-bxL6/bV26/bDV7/bID7 to be mounted on HSP
HSK COMe-basic passive (w/o HSP) 38025-0000-99-0C06	Passive Cooler for COMe-bxL6/bV26/bDV7/bID7 to be mounted on HSP
DDR4-3200 SODIMM 4GB_BTL6 97020-0432-BTL6	DDR4-3200, 4GB, 260P, 1600MHz, PC4-3200 SODIMM
DDR4-3200 SODIMM 8GB_BTL6 97020-0832-BTL6	DDR4-3200, 8GB, 260P, 1600MHz, PC4-3200 SODIMM
DDR4-3200 SODIMM 16GB_BTL6 97020-1632-BTL6	DDR4-3200, 16GB, 260P, 1600MHz, PC4-3200 SODIMM
DDR4-3200 SODIMM 32GB_BTL6 97020-3232-BTL6	DDR4-3200, 32GB, 260P, 1600MHz, PC4-3200 SODIMM
DDR4-3200 SODIMM 4GB E2_BTL6 97021-0432-BTL6	DDR4-3200, 4GB, E2, 260P, 1600MHz, PC4-3200 SODIMM
DDR4-3200 SODIMM 8GB E2_BTL6 97021-0832-BTL6	DDR4-3200, 8GB, E2, 260P, 1600MHz, PC4-3200 SODIMM
DDR4-3200 SODIMM 16GB E2_BTL6 97021-1632-BTL6	DDR4-3200, 16GB, E2, 260P, 1600MHz, PC4-3200 SODIMM
DDR4-3200 SODIMM 32GB E2_BTL6 97021-3232-BTL6	DDR4-3200, 32GB, E2, 260P, 1600MHz, PC4-3200 SODIMM
DDR4-3200 SODIMM 4GB ECC_BTL6 97030-0432-BTL6	DDR4-3200, 4GB, ECC, 260P, 1600MHz, PC4-3200 SODIMM
DDR4-3200 SODIMM 8GB ECC_BTL6 97030-0832-BTL6	DDR4-3200, 8GB, ECC, 260P, 1600MHz, PC4-3200 SODIMM
DDR4-3200 SODIMM 16GB ECC_BTL6 97030-1632-BTL6	DDR4-3200, 16GB, ECC, 260P, 1600MHz, PC4-3200 SODIMM
DDR4-3200 SODIMM 32GB ECC_BTL6 97030-3232-BTL6	DDR4-3200, 32GB, ECC, 260P, 1600MHz, PC4-3200 SODIMM
DDR4-3200 SODIMM 4GB ECC E2_BTL6 97031-0432-BTL6	DDR4-3200, 4GB, ECC, E2, 260P, 1600MHz, PC4-3200 SODIMM
DDR4-3200 SODIMM 8GB ECC E2_BTL6 97031-0832-BTL6	DDR4-3200, 8GB, ECC, E2, 260P, 1600MHz, PC4-3200 SODIMM
DDR4-3200 SODIMM 16GB ECC E2_BTL6 97031-1632-BTL6	DDR4-3200, 16GB, ECC, E2, 260P, 1600MHz, PC4-3200 SODIMM
DDR4-3200 SODIMM 32GB ECC E2_BTL6 97031-3232-BTL6	DDR4-3200, 32GB, ECC, E2, 260P, 1600MHz, PC4-3200 SODIMM

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