COMe-mAS10 (E2) New
COM Express® mini Type 10 with Intel Atom® x7000E / x7000RE Series
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Specifications
- Low-Power – Performance/Watt optimized form factor solution
- Up to 32 GByte LPDDR5 memory down (In-Band ECC)
- 2x USB 3.2 Gen2/2.0, 6x USB 2.0
- 1 GbE (optional 2.5 GbE) with TSN support
- Industrial grade temperature
The COMe-mAS10 (E2) supports the broad scalability of the new Intel Atom® series x7000E/x7000RE, designed for IoT applications. The range extends from the cost-optimized 2-core to high-performance 8-core solution.
The COMe-mAS10 (E2) for space-saving system solutions supports up to 16 Gigabyte LPDDR5-4800 memory-down, four PCIe 3.0 lanes, two USB 3.2 Gen2/2.0 and six USB 2.0 interfaces, two SATA ports, eMMC on-board, one 1GBASE-T (alternatively 2.5GBASE-T) Ethernet port with TSN.
Features
| Compliance | COM Express® mini, Pin-out Type 10 - COM.0 R3.1 |
| Dimension (H x W) | 84 mm x 55 mm |
| CPU | COMe-mAS10: x7000E-Series COMe-mAS10 E2: x7000RE-Series |
| Chipset | Integrated in SoC |
| Main Memory | Up to 32 GByte LPDDR5 4800 MT/s memory down (In-Band ECC) |
| Graphics Controller | SOC: Intel® HD Gfx Gen12: LVDS/eDP, 1x DP |
| Ethernet Controller | SOC + LAN PHY GPY115 (GPY215 on request) |
| Ethernet | 1GBit Ethernet (2.5GBit on request with GPY215) |
| Storage | 2x SATA 6Gb/s |
| Flash Onboard | eMMC option – up to 256 GByte eMMC TLC |
| PCI Express | PCIe Gen 3.0 - PCIe lane configurations: 4 x1, 2 x1 + 1 x2, 2 x2 |
| Display | DDI: DP++, LVDS: Single Channel 18/24 bit or eDP |
| USB | 2x USB 3.2 Gen2 (incl. USB 2.0) + 6x USB 2.0 |
| Serial | 2x serial interface (RX/TX only) |
| Audio | Intel® High Definition Audio |
| Common Features | SPI, LPC, SMB, Fast I²C, Staged Watchdog, RTC |
| Special Features | Industrial grade temperature |
| Options | eMMC up to 256 GByte TLC, eDP instead of LVDS, General Purpose SPI instead of Boot SPI, Trusted Platform module TPM 2.0, de-populated LAN PHY, 2.5GBit LAN instead of 1Gbit |
| Power Management | ACPI 6.0 |
| Power Supply | 4.75 V – 20 V Wide Range, Single Supply Power |
| BIOS | AMI Aptio V |
| Operating System | Microsoft® Windows 11 IoT LTSC, Microsoft® Windows 10 IoT LTSC, Linux |
| Temperature | COMe-mAS10- commercial temperature: 0° C to +60° C operating, -30° C to +85° C non-operating COMe-mAS10 E2 - industrial temperature: -40° C to +85° C operating, -40° C to +85° C non-operating |
| Humidity | 93% relative Humidity at 40°C, non-condensing (according to IEC 60068-2-78) |
| Supported Modules | industrial temperature: COMe-mAS10 E2 (34017-xxxx-xx-x) on request commercial temperature: COMe-mAS10 (34016-xxxx-xx-x) |
Downloads
Solution Brief
Intel Solution Brief: Computer-on-Module Flexibility at the Edge
Kontron COM Express® and COM-HPC® modules with 13th Gen Intel® Core™ mobile processors deliver powerful performance, AI, and graphics with portfolio flexibility for industrial-grade deployments.
[ 18933-1-intel-rpl-p-kontron-solution-brief-v4.pdf, 1.67 MB, Mar.03.2023 ]
Datasheets
Datasheet COMe-mAS10 (E2)
[ come-mas10_datasheet.pdf, 858.07 KB, Oct.02.2024 ]
Manuals
COMe-mAS10 (E2) User Guide
[ come-mas10-user-guide_rev-0-3_2024-1002.pdf, 2.37 MB, Oct.02.2024 ]
General Safety Instruction
[ general-safety-instructions.pdf, 628.88 KB, Aug.02.2024 ]
White Papers
Modules and Motherboards WP [restrictions apply]
Robotic-Assisted Surgery White Paper [restrictions apply]
Use Cases
Autonomous Driving
Read how our COM Express® Module is working perfect for application from b-plus with its flexibility, bandwith, reliability and the required graphics.
[ uc_b-plus_eu.pdf, 4.78 MB, May.26.2021 ]
COM Express® Basic for Autonomous Transportation in Rugged Environments
Implementing Kontron’s latest COMe® Basic based on Intel’s® 11th generation Xeon® processors and ECC memory provided the optimum power and performance
[ adas_en_use-case_kontron.pdf, 1.54 MB, Oct.11.2022 ]
The tough choice of Processors
Solving challenges in selecting computer boards & modules for IIoT projects. In this article we support you to make the right choice for your application: To find the best balance of processing power, graphics capabilities and connectivity on the one hand and size, power consumption, and cost on the other.
[ artikel_processor-choice_eu-1-.pdf, 4.42 MB, Apr.20.2023 ]
Tech Spec Sheet
Tech Specs COM EXPRESS®
[ tech-spec_comexpress.pdf, 7.08 MB, Apr.04.2024 ]
Services
Kontron Services Brochure
[ kontron-services-brochure.pdf, 8.9 MB, Dec.17.2020 ]
More Downloads
All other downloads such as drivers, bios, drawings etc. are available on Kontron’s Customer Section
Accessories
|
COMe Eval Carrier3 T10
34101-0000-00-3 |
|
COM Express® Evaluation Carrier Type 10 | more |
|
COMe Eval Carrier2 T10
34101-0000-00-2 |
|
COM Express® Evaluation Carrier Type 10 | more |
|
HSP COMe-mAS10 (E2) thread 34017-0000-99-0 |
Heatspreader for COMe-mAS10 commercial and E2, threaded mounting | ||
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HSP COMe-mAS10 (E2) through 34017-0000-99-1 |
Heatspreader for COMe-mAS10 commercial and E2, through mounting holes | ||
|
HSP COMe-mAS10 (E2) slim thread 34017-0000-99-2 |
Heatspreader for COMe-mAS10 slim commercial and E2, threaded mounting | ||
|
HSP COMe-mAS10 (E2) slim through 34017-0000-99-3 |
Heatspreader for COMe-mAS10 slim commercial and E2, through mounting holes | ||
|
COMe mini Active Uni Cooler 34099-0000-99-0 |
COM Express® mini Universal Active Cooler for Heatspreader Mounting (for CPUs <10W) | ||
|
COMe mini Passive Uni Cooler 34099-0000-99-1 |
COM Express® mini Universal Passive Cooler for Heatspreader Mounting | ||
|
COMe mini Passive Uni Cooler Slim Top Mount 34099-0000-99-3 |
COM Express® mini Universal Passive Cooler Slim for Heatspreader Top Mounting |
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