IoT

One of the new challenges arising with the use of edge, fog, and cloud architectures is the connection of components to each other and to the public cloud. An important element of developing a solution capturing all pieces is the IoT framework susietec

At the field, or edge level, data is collected by industrial computers, e.g. by gateways, which process, filter, analyze and act on these data in real-time right at the device.

Edge, fog and cloud applications demand increasing computing power. The interfaces to sensors or machines often require non-standard solutions. Especially in smaller machines, space is limited or restricted in some dimension and need a special solution.

Today, the connection from the sensor device to the embedded cloud takes place via real-time data communication, on sensor and edge level - for example Industrial Ethernet or fieldbuses - and gateways , which provide the transformation of real time data into the informational area.

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COMh-caRP

COM HPC/Client module size A with 13th Generation Intel® Core™ Processors

Specifications

Up to 64 GByte DDR5 memory
Up to 2.5Gb Ethernet with TSN support
Optional NVMe SSD onboard
Industrial grade

Download Datasheet Download Product Folder

The COMh-caRP is based on 13th Gen Intel® Core™ processors (former codename Raptor Lake U/P/H. They offer a significant performance increase compared to the previous generation and are equipped with 14 cores up to 24 cores with Intel® performance hybrid architecture. The 13th generation is particularly well suited for connected IoT applications. A new embedded controller ensures improved availability, flexibility and system openness. The Module provides essential, industrial-grade features such as support for in-band error correction code (IBECC) memory, Intel® Time Coordinated Computing (Intel® TCC), Time-Sensitive Networking (TSN), and extended temp ranges of -40C to +85C Tjmax.
All features are perfect for high-performance computing in resource-intensive and demanding areas such as networking, automation and measurement and customers profit from longterm availability

Features

Compliance

COM HPC® Client 2x 400 pin connector

CPU	Intel® 13th Generation Core™ family For details see table (CPU variants) given below

Chipset

lntel® 600/700 Series Chipset Family - On-Package Platform Controller Hub

Main Memory

2x DDR5 SODIMM dual channel up to 64 GByte non ECC

Graphics Controller

Intel® Iris XeGraphics architecture with up to 96 EUs, 4 Independent Displays (up to 8K)

Ethernet Controller

Intel® i226

Ethernet

Up to 2x 2.5 Gb Ethernet with TSN & WOL support (depending on SKU)

Flash Onboard

Up to 1 TByte NVMe SSD (on request)

PCI Express / PCI support

1x 8 PCIe Gen 5.0 (Raptor Lake H-Series, 35-45 W)
2x 4 PCIe Gen 4.0 -> 1x4 shared with onboard NVMe 8x PCIe Gen3.0
Optional 1x PCIe for BMC

Display

DDI1: DP++, DDI2: DP++, DDI3: DP++, eDP (DSI, BIOS option), MIPI DSI

USB	2x USB 4.0/ Thunderbolt™ ; 2x USB 3.2; 8x USB 2.0

Serial

2x serial interface (RX/TX only)

Audio

4x Sound wire, I2S (HW option: Option HD Audio instead of 2x sound wire)

Special Features

Trusted Platform Module TPM 2.0

Power Management

ACPI 6.0

Power Supply

Commercial Temperature: 8.0 V – 20 V Wide Range, Single Supply Power
Industrial Temperature: 12 V ± 5%

BIOS

AMI UEFI

Operating System

Windows®10, Linux, VxWorks

Temperature

Industrial temperature: -40 °C to +85 °C operating, -40 °C to +85 °C non-operating

Humidity

93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78)

Downloads

Solution Brief

Intel Solution Brief: Computer-on-Module Flexibility at the Edge
Kontron COM Express® and COM-HPC® modules with 13th Gen Intel® Core™ mobile processors deliver powerful performance, AI, and graphics with portfolio flexibility for industrial-grade deployments.
[ 18933-1-intel-rpl-p-kontron-solution-brief-v4.pdf, 1.67 MB, Mar.03.2023 ]

Datasheets

COMh-caRP
[ comh-carp_datasheet.pdf, 536.44 KB, Jun.26.2024 ]

Manuals

COMh-caRP User Guide
[ comh-carp_userguide_0-3.pdf, 1.46 MB, Aug.02.2023 ]

General Safety Instruction
[ general-safety-instructions.pdf, 628.88 KB, Aug.02.2024 ]

White Papers

Modules and Motherboards WP [restrictions apply]

Robotic-Assisted Surgery White Paper [restrictions apply]

The new Standard COM-HPC – Delivering future proofed power and connectivity [restrictions apply]
In response to the growing high performance computing requirements and to ensure Computer-on-Modules remain fit-for-purpose long into the future, a new High Performance Computing standard for Modules has been defined by the PICMG: COM-HPC®. This enables more powerful COMs that extend beyond the limits and capabilities of COM Express® (Type 6 and 7) and other COM standards. While complementary, COM-HPC® is distinct from COM Express®, directly supporting the growing need for more powerful future-proofed compute, scalability, transmission, and network performance.

Tech Spec Sheet

COM-HPC Tech Specs
[ techspec_com-hpc.pdf, 2.02 MB, Apr.04.2024 ]

Services

Kontron Services Brochure
[ kontron-services-brochure.pdf, 8.9 MB, Dec.17.2020 ]

Accessories

COMh Mounting Kit
HXX17-0000-00-0

COM-HPC Universal Mounting Kit

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