IoT

One of the new challenges arising with the use of edge, fog, and cloud architectures is the connection of components to each other and to the public cloud. An important element of developing a solution capturing all pieces is the IoT framework susietec

At the field, or edge level, data is collected by industrial computers, e.g. by gateways, which process, filter, analyze and act on these data in real-time right at the device.

Edge, fog and cloud applications demand increasing computing power. The interfaces to sensors or machines often require non-standard solutions. Especially in smaller machines, space is limited or restricted in some dimension and need a special solution.

Today, the connection from the sensor device to the embedded cloud takes place via real-time data communication, on sensor and edge level - for example Industrial Ethernet or fieldbuses - and gateways , which provide the transformation of real time data into the informational area.

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COMh-sdIL E2 New

COM-HPC®/Server with Intel® Xeon® D-1700 / D-1800 processor family

Specifications

Size D "small" form factor – 120 x 160 mm
Intel Xeon D-1700 / D-1800 Server platform
Up to 10 cores, processor TDP up to 67W
16x PCIe Gen 4.0 lanes + 16x PCIe Gen 3.0 lanes
8x LAN Ports for various configurations - up to 100GbE
Memory: Max 64GB soldered memeory with ECC support
Optional onboard storage NVMe
Industrial temperature versions
Embedded management controller

Download Datasheet

The COMh-sdIL with scalability from 4 to 10 cores, SKUs for an extended temperature range and 24x7 / 10 years reliability allows very robust implementations for harsh environments and extreme conditions in a small mechanical footprint.

The module accommodates up to 64GB DDR4-ECC soldered memory, as storage medium, a soldered NVMe SSD onboard with up to 1 TByte storage capacity is optionally available.

With 32x PCIe lanes (16x PCIe Gen4 plus 16x PCIe Gen3 lanes) and 2x Quad LAN interfaces supporting 100Gb Ethernet, the COMh-sdIL is an ideal platform for high data throughput requirements in demanding I/O and network structures.

Downloads

Datasheets

Datasheet COMh-sdIL
[ comh-sdil_datasheet.pdf, 752.12 KB, Sep.04.2024 ]

Manuals

COMh-sdIL User Guide
[ comh-sdil-user-guide_rev-1-0_2024-1122.pdf, 2.75 MB, Nov.22.2024 ]

General Safety Instruction
[ general-safety-instructions.pdf, 628.88 KB, Aug.02.2024 ]

White Papers

Modules and Motherboards WP [restrictions apply]

Robotic-Assisted Surgery White Paper [restrictions apply]

The new Standard COM-HPC – Delivering future proofed power and connectivity [restrictions apply]
In response to the growing high performance computing requirements and to ensure Computer-on-Modules remain fit-for-purpose long into the future, a new High Performance Computing standard for Modules has been defined by the PICMG: COM-HPC®. This enables more powerful COMs that extend beyond the limits and capabilities of COM Express® (Type 6 and 7) and other COM standards. While complementary, COM-HPC® is distinct from COM Express®, directly supporting the growing need for more powerful future-proofed compute, scalability, transmission, and network performance.

Tech Spec Sheet

COM-HPC Tech Specs
[ techspec_com-hpc.pdf, 2.02 MB, Apr.04.2024 ]

Services

Kontron Services Brochure
[ kontron-services-brochure.pdf, 8.9 MB, Dec.17.2020 ]

More Downloads

All other downloads such as drivers, bios, drawings etc. are available on Kontron’s Customer Section

Variants

COMh-sdIL E2 D-1746TER 64GB HSD04-6400-46-1		COM-HPC Server size D small, Intel® D-1746TER, 67/56W, 10 core, 2.0GHz, CEI - 4x 25G, 16x PCIe Gen4, 16x PCIe Gen3, 64GB DDR4-2667 memory down, industrial temperature
COMh-sdIL E2 D-1732TE 32GB HSD04-3200-32-1		COM-HPC Server size D small, Intel® D-1732TE, 52W, 8 core, 1.9GHz, CEI - 4x 10G, 16x PCIe Gen4, 16x PCIe Gen3, 32GB DDR4-2667 memory down industrial temperature
COMh-sdIL E2 D-1715TER 16GB HSD04-1600-15-1		COM-HPC Server size D small, Intel® D-1715TER, 50W, 4 core, 2.4GHz, CEI - 4x 10G, 16x PCIe Gen4, 16x PCIe Gen3, 16GB DDR4-2667 memory down industrial temperature

Accessories

COMh Eval Carrier Server HST01-0000-10-0	COMh Eval Carrier Server	more
HSP COMh-sdIL (E2) thread HSD04-0000-99-0	Heatspreader for COMh-sdIL commercial and E2, threaded mounting holes
HSP COMh-sdIL (E2) through HSD04-0000-99-1	Heatspreader for COMh-sdIL commercial and E2, through holes
COMh Size D Active Uni Cooler (w/o HSP) HSD99-0000-99-0	COM-HPC Size D Universal Active Cooler for Heatspreader Mounting (160 x 100 x 46 mm)
COMh Size D Passive Uni Cooler (w/o HSP) HSD99-0000-99-1	COM-HPC Size D Universal Passive Cooler for Heatspreader Mounting (160 x 100 x 46 mm)
COMh Mounting Kit HXX17-0000-00-0	COM-HPC Universal Mounting Kit

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