COMe-bCD2 This product is legacy
COM Express® basic Type 2
with Intel® Core™ Duo Processors
Specifications
- Up to Intel® Core™ Duo (up to 1,66 GHz) processor
- Up to 4 GB DDR2 SODIMM
- 2x SerialATA for highspeed drives, 8x USB 2.0 for fast peripherals
- Up to 4 PCI Express x1 and PCIe Graphic x16
- Gigabit Ethernet for high connectivity
The COMe-bCD2 module is based on the Intel® Core™ Duo processor or the Intel® Celeron® M processor in conjunction with the Intel 945GME chipset. PCI-Express is the primary data path for upcoming x86 based systems. Non PCI-Express components such as PCI plug-in cards can still be supported with the PCI 2.1 32 Bit Interface as COM Express® basic continue supporting the PCI bus for legacy applications.
The COMe-bCD2 support 4 PCI Express x1, PEG x16 lanes. Gigabit Ethernet for high connectivity and 8x USB 2.0 provides fast and sufficient interfaces for external peripherals. COM Express® basic modules also provide the following interfaces that are always located in the same physical position on each board, thus guaranteering scaleability between modules: PCI Express, PCI, USB, SerialATA, ParallelATA, LVDS Multi Media ports as well as an ACPI (Advanced Configuration and Power Interface) for optimized power management. Six mounting holes on the board provide secure mounting to allow the module increased shock and vibration resistance.
The COMe-bCD2 support 4 PCI Express x1, PEG x16 lanes. Gigabit Ethernet for high connectivity and 8x USB 2.0 provides fast and sufficient interfaces for external peripherals. COM Express® basic modules also provide the following interfaces that are always located in the same physical position on each board, thus guaranteering scaleability between modules: PCI Express, PCI, USB, SerialATA, ParallelATA, LVDS Multi Media ports as well as an ACPI (Advanced Configuration and Power Interface) for optimized power management. Six mounting holes on the board provide secure mounting to allow the module increased shock and vibration resistance.
Features
| CPU | up to Intel® Core™ Duo processor up to 1,66 GHz up to Intel® Celeron® M processor 1,86 GHz |
| Chipset | Intel® 945GME, ICH7M-DH |
| Hard Disk | 2x Serial ATA (AHCI/RAID 0,1), 1x Parallel ATA |
| USB | 8x USB 2.0 ports |
| Main Memory | Physical memory up to 4 GB (533/667) DDR2 SODIMM by dual channel memory support |
| PCI Express / PCI support | 4 PCI Express x1 / 1 x4; 1 PEG x16 |
| PCI | PCI 2.3, 32 bit / 33 MHz PCI bus |
| Audio Controller | Intel® High Definition Audio / AC' 97 |
| Graphics Controller | Integrated with Intel® Graphics Media Accelerator (GMA950) with DirectX® 9.0/SM3.0 and DVMT 3.0 support; Dual SDVO multiplexed with PEG |
| Resolution | Resolution CRT: CRT up to 2048 x 1536 Resolution LVDS: LVDS up to 1600 x 1200 JILI3 / EDID support |
| Panel signal | LVDS Panel Support: Single and Dual Channel LVDS 18/24 bit |
| TV out | TV out: TV output Component , S-Video or composite HDTV support (480p / 720p / 1080i / 1080p) |
| Common Features | LPC, JIDA Support, WakeOnLAN, I²C Bus, 8x GPIO, JRC support, Suspend states (S0/S3/S4/S5) |
| Watchdog | Watchdog |
| Dimensions (H x W x D) | 95 x 125 mm |
| Compliance | Fully COMexpress™ Type 2 compliant |
| Power Consumption | typ. Idle 14W @ Intel® Core™ Duo processor L2400 LV |
| Temperature | Operation: 0° to 60°C Storage: -30° to 85 °C *Ask about extended temperature ranges |
| Humidity | 93% relative Humidity at 40°C, non-condensing (according to IEC 60068-2-78) |
| Power Management | Power Management ACPI 2.0 (Advanced Configuration and Power Interface) |
| Operating System | Windows® XP Embedded, Windows® CE, Linux and others |
| Ethernet | 10/100/1000 MBit Ethernet, Realtek RTL8111C |
| Real Time Clock | Real Time Clock |
| Darkboot/Lanboot | LAN Boot |
Downloads
Datasheets
Datasheet COMe-bCD2
(Release Candidate)
[ datasheet_come-bcd2.pdf, 1.17 MB, Aug.31.2017 ]
Manuals
User's Guide
[ ccalm120.pdf, 1.94 MB, Sep.11.2017 ]
General Safety Instruction
[ general-safety-instructions.pdf, 628.88 KB, Aug.02.2024 ]
White Papers
COM Express® Design Guide by PICMG, Rev. 2.0
PICMG Guidelines for designing COM Express® Carrier Boards, Rev. 2.0
[ picmg_comdg_2-0-released-2013-12-06.pdf, 3.27 MB, Apr.20.2023 ]
Case Study: ETXexpress Infotainment
Discussion of how Kontron ETXexpress / COM Express modules are used in a home automoation/infotainment application.
[ wp_emd_infotainment_2006.pdf, 2.56 MB, Jun.26.2020 ]
Case Study: UL Certified COMs Deliver Quality
[ wp_ul_2007.pdf, 137.82 KB, Jun.26.2020 ]
Technology Paper about COM Express® Concept
Technology Paper about COM Express® Concept - COM Express® - One Concept, Ever Smaller.
[ com_expr_6seiter_11_2011_en_web.pdf, 2.91 MB, Nov.26.2020 ]
Whitepaper COM Express COM.0 Rev. 2.0
COM Express COM.0 Rev. 2.0 addresses the new functionalities that Intel®, AMD and other manufacturers are integrating in their upcoming processor families. Rev 2.0 adds two new pin-outs that make space for possible future technologies.
[ whitepaper_com-express-com-0-rev--2-0_en.pdf, 2.32 MB, Apr.20.2023 ]
Use Cases
Computer On Modules Magazine - 2007
With high scalability and Value-Add Service
for your customized solution
[ computer_on_modules_brochure2007.pdf, 7.01 MB, Nov.27.2013 ]
Services
Kontron Services Brochure
[ kontron-services-brochure.pdf, 8.9 MB, Dec.17.2020 ]
More Downloads
All other downloads such as drivers, bios, drawings etc. are available on Kontron’s Customer Section
Accessories
|
HSP COMe-bCD2 thread
38003-0000-99-0 |
Heatspreader for COMe-bCD2, threaded mounting holes | more | |
|
HSP COMe-bCD2 through
38003-0000-99-1 |
Heatspreader for COMe-bCD2, through holes | more | |
|
HSK COMe-bCD2 active thread
38003-0000-99-0C01 |
Active cooling solution for COMe-bCD2, threaded mounting holes | more | |
|
HSK COMe-bCD2 passive thread
38003-0000-99-0C02 |
Passive cooling solution for COMe-bCD2, threaded mounting holes | more |
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