Products
Industries
IoT
One of the new challenges arising with the use of edge, fog, and cloud architectures is the connection of components to each other and to the public cloud. An important element of developing a solution capturing all pieces is the IoT framework susietec
At the field, or edge level, data is collected by industrial computers, e.g. by gateways, which process, filter, analyze and act on these data in real-time right at the device.
Edge, fog and cloud applications demand increasing computing power. The interfaces to sensors or machines often require non-standard solutions. Especially in smaller machines, space is limited or restricted in some dimension and need a special solution.
Today, the connection from the sensor device to the embedded cloud takes place via real-time data communication, on sensor and edge level - for example Industrial Ethernet or fieldbuses - and gateways , which provide the transformation of real time data into the informational area.
Support & Services
Contact
For support related inquires, please contact our support team:
Contact Support
Downloads
We provide our customers with additional material enhancing their knowledge. Find all White Papers, Use Cases and brochures here.
Learn more about how Kontron supports its customers by improving their products and solutions. Read our Use Cases. Contact us for further information.
Learn more about our solutions for various industries by downloading our Whitepapers.
We provide our customers with additional material enhancing their knowledge. Find all White Papers, Use Cases and brochures here.
Get extended insights into our products and solutions by participating in our webcasts. You can find all webcasts here. Contact us for further information.
Learn more about our solutions for various industries by downloading our Whitepapers.
COM Express® Technology
COM Express® defines standardized footprints and pin-outs for Computer-on-Modules. With the new Revision 2.0, PICMG® added the compact footprint (95x95mm) to the basic footprint (125x95mm) and extended the pin-outs being future-proof. New Digital Display Interfaces (DDI) and super-fast USB 3.0 are now integrated. The new Pin-out Type 10 in COM Express® Revision 2.0 supports perfectly modules in the ultra footprint (85x55 mm).
Related Videos
