COMe-cAL6 (E2)
COM Express® compact Type 6 with Intel® Atom® E3900 Series, Pentium® and Celeron® Processors
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Specifications
- Low-power – performance/watt optimized form factor solution
- Up to 8 GByte DDR3L 1600 / 1867 Memory (2x SODIMM socket)
- Triple display support
- Up to 5x PCIe lanes
- 4x USB 3.0/2.0, 4x USB 2.0, 2x SATA, eMMC Flash
- Industrial grade temperature
The COMe-cAL6 (E2) COM Express compact Type 6 module is highly scalable and covers the entire range of Intel's latest IoT-ready embedded processors. A broad range of module variants, based on five different processor types, make up the COMe-cAL6 portfolio. Versions range from a cost optimized dual-core Intel Celeron (2x 1.1/2.4 GHz with 6W TDP) iteration optimized for energy-sensitive applications to genuine quad-core Intel Atom (4x 1.6/2.0 GHz with 12W TDP) and Intel Pentium (4x 1.1/2.5 GHz with 6W TDP) versions for high-end applications.
Users benefit from a significantly improved computing performance, an impressive performance-per-watt ratio and the long-term availability inherent in all Kontron embedded solutions.
Features
| Compliance | COM Express® compact, Pin-out Type 6 - COM.0 R3.0 |
| Dimensions (H x W x D) | 95 x 95 mm |
| CPU | COMe-cAL6 E2: Intel® Atom® x7-E3950, 4C, 1.6 / 2.0 GHz, 12 W TDP Intel® Atom® x5-E3940, 4C, 1.6 / 1.8 GHz, 9.5 W TDP Intel® Atom® x5-E3930, 2C, 1.3 / 1.8 GHz, 6.5 W TDP COMe-cAL6: Intel® Pentium® N4200E, 4C, 1.1 / 2.5 GHz, 6 W TDP Intel® Celeron® N3350E, 2C, 1.1 / 2.4 GHz, 6 W TDP |
| Chipset | Integrated SoC |
| Main Memory | Up to 8 GByte DDR3L 1600 / 1867 Memory (2x SODIMM socket) |
| Graphics Controller | Intel HD Gfx Gen9: 1x LVDS/eDP (3840 x 2160 @ 60 Hz) 2x DP (++) on DDI1/DDI2 up to 4K |
| Ethernet Controller | Intel® I210IT / I210AT |
| Ethernet | 10/100/1000 MBit Ethernet |
| Storage | 2x SATA 6Gb/s |
| Flash Onboard | Build option: - up to 84 GByte eMMC pSLC - up to 256 GByte eMMC TLC |
| PCI Express / PCI support | 3x PCIe x1 on request: - 5x PCIe x1: w/ LAN, w/ PCIe hub - 4x PCIe x1: w/o LAN, w/o PCIe hub |
| Panel signal | DDI 1/2: DP++, LVDS: Dual Channel up to 48-bit or eDP on request |
| USB | 4x USB 3.0/2.0, 4x USB 2.0 |
| Serial | 2x serial interface (RX/TX only) |
| Audio | Intel® High Definition Audio |
| Common Features | SPI, LPC, SMB, Fast I²C, Staged Watchdog, RTC |
| BIOS | AMI Aptio V |
| Humidity | 93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78) |
| Options | 5x PCIe x1 configuration w/ PCI hub eMMC Flash option (up to 84GByte pSLC, 256GByte TLC) eDP instead of LVDS General Purpose SPI instead of Boot SPI, AES-NI, USB client |
| Power Management | ACPI 5.0 |
| Power Supply | 8.5 V – 20 V Wide Range, Single Supply Power |
| Special Features | POSCAP capacitors, Trusted Platform Module TPM 2.0, 4k Resolutions, Industrial grade temperature |
| Operating System | Windows 10 Enterprise, Windows 10 IoT, Linux, VxWorks |
| Temperature | COMe-cAL6 - commercial temperature: 0 °C to +60 °C operating, -30 °C to +85 °C non-operating COMe-cAL6 E2 - industrial temperature: -40 °C to +85 °C operating, -40 °C to +85 °C non-operating |
| Supported Modules | COMe-cAL6 / COMe-cAL6 E2 |
Downloads
Solution Brief
Intel Solution Brief: Computer-on-Module Flexibility at the Edge
Kontron COM Express® and COM-HPC® modules with 13th Gen Intel® Core™ mobile processors deliver powerful performance, AI, and graphics with portfolio flexibility for industrial-grade deployments.
[ 18933-1-intel-rpl-p-kontron-solution-brief-v4.pdf, 1.67 MB, Mar.03.2023 ]
Datasheets
Datasheet COMe-cAL6 (E2)
[ come-cal6_datasheet.pdf, 480.45 KB, Nov.19.2024 ]
Manuals
COMe-cAL6 (E2) User Guide
Rev. 2.2
[ come-cal6_user-guide_rev-2-2_2024-1028.pdf, 3.53 MB, Oct.28.2024 ]
General Safety Instruction
[ general-safety-instructions.pdf, 628.88 KB, Aug.02.2024 ]
White Papers
Modules and Motherboards WP [restrictions apply]
Robotic-Assisted Surgery White Paper [restrictions apply]
Use Cases
Autonomous Driving
Read how our COM Express® Module is working perfect for application from b-plus with its flexibility, bandwith, reliability and the required graphics.
[ uc_b-plus_eu.pdf, 4.78 MB, May.26.2021 ]
COM Express® Basic for Autonomous Transportation in Rugged Environments
Implementing Kontron’s latest COMe® Basic based on Intel’s® 11th generation Xeon® processors and ECC memory provided the optimum power and performance
[ adas_en_use-case_kontron.pdf, 1.54 MB, Oct.11.2022 ]
The tough choice of Processors
Solving challenges in selecting computer boards & modules for IIoT projects. In this article we support you to make the right choice for your application: To find the best balance of processing power, graphics capabilities and connectivity on the one hand and size, power consumption, and cost on the other.
[ artikel_processor-choice_eu-1-.pdf, 4.42 MB, Apr.20.2023 ]
Tech Spec Sheet
COM EXPRESS® compact
[ tech-spec_comexpress.pdf, 7.08 MB, Apr.04.2024 ]
Services
Kontron Services Brochure
[ kontron-services-brochure.pdf, 8.9 MB, Dec.17.2020 ]
More Downloads
All other downloads such as drivers, bios, drawings etc. are available on Kontron’s Customer Section
Accessories
|
COMe Eval Carrier2 T6
38116-0000-00-5 |
|
COM Express® Eval Carrier2 Type 6 with 5mm COMe connector | more |
|
COMe Ref.Carrier-i T6 TMIP 38115-0000-00-0 |
COM Express® Reference Carrier-i Type 6 Thin-MiniITX Professional | ||
|
COMe Active Uni Cooler (w/o HSP) 36099-0000-99-0 |
COM Express® Universal Active Cooler for Heatspreader Mounting (87x78x14.3mm) (for CPU's <20W) | ||
|
COMe Passive Uni Cooler (w/o HSP) 36099-0000-99-1 |
COM Express® Universal Passive Cooler for Heatspreader Mounting (87x78x14.3mm) (for CPU's <10W) | ||
|
COMe Passive Uni Cooler Slim (w/o HSP) 36099-0000-99-3 |
COM Express® Universal Passive Cooler low profile for Heatspreader Mounting (95x95x10 mm) 90° fin direction mounting option | ||
|
KAB-HSP 200mm 96079-0000-00-0 |
Fan cable adapter for 3pin standard FAN connector to 3pin molex connector, cable length 200mm | ||
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KAB-HSP 40mm 96079-0000-00-2 |
Fan cable adapter for 3pin standard FAN connector to 3pin molex connector, cable length 40mm | ||
|
COMe Mount KIT 8mm 1set 38017-0000-00-0 |
COM Express® Mounting Kit 8mm 1set for threaded HSP and Cooling Solutions | ||
|
COMe Mount Kit 5mm 100sets 38017-0100-00-5 |
COM Express® Mounting Kit 5mm 100 sets | ||
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COMe Mount Kit 5mm 1set 38017-0000-00-5 |
COM Express® Mounting Kit 5mm 1set for threaded HSP and Cooling Solutions | ||
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COMe Mount Kit 8mm 100sets 38017-0100-00-0 |
COM Express® Mounting Kit 8mm 100sets | ||
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HSP COMe-cAL6 (E2) Thread 36024-0000-99-0 |
Heatspreader for COMe-cAL6/COMe-cAL6 E2, threaded mounting holes | ||
|
HSP COMe-cAL6 (E2) Through 36024-0000-99-1 |
Heatspreader for COMe-cAL6/COMe-cAL6 E2, through holes | ||
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DDR3L-1866 SODIMM 4GB E2_COM 97015-4096-19-2 |
DDR3L SDRAM, 204pin, Speed = 933MHz / DDR3L-1866 / 1.35V / PC3-14900, industrial temperature -40°C to +85°C | ||
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DDR3L-1866 SODIMM 4GB_COM 97015-4096-19-0 |
DDR3L SDRAM, 204pin, Speed = 933MHz / DDR3L-1866 / 1.35V / PC3-14900 | ||
|
DDR3L-1866 SODIMM 8GB E2_COM 97015-8192-19-2 |
DDR3L SDRAM, 204pin, Speed = 933MHz / DDR3L-1866 / 1.35V / PC3-14900, industrial temperature -40°C to +85°C | ||
|
DDR3L-1866 SODIMM 8GB_COM 97015-8192-19-0 |
DDR3L SDRAM, 204pin, Speed = 933MHz / DDR3L-1866 / 1.35V / PC3-14900 |
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