The new COM–Express® modules, based on 13th Gen Intel® Core™ (former codename Raptor Lake-P) offer a significant performance increase compared to the previous generation and are equipped with up to 14 cores based on Intel® performance hybrid architecture.
The COM-Express® modules provide essential, industrial-grade features such as support for in-band error correction code (IBECC) memory, Intel® Time Coordinated Computing (Intel® TCC), Time-Sensitive Networking (TSN) and extended temp. range of -40C to +85C (operating).
All features are perfect for applications in demanding areas such as Industrial Automation, Health Care and Automotive.
Compliance | COM Express® Mini Pin-out Type 10 |
Dimension (H x W) | 84 x 55 mm |
CPU | Intel® 13th Generation Core™ family For details see table (CPU variants) given below |
Chipset | Integrated SoC |
Main Memory | Dual-Channel LPDDR5(x) memory down up to 32 GByte |
Graphics Controller | Intel® Iris® Xe Graphics on i7/i5 processors Intel® UHD Graphics on i3/Celeron® processors |
Ethernet Controller | Intel® I226LM/I226IT |
Ethernet | Up to 2.5Gb Ethernet with TSN support |
Storage | 2x SATA 6Gb/s |
Flash Onboard | Up to 1 TByte NVMe SSD (on request) |
PCI Express | 4x PCIe 3.0 |
Display | DDI1: DP++, LVDS: Single Channel 18/24bit |
USB | 2x USB 3.2 Gen2 (incl. USB 2.0) + 6x USB 2.0 |
Serial | 2x serial interface (RX/TX only) |
Audio | High Definition Audio interface |
Common Features | (G) SPI, LPC, SMB, Fast I²C, Staged Watchdog, RTC |
Special Features | POSCAP capacitors, Trusted Platform Module TPM 2.0 |
Power Management | ACPI 6.0 |
Power Supply | 4.75 V – 20 V Wide Range, Single Supply Power |
BIOS | AMI Aptio V |
Operating System | Windows®10, Linux, VxWorks (project based) |
Temperature | Commercial temperature: 0 °C to +60 °C operating, -30 °C to +85 °C non-operating Industrial temperature: -40 °C to +85 °C operating, -40 °C to +85 °C non-operating |
Humidity | 93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78) |
Intel Solution Brief: Computer-on-Module Flexibility at the Edge
Kontron COM Express® and COM-HPC® modules with 13th Gen Intel® Core™ mobile processors deliver powerful performance, AI, and graphics with portfolio flexibility for industrial-grade deployments.
[ 18933-1-intel-rpl-p-kontron-solution-brief-v4.pdf, 1.67 MB, Mar.03.2023 ]
come-mrp10-e2
[ come-mrp10-e2_datasheet.pdf, 465.66 KB, Feb.16.2024 ]
COMe-mRP10 User Manual
[ come-mrp10_user_guide_1-0_2024_06_13.pdf, 1.17 MB, Jun.13.2024 ]
General Safety Instruction
[ general-safety-instructions.pdf, 628.88 KB, Aug.02.2024 ]
Modules and Motherboards WP [restrictions apply]
Robotic-Assisted Surgery White Paper [restrictions apply]
Autonomous Driving
Read how our COM Express® Module is working perfect for application from b-plus with its flexibility, bandwith, reliability and the required graphics.
[ uc_b-plus_eu.pdf, 4.78 MB, May.26.2021 ]
COM Express® Basic for Autonomous Transportation in Rugged Environments
Implementing Kontron’s latest COMe® Basic based on Intel’s® 11th generation Xeon® processors and ECC memory provided the optimum power and performance
[ adas_en_use-case_kontron.pdf, 1.54 MB, Oct.11.2022 ]
The tough choice of Processors
Solving challenges in selecting computer boards & modules for IIoT projects. In this article we support you to make the right choice for your application: To find the best balance of processing power, graphics capabilities and connectivity on the one hand and size, power consumption, and cost on the other.
[ artikel_processor-choice_eu-1-.pdf, 4.42 MB, Apr.20.2023 ]
Tech Specs COM EXPRESS®
[ tech-spec_comexpress.pdf, 7.08 MB, Apr.04.2024 ]
Kontron Services Brochure
[ kontron-services-brochure.pdf, 8.9 MB, Dec.17.2020 ]
All other downloads such as drivers, bios, drawings etc. are available on Kontron’s Customer Section
COME EVAL CARRIER T10 GEN2 34101-0000-00-2 |
COM Express® Evaluation Carrier Type 10 Gen2 | ||
HSP COMe-mRP10 CU-CORE THREADED 34014-0000-99-0 |
Heatspreader for COM-mRP10, Cu-core, threaded mounting holes | ||
HSP COMe-mRP10 CU-CORE THROUGH 34014-0000-99-1 |
Heatspreader for COM-mRP10, Cu-core, through mounting holes | ||
COMe MINI ACTIVE UNI COOLER2 (W/O HSP) 34099-0000-99-0 |
COM Express® Mini Universal Active Cooler for Heatspreader Mounting | ||
COMe MINI PASSIVE UNI COOLER2 (W/O HSP) 34099-0000-99-1 |
COM Express® Mini Universal Passive Cooler for Heatspreader Mounting |
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