Ideal für ultra-compakte oder portable IoT edge Systeme
2,5„-SBC-ADN ist ein 2,5“-Einplatinencomputer im Pico-ITX-Formfaktor, der auf Intel® Atom® x7000RE Series (Codename Amston Lake), Intel® Atom® x7000E Series, Intel® Core™ i3 N-Series und Intel® N-Series (Codename Alder Lake N) Prozessoren basierend ist. Integriert ist die Intel® UHD Graphics Gen12 sowie Hochgeschwindigkeitsspeicher der nächsten Generation LPDDR5. Dadurch kann es eine verbesserte Leistung, eine verbesserte Medientranskodierung und eine schnellere KI-Inferenz liefern, was es zu einem idealen Baseboard macht, das in ein ultrakompaktes oder tragbares IoT-Edge-System oder eine All-in-One-Lösung für eine Vielzahl von Anwendungen wie Smart Retail, Industrieautomatisierung, Gesundheitswesen, Videoverarbeitung und Büroautomation integriert werden kann.
Processor | [Standard] Intel® Atom® x7211RE (2C, 6M, 1.0/3.2GHz, 6W) Intel® Atom® x7433RE (4C, 6M, 1.5/3.4GHz, 9W) Intel® Atom® x7835RE (8C, 6M, 1.3/3.6GHz, 12W) Intel® Core™ i3-N305 (8C, 6M, 1.8/3.8GHz, 9←15W) Intel® N97 (4C, 6M, 2.0/3.6GHz, 12W) [Project] Intel® Atom® x7213RE (2C, 6M, 2.0/3.4GHz, 9W) Intel® Atom® x7211E (2C, 6M, 1.0/3.2GHz, 6W) Intel® Atom® x7213E (2C, 6M, 1.7/3.2GHz, 10W) Intel® Atom® x7425E (4C, 6M, 1.5/3.4GHz, 12W) Intel® N50 (2C 6M, 1.0/3.4GHz, 6W) Intel® N200 (4C, 6M, 1.0/3.7GHz, 6W) |
Main Memory | 4 GByte / 8 GByte / 16 GByte LPDDR5 4800 memory down |
Graphics Controller | Intel® UHD Graphics Gen12 |
Display | 1x eDP (4096 x 2160 @ 60 Hz) 2x DP (4096 x 2160 @ 60 Hz, 1x Full-size DP on rear, 1x DP USB-C on rear) Triple Display Support |
Ethernet Controller | Intel® I226-V/IT |
Ethernet | 2x 2.5 GbE LAN (RJ45 on rear) TSN support for models with Atom® processors |
USB | 2x USB 3.2 Gen 2 Type A (on rear) 1x USB 3.2 Gen 2 Type C (on rear, w/ DP & PD 5 V / 3 A, except Atom® x7000RE) 1x USB 3.2 Gen 1 Type C (on rear, w/ DP & PD 5 V / 3 A, only Atom® x7000RE) 2x USB 2.0 (by header) |
Serial Ports | 2x RS232 (default) / RS232/422/485 (optional) (by header, Tx / Rx only for RS232 signal) |
Digital Inputs (DI) | 4x DI (by wafer) |
Digital Outputs (DO) | 4x DO (by wafer) |
eMMC | 32 GByte / 64 GByte / 128 GByte eMMC |
Expansion | 1x M.2 Key B (Type 2242/3042/3052/2280, w/ PCIe x2 / USB 2.0 / SATA / UIM) 1x M.2 Key E (Type 2230, w/ PCIe x1 / USB 2.0 / CNVi (Atom® x7000RE does not support CNVi)) 1x SIM Card Holder (by Wafer) |
Input Voltage | DC 9 V ~ 20 V |
Power connector | 1x2-pin pitch 1.25 mm Wafer |
BIOS | AMI uEFI BIOS w/ 256 Mb SPI Flash |
Watchdog | Programmable WDT to generate system reset event |
System Monitoring | Voltages Temperatures |
Real Time Clock | Processor integrated RTC |
TPM | TPM 2.0 Support (Infineon SLB 9672) |
FP Header | 1x Header for Power Button, Reset Button, Power LED & SATA LED |
Form Factor | Pico-ITX (100 mm x 72 mm / 3.94" x 2.83") |
Operating Temperature | 0 °C~ 60 °C / 32 °F ~ 140 °F (Standard) -40 °C ~ 85 °C / -40 °F ~ 185 °F (Extreme) |
Storage Temperature | -20 °C ~ 80 °C / -4 °F ~ 176 °F (Standard) -55 °C ~ 85 °C / -67 °F ~ 185 °F (Extreme) |
Humidity | 0 % ~ 95 % |
Compliance | CE Class B, FCC Class B, ICES Class B, UKCA, UR (UL Recognized) |
2.5"-SBC-AML/ADN Datasheet
Revision 20241021, October 21, 2024
[ 2d5-sbc-aml-adn-datasheet-20241021.pdf, 2.12 MB, Oct.21.2024 ]
General Safety Instruction
[ general-safety-instructions.pdf, 628.88 KB, Aug.02.2024 ]
2.5" SBC Tech Spec Sheet
Revision 20240807, August 7, 2024
[ 2d5-sbc-tech-spec-sheet-20240807.pdf, 6.09 MB, Nov.04.2024 ]
Tech Specs SBC
(Release Candidate)
Revision 20241014, October 14, 2024
[ 3d5-sbc-tech-spec-sheet-20241014.pdf, 19.83 MB, Nov.04.2024 ]
Kontron Services Brochure
[ kontron-services-brochure.pdf, 8.9 MB, Dec.17.2020 ]
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