3.5"-SBC-AML/ADN
3.5" Single Board Computer with Intel® Atom® x7000(R)E Series, Intel® Core™ i3 N-Series & Intel® N-Series Processors
Spezifikationen
Bald verfügbar- Upgraded processing and graphics performance + faster AI inference capability
- Next-gen DDR5 memory support with up to 4800 MT/s data transfer rate
- Additional Rear I/O expansion via board-to-board connector
- DP Alt Mode over USB-C support to carry video / audio, data & power over a single port
- Hardware-based security for data protection and reliable authentication
Ideal for IoT, IIoT and AIoT Applications
3.5"-SBC-AML/ADN is a 3.5" single board computer powered by Intel® Atom® x7000RE Series (codenamed Amston Lake), Intel® Atom® x7000E Series, Intel® Core™ i3 N-Series and Intel® N-Series (codenamed Alder Lake N) processors integrated with Intel® UHD Graphics Gen12 as well as support for a next-gen high-speed DDR5 memory. Thus, it can deliver upgraded performance, enhanced media transcoding and faster AI inference, making it an ideal baseboard to be integrated into a compact IoT edge system or an all-in-one solution for a variety of applications, such as smart retail, industrial automation, healthcare, video processing and offi ce automation.
Eigenschaften
| Processor | [Standard] Intel® Atom® x7211RE (2C, 6M, 1.0/3.2GHz, 6W) Intel® Atom® x7433RE (4C, 6M, 1.5/3.4GHz, 9W) Intel® Core™ i3-N305 (8C, 6M, 1.8/3.8GHz, 9←15W) Intel® N97 (4C, 6M, 2.0/3.6GHz, 12W) [Project] Intel® Atom® x7213RE (2C, 6M, 2.0/3.4GHz, 9W) Intel® Atom® x7835RE (8C, 6M, 1.3/3.6GHz, 12W) Intel® Atom® x7211E (2C, 6M, 1.0/3.2GHz, 6W) Intel® Atom® x7213E (2C, 6M, 1.7/3.2GHz, 10W) Intel® Atom® x7425E (4C, 6M, 1.5/3.4GHz, 12W) Intel® N50 (2C 6M, 1.0/3.4GHz, 6W) Intel® N200 (4C, 6M, 1.0/3.7GHz, 6W) |
| Main Memory | 1x DDR5 4800 SO-DIMM up to 16 GByte |
| Graphics Controller | Intel® UHD Graphics Gen12 |
| Display | Intel® UHD Graphics Gen12 1x LVDS / eDP (24-bit, 2-ch, 1920 x 1200 @ 60 Hz / 4096 x 2160 @ 60 Hz) 3x DP (4096 x 2160 @ 60 Hz, 2x Full-size DP on rear, 1x DP USB-C on rear) Triple Display Support |
| Audio CODEC | TSI 92HD91B |
| Audio Interface | 1x Speaker-out (Stereo, 3 W, by header) 1x Line-in (by header) 1x Line-out (by header) 1x Mic-in (by header) 1x S/PDIF Out (by header) |
| Ethernet | 2x 2.5 GbE LAN (RJ45 on rear, Intel® I226-V/IT) TSN support models with Atom® processors |
| USB | 2x USB 3.2 Gen 2 Type A (on rear) 1x USB 3.2 Gen 2 Type C (on rear, w/ DP & PD 5 V / 3 A, except Atom® x7000RE) 1x USB 3.2 Gen 1 Type C (on rear, w/ DP & PD 5 V / 3 A, only Atom® x7000RE) 3x USB 2.0 (1x Type A on rear, 2x by header (optl. routed to B2B connector)) |
| Serial Ports | 4x RS232/422/485 (2x Tx/Rx only in RS232 signal, by header) |
| DIO | 4x DI (by wafer) 4x DO (by wafer) |
| SATA | 1x SATA 3.0 |
| Expansion Slots | 1x M.2 Key B (2242 / 3042 / 3052 / 2280, w/ PCIe x1 / USB 2.0 / UIM) 1x M.2 Key E (Type 2230, w/ PCIe x1 (optl. routed to B2B conenctor) / USB 2.0 / CNVi (Atom® x7000RE does not support CNVi)) 1x M.2 Key M (Type 2280, w/ SATA 3.0 (default) / PCIe x1 (optional)) 1x SIM Card Holder (by header) 1x Board-to-board Connector (w/ 1x PCIe x1 (2x optional, replacing PCIe in M.2 Key E) / 1x SM Bus / 1x I2C / 1x UART / 1x GSPI / 2x USB 2.0 (optional, replacing the route to 2x internal USB 2.0)) |
| Input Voltage | DC 9 V ~ 36 V |
| Power connector | 1x4-pin pitch 3.0 mm Wafer |
| BIOS | AMI uEFI BIOS w/ 256 Mb SPI Flash |
| Watchdog | Programmable WDT to generate system reset event |
| System Monitoring | Voltages, Temperatures |
| Real Time Clock | Processor integrated RTC |
| Security | TPM 2.0 Support (Infineon SLB 9672) |
| Cooling | 1x Wafer for Smart Fan |
| Operating System | Windows 11, Windows 10, Linux |
| Dimensions. (LxW) | ECX (146 mm x 105 mm / 5.75" x 4.13") |
| Operating Temperature | 0 °C~ 60 °C / 32 °F ~ 140 °F (Standard) -40 °C ~ 85 °C / -40 °F ~ 185 °F (Extreme) |
| Storage Temperature | -20 °C ~ 80 °C / -4 °F ~ 176 °F (Standard) -55 °C ~ 85 °C / -67 °F ~ 185 °F (Extreme) |
| Humidity | 0 % ~ 95 % |
| Compliance | CE Class B, FCC Class B, ICES Class B, UKCA, UR (UL Recognized) |
Downloads
Datasheets
3.5"-SBC-AML/ADN Datasheet
Revision 20241219, December 19, 2024
[ 3d5-sbc-aml-adn-datasheet-20241219.pdf, 2 MB, Dec.19.2024 ]
Manuals
3.5"-SBC-AML/ADN User Guide
Revision 1.0, December 6, 2024
[ 3d5-sbc-aml-adn-user-guide-rev-1d0-2024-12-06.pdf, 4.06 MB, Dec.06.2024 ]
General Safety Instruction
[ general-safety-instructions.pdf, 628.88 KB, Aug.02.2024 ]
Tech Spec Sheet
Tech Specs SBC
(Release Candidate)
Revision 20241014, October 14, 2024
[ 3d5-sbc-tech-spec-sheet-20241014.pdf, 19.83 MB, Nov.04.2024 ]
Services
Kontron Services Brochure
[ kontron-services-brochure.pdf, 8.9 MB, Dec.17.2020 ]
Zubehör
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3.5" Extended I/O Board (3.5"-eIO-GPA-2-XT)
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DC Jack Cable 1064-2433 |
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2,5-Gleichstrombuchse mit 2-mm-Mutter und 0,5-mm-Unterlegscheibe im Raster 1 x 4P 3,0 | |
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SATA Cable with Lock 1064-2431 |
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SATA Cable with Lock, 1X7P (1.27 pitch), L=460 mm | |
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SATA Power Cable 1064-2430 |
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SATA Power Cable, SATA 1x15P Pitch:1.27mm to PH 2.0 HSG 1x4P 2.0pitch, L=460mm | |
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COM_Port Cable 1064-2427 |
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D-SUB 9P (männlich) bis 1x10P 1,25 | |
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DIO Cable 1065-3137 |
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D-SUB-9P(Female) to 1x10P 1.25 pitch, L=200mm | |
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2-Port USB 2.0 Cable 1069-7893 |
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2x5-pin pitch 2.0 mm to 2x USB Type A 4P Female w/ bracket, L = 270 mm | |
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Audio Cable w/ 3x Phone Jack 1070-1245 |
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HRS DF13-10DS-1.25C 1.25 pitch to PJ-2509CTPC-5-L (3.5 mm phone jack) x3, L = 400 mm | |
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AC to DC Power Adapter (12 V) 1069-3055 |
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Input: AC 90 V ~ 264 V, output: DC 12 V @ 5 A Max. 60 W | |
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Screw Copper Pillar Kit - 12 pcs |
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4x 39.6 mm pillar, 3x 19 mm pillar, 4x 15 mm screw, 1x 5 mm screw | |
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Heatsink - 3.5"-SBC-EKL(J/N)/AML/ADN 1070-1238 |
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Heatsink w/ Thermal Pad, 2x M3x6 screw | |
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3.5"-SBC-EKL(N/J Series)/AML/ADN Starter Kits 1070-4932 |
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1x DC In Cable, 1x SATA Cable, 1x SATA Power Cable, 1x COM Port Cable, 1x DIO Cable, 1x 2-port USB Cable, 1x Audio Cable, 1x Power Adapter, 1x Heatsink, 1x Screw Copper Pillar Kit |
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