Ideal for IoT, IIoT and AIoT Applications
3.5"-SBC-AML/ADN is a 3.5" single board computer powered by Intel® Atom® x7000RE Series (codenamed Amston Lake), Intel® Atom® x7000E Series, Intel® Core™ i3 N-Series and Intel® N-Series (codenamed Alder Lake N) processors integrated with Intel® UHD Graphics Gen12 as well as support for a next-gen high-speed DDR5 memory. Thus, it can deliver upgraded performance, enhanced media transcoding and faster AI inference, making it an ideal baseboard to be integrated into a compact IoT edge system or an all-in-one solution for a variety of applications, such as smart retail, industrial automation, healthcare, video processing and office automation.
Processor | [Standard] Intel® Atom® x7211RE (2C, 6M, 1.0/3.2GHz, 6W) Intel® Atom® x7433RE (4C, 6M, 1.5/3.4GHz, 9W) Intel® Core™ i3-N305 (8C, 6M, 1.8/3.8GHz, 9←15W) Intel® N97 (4C, 6M, 2.0/3.6GHz, 12W) [Project] Intel® Atom® x7213RE (2C, 6M, 2.0/3.4GHz, 9W) Intel® Atom® x7835RE (8C, 6M, 1.3/3.6GHz, 12W) Intel® Atom® x7211E (2C, 6M, 1.0/3.2GHz, 6W) Intel® Atom® x7213E (2C, 6M, 1.7/3.2GHz, 10W) Intel® Atom® x7425E (4C, 6M, 1.5/3.4GHz, 12W) Intel® N50 (2C 6M, 1.0/3.4GHz, 6W) Intel® N200 (4C, 6M, 1.0/3.7GHz, 6W) |
Main Memory | 1x DDR5 4800 SO-DIMM up to 16 GByte |
Graphics Controller | Intel® UHD Graphics Gen12 |
Display | Intel® UHD Graphics Gen12 1x LVDS / eDP (24-bit, 2-ch, 1920 x 1200 @ 60 Hz / 4096 x 2160 @ 60 Hz) 3x DP (4096 x 2160 @ 60 Hz, 2x Full-size DP on rear, 1x DP USB-C on rear) Triple Display Support |
Audio CODEC | TSI 92HD91B |
Audio Interface | 1x Speaker-out (Stereo, 3 W, by header) 1x Line-in (by header) 1x Line-out (by header) 1x Mic-in (by header) 1x S/PDIF Out (by header) |
Ethernet | 2x 2.5 GbE LAN (RJ45 on rear, Intel® I226-V/IT) TSN support models with Atom® processors |
USB | 2x USB 3.2 Gen 2 Type A (on rear) 1x USB 3.2 Gen 2 Type C (on rear, w/ DP & PD 5 V / 3 A, except Atom® x7000RE) 1x USB 3.2 Gen 1 Type C (on rear, w/ DP & PD 5 V / 3 A, only Atom® x7000RE) 3x USB 2.0 (1x Type A on rear, 2x by header (optl. routed to B2B connector)) |
Serial Ports | 4x RS232/422/485 (2x Tx/Rx only in RS232 signal, by header) |
DIO | 4x DI (by wafer) 4x DO (by wafer) |
SATA | 1x SATA 3.0 |
Expansion Slots | 1x M.2 Key B (2242 / 3042 / 3052 / 2280, w/ PCIe x1 / USB 2.0 / UIM) 1x M.2 Key E (Type 2230, w/ PCIe x1 (optl. routed to B2B conenctor) / USB 2.0 / CNVi (Atom® x7000RE does not support CNVi)) 1x M.2 Key M (Type 2280, w/ SATA 3.0 (default) / PCIe x1 (optional)) 1x SIM Card Holder (by header) 1x Board-to-board Connector (w/ 1x PCIe x1 (2x optional, replacing PCIe in M.2 Key E) / 1x SM Bus / 1x I2C / 1x UART / 1x GSPI / 2x USB 2.0 (optional, replacing the route to 2x internal USB 2.0)) |
Input Voltage | DC 9 V ~ 36 V |
Power connector | 1x4-pin pitch 3.0 mm Wafer |
BIOS | AMI uEFI BIOS w/ 256 Mb SPI Flash |
Watchdog | Programmable WDT to generate system reset event |
System Monitoring | Voltages, Temperatures |
Real Time Clock | Processor integrated RTC |
Security | TPM 2.0 Support (Infineon SLB 9672) |
Cooling | 1x Wafer for Smart Fan |
Operating System | Windows 11, Windows 10, Linux |
Dimensions. (LxW) | ECX (146 mm x 105 mm / 5.75" x 4.13") |
Operating Temperature | 0 °C~ 60 °C / 32 °F ~ 140 °F (Standard) -40 °C ~ 85 °C / -40 °F ~ 185 °F (Extreme) |
Storage Temperature | -20 °C ~ 80 °C / -4 °F ~ 176 °F (Standard) -55 °C ~ 85 °C / -67 °F ~ 185 °F (Extreme) |
Humidity | 0 % ~ 95 % |
Compliance | CE Class B, FCC Class B, ICES Class B, UKCA, UR (UL Recognized) |
3.5"-SBC-AML/ADN Datasheet
Revision 20241029, October 29, 2024
[ 3d5-sbc-aml-adn-datasheet-20241029.pdf, 1.92 MB, Oct.29.2024 ]
General Safety Instruction
[ general-safety-instructions.pdf, 628.88 KB, Aug.02.2024 ]
Tech Specs SBC
(Release Candidate)
Revision 20241014, October 14, 2024
[ 3d5-sbc-tech-spec-sheet-20241014.pdf, 19.83 MB, Nov.04.2024 ]
Kontron Services Brochure
[ kontron-services-brochure.pdf, 8.9 MB, Dec.17.2020 ]
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