This COM Express® module COMe-bBD7 extends Kontron’s product family of server-class COM platforms. The module features data-centre-grade CPU performance with up to 16 cores. This robust performance is combined with support for two 10GbE-KR ports making it ideal for network intensive implementations. The KR design allows for maximum flexibility by defining the physical interface – KR for backplane connectivity, Copper (RJ45) or fibre (SFP+) on the base board. Furthermore the available NC-Si signals allow for the connection of a Baseboard Management Controller (BMC) on the baseboard for the purpose of enabling out-of-band remote manageability. This enhances reliability and helps reducing the overall operating cost in general.
In addition, the COMe-bBD7 offers high-speed connectivity from configurable PCIe lanes with an up to PCIe x24 implementation for high I/O performance demands such as those required in medical applications. Offering a well-balanced multi-core CPU versus memory-size approach, it supports up to 64 gigabytes (GB) of ECC and non-ECC DDR4 memory.
Compliance | COM Express® basic, Pin-out Type 7 - COM.0 R3.0 |
Dimension (H x W) | 125 x 95 mm |
CPU | Intel® Xeon® Processor D-1577, 16 C, 1.3 GHz, 24 MByte, 45 W, Intel® Xeon® Processor D-1548, 8 C, 2.0 GHz, 12 MByte, 45 W, Intel® Xeon® Processor D-1537, 8 C, 1.7 GHz, 12 MByte, 35 W, Intel® Xeon® Processor D-1528, 6 C, 1.9 GHz, 9 MByte, 35 W, Intel® Xeon® Processor D-1527, 4 C, 2.2 GHz, 6 MByte, 35 W, Intel® Pentium® Processor D1517, 4 C, 1.6 GHz, 6 MByte, 25 W, Intel® Pentium® Processor D1508, 2 C, 2.2 GHz, 3 MByte, 25 W, Intel® Xeon® Processor D-1559, 12 C, 1.5 GHz, 18 MByte, 45 W, ind. Temp Intel® Xeon® Processor D-1539, 8 C, 1.6 GHz, 12 MByte, 35 W, ind. Temp Intel® Pentium® Processor D1519, 4 C, 1.5 GHz, 6 MByte, 25 W, ind. Temp |
Panel signal | - |
Audio | - |
Main Memory | 2x DDR4 SODIMM dual channel up to 2x 32 GByte ECC or non ECC |
Graphics Controller | - |
Chipset | Integrated in SoC |
Ethernet | 10 Gbit Ethernet (KR) 10/100/1000 MBit Ethernet |
Ethernet Controller | 2x 10 GbE: Integrated in SoC 1x GbE: Intel® I210IT |
Storage | 2x SATA3, 6Gb/s |
Options | - |
PCI Express | 24x PCIe 3.0 (6 controllers, x16, x8, x4 configuration) 8x PCIe 2.0 (8 controllers, x4, x2, x1 configuration), one lane used by onboard 1 GbE LAN controller |
USB | 4x USB 3.0/2.0 |
Serial | 2x serial interface (RX/TX only) |
Common Features | SPI, LPC, SMB, Fast I²C, Staged Watchdog, RTC |
BIOS | AMI UEFI |
Humidity | 93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78) |
Power Management | ACPI 4.0 |
Power Supply | ATX, 8.5 V – 20 V Wide Range, Single Supply Power |
Special Features | Trusted Platfom Module TPM 2.0 |
Operating System | Linux, Windows® Server 2012 / 2012 R2 / 2016, Windows® 7, Windows® 10, VxWorks 7.x |
Temperature | Commercial temperature 0 - 60 °C Industrial temperature -40 °C to +85 °C (specified SKUs only) |
Supported Modules | COMe-bBD7 xx-xxxxxx: commercial temperature COMe-bBD7R E2 xx-xxxxxx: industrial temperature |
Intel Solution Brief: Computer-on-Module Flexibility at the Edge
Kontron COM Express® and COM-HPC® modules with 13th Gen Intel® Core™ mobile processors deliver powerful performance, AI, and graphics with portfolio flexibility for industrial-grade deployments.
[ 18933-1-intel-rpl-p-kontron-solution-brief-v4.pdf, 1.67 MB, Mar.03.2023 ]
Datasheet COMe-bBD7
[ come-bbd7_datasheet.pdf, 1.8 MB, Apr.20.2023 ]
COMe-bBD7 User Guide
Rev. 1.10
[ come-bbd7_user-guide_rev1-10_2023-0714_w2016.pdf, 4.4 MB, Jul.14.2023 ]
General Safety Instruction
[ general-safety-instructions.pdf, 628.88 KB, Aug.02.2024 ]
Modules and Motherboards WP [eingeschränkter Download]
Robotic-Assisted Surgery White Paper [eingeschränkter Download]
Autonomes Fahren
Erfahren Sie wie perfekt unser COM Express® Modul für die Applikation unseres Kunden b-plus passt wegen seiner Flexibilität, Bandbreite, Zuverlässigkeit und der erforderlichen Grafik.
[ uc_b-plus_de.pdf, 1.9 MB, Jul.02.2024 ]
COM Express®: A RECIPE FOR IIOT SUCCESS
How Ectron is tapping into AI and machine learning to further modernize industrial baking, yielding greater efficiency for consistently delicious baked goods
[ ectron-case-study-resized.pdf, 3.93 MB, Apr.20.2023 ]
Die Qual der Prozessor-Wahl
Ein Leitfaden für die Auswahl von Computerboards und -modulen für IoT-Projekte. Mit diesem Leitfaden will Kontron Sie unterstützen die richtige Entscheidung für Ihre Applikation zu treffen: Den bestmöglichen Kompromiss finden zwischen Verarbeitungsleistung, Grafikfähigkeit und Konnektivität einerseits und Größe, Verlustleistung und Kosten andererseits.
[ artikel_processor-choice_de-1-.pdf, 4.43 MB, Apr.20.2023 ]
Autonomer Transport
Die Implementierung von Kontrons neuestem COMe® Basic auf Basis von Intels® Xeon® Prozessoren der 11. Generation und ECC-Speicher lieferte die optimale Leistung und Performance
[ adas_en_use-case_kontron.pdf, 1.54 MB, Oct.11.2022 ]
Tech Specs COM EXPRESS®
[ tech-spec_comexpress.pdf, 7.08 MB, Apr.04.2024 ]
Kontron Services Brochure
[ kontron-services-brochure.pdf, 8.9 MB, Dec.17.2020 ]
Alle weiteren Downloads (Treiber, Downloads etc.) finden Sie auf Kontrons Customer Section
COMe Eval Carrier T7 Gen2
|
COM Express® Eval Carrier Type 7 | more | |
COMe Eval Carrier T7
68300-0000-00-0 |
COM Express® Eval Carrier Type 7 | more | |
HSP COMe-bBD6/7 thread 68004-0000-99-0 |
Heatspreader for COMe-bBD6/bBD7, threaded mounting holes | ||
HSP COMe-bBD6/7 through 68004-0000-99-1 |
Heatspreader for COMe-bBD6/bBD7, through holes | ||
HSK COMe-bBD6 passive (w/o HSP) 68002-0000-99-0C06 |
Passive Cooler for COMe-bBD6/COMe-bBD7 to be mounted on HSP | ||
HSK COMe-bBD6 active (w/o HSP) 68002-0000-99-0C05 |
Active Cooler for COMe-bBD6/bBD7 to be mounted on HSP | ||
DDR4-2400 SODIMM 4GB_COM7 97020-0424-COM7 |
DDR4-2400, 4GB, 260P, 1200MHz, PC4-2400 SODIMM for COMe-cDV7, COMe-bDV7, COMe-bBD7 | ||
DDR4-2400 SODIMM 4GB E2_COM7 97021-0424-COM7 |
DDR4-2400, 4GB, E2, 260P, 1200MHz, PC4-2400 SODIMM for COMe-cDV7, COMe-bDV7, COMe-bBD7 | ||
DDR4-2400 SODIMM 4GB ECC_COM7 97030-0424-COM7 |
DDR4-2400, 4GB, ECC, 260P, 1200MHz, PC4-2400 SODIMM for COMe-cDV7, COMe-bDV7, COMe-bBD7 | ||
DDR4-2400 SODIMM 4GB ECC E2_COM7 97031-0424-COM7 |
DDR4-2400, 4GB, ECC, E2, 260P, 1200MHz, PC4-2400 SODIMM for COMe-cDV7, COMe-bDV7, COMe-bBD7 | ||
DDR4-2400 SODIMM 8GB_COM7 97020-0824-COM7 |
DDR4-2400, 8GB, 260P, 1200MHz, PC4-2400 SODIMM for COMe-cDV7, COMe-bDV7, COMe-bBD7 | ||
DDR4-2400 SODIMM 8GB E2_COM7 97021-0824-COM7 |
DDR4-2400, 8GB, E2, 260P, 1200MHz, PC4-2400 SODIMM for COMe-cDV7, COMe-bDV7, COMe-bBD7 | ||
DDR4-2400 SODIMM 8GB ECC_COM7 97030-0824-COM7 |
DDR4-2400, 8GB, ECC, 260P, 1200MHz, PC4-2400 SODIMM for COMe-cDV7, COMe-bDV7, COMe-bBD7 | ||
DDR4-2400 SODIMM 8GB ECC E2_COM7 97031-0824-COM7 |
DDR4-2400, 8GB, ECC, E2, 260P, 1200MHz, PC4-2400 SODIMM for COMe-cDV7, COMe-bDV7, COMe-bBD7 | ||
DDR4-2400 SODIMM 16GB_COM7 97020-1624-COM7 |
DDR4-2400, 16GB, 260P, 1200MHz, PC4-2400 SODIMM for COMe-cDV7, COMe-bDV7, COMe-bBD7 | ||
DDR4-2400 SODIMM 16GB E2_COM7 97021-1624-COM7 |
DDR4-2400, 16GB, E2, 260P, 1200MHz, PC4-2400 SODIMM for COMe-cDV7, COMe-bDV7, COMe-bBD7 | ||
DDR4-2400 SODIMM 16GB ECC_COM7 97030-1624-COM7 |
DDR4-2400, 16GB, ECC, 260P, 1200MHz, PC4-2400 SODIMM for COMe-cDV7, COMe-bDV7, COMe-bBD7 | ||
DDR4-2400 SODIMM 16GB ECC E2_COM7 97031-1624-COM7 |
DDR4-2400, 16GB, ECC, E2, 260P, 1200MHz, PC4-2400 SODIMM for COMe-cDV7, COMe-bDV7, COMe-bBD7 | ||
DDR4-2400 SODIMM 32GB_COM7 97020-3224-COM7 |
DDR4-2400, 32GB, 260P, 1200MHz, PC4-2400 SODIMM for COMe-cDV7, COMe-bDV7, COMe-bBD7 | ||
DDR4-2400 SODIMM 32GB E2_COM7 97021-3224-COM7 |
DDR4-2400, 32GB, E2, 260P, 1200MHz, PC4-2400 SODIMM for COMe-cDV7, COMe-bDV7, COMe-bBD7 | ||
DDR4-2400 SODIMM 32GB ECC_COM7 97030-3224-COM7 |
DDR4-2400, 32GB, ECC, 260P, 1200MHz, PC4-2400 SODIMM for COMe-cDV7, COMe-bDV7, COMe-bBD7 | ||
DDR4-2400 SODIMM 32GB ECC E2_COM7 97031-3224-COM7 |
DDR4-2400, 32GB, ECC, E2, 260P, 1200MHz, PC4-2400 SODIMM for COMe-cDV7, COMe-bDV7, COMe-bBD7 |
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