COMe-bCD2 Dieses Produkt ist Legacy
COM Express® basic Type 2
with Intel® Core™ Duo Processors
Spezifikationen
- Up to Intel® Core™ Duo (up to 1,66 GHz) processor
- Up to 4 GB DDR2 SODIMM
- 2x SerialATA for highspeed drives, 8x USB 2.0 for fast peripherals
- Up to 4 PCI Express x1 and PCIe Graphic x16
- Gigabit Ethernet for high connectivity
Das neue COM Express® basic Modul COMe-bCD2 basiert auf dem Intel® Core™ Duo Prozessor und Intel® 945GME Chipsatz. PCI-Express ist die wichtigste Datenschnittstelle für kommende x86 basierte Systeme. Komponenten, die nicht auf PCI-Express basieren, wie beispielsweise PCI basierte Erweiterungskarten werden weiterhin über das PCI 2.1 32 Bit Interface unterstützt.
Das COM Express® basic Computer-on-Modul COMe-bCD2 unterstützt 4 PCI-Express x1 und 1x PEG x16. 1x Gigabit Ethernet und 8x USB 2.0 bieten schnelle Interfaces für Netzanschluss und externe Peripherie. COM Express® basic COMs sind zudem mit folgenden Interfaces ausgestattet, die immer an der gleichen Stelle des Boards ausgeführt werden, sodass die Skalierbarkeit zwischen den Modulen garantiert ist: PCI-Express, PCI-, USB-, SerialATA-, ParallelATA-, LVDS-Multimedia-Schnittstellen sowie ein ACPI (Advanced Configuration and Power Interface) für optimiertes Lastmanagement. Sechs Befestigungslöcher auf dem Board gewährleisten eine sichere Montage und bieten erhöhte Schock- und Vibrationsresistenz.
Das COM Express® basic Computer-on-Modul COMe-bCD2 unterstützt 4 PCI-Express x1 und 1x PEG x16. 1x Gigabit Ethernet und 8x USB 2.0 bieten schnelle Interfaces für Netzanschluss und externe Peripherie. COM Express® basic COMs sind zudem mit folgenden Interfaces ausgestattet, die immer an der gleichen Stelle des Boards ausgeführt werden, sodass die Skalierbarkeit zwischen den Modulen garantiert ist: PCI-Express, PCI-, USB-, SerialATA-, ParallelATA-, LVDS-Multimedia-Schnittstellen sowie ein ACPI (Advanced Configuration and Power Interface) für optimiertes Lastmanagement. Sechs Befestigungslöcher auf dem Board gewährleisten eine sichere Montage und bieten erhöhte Schock- und Vibrationsresistenz.
Eigenschaften
| CPU | up to Intel® Core™ Duo processor up to 1,66 GHz up to Intel® Celeron® M processor 1,86 GHz |
| Chipset | Intel® 945GME, ICH7M-DH |
| Hard Disk | 2x Serial ATA (AHCI/RAID 0,1), 1x Parallel ATA |
| USB | 8x USB 2.0 ports |
| Main Memory | Physical memory up to 4 GB (533/667) DDR2 SODIMM by dual channel memory support |
| PCI Express / PCI support | 4 PCI Express x1 / 1 x4; 1 PEG x16 |
| PCI | PCI 2.3, 32 bit / 33 MHz PCI bus |
| Audio Controller | Intel® High Definition Audio / AC' 97 |
| Graphics Controller | Integrated with Intel® Graphics Media Accelerator (GMA950) with DirectX® 9.0/SM3.0 and DVMT 3.0 support; Dual SDVO multiplexed with PEG |
| Resolution | Resolution CRT: CRT up to 2048 x 1536 Resolution LVDS: LVDS up to 1600 x 1200 JILI3 / EDID support |
| Panel signal | LVDS Panel Support: Single and Dual Channel LVDS 18/24 bit |
| TV out | TV out: TV output Component , S-Video or composite HDTV support (480p / 720p / 1080i / 1080p) |
| Common Features | LPC, JIDA Support, WakeOnLAN, I²C Bus, 8x GPIO, JRC support, Suspend states (S0/S3/S4/S5) |
| Watchdog | Watchdog |
| Dimensions (H x W x D) | 95 x 125 mm |
| Compliance | Fully COMexpress™ Type 2 compliant |
| Power Consumption | typ. Idle 14W @ Intel® Core™ Duo processor L2400 LV |
| Temperature | Operation: 0° to 60°C Storage: -30° to 85 °C *Ask about extended temperature ranges |
| Humidity | 93% relative Humidity at 40°C, non-condensing (according to IEC 60068-2-78) |
| Power Management | Power Management ACPI 2.0 (Advanced Configuration and Power Interface) |
| Operating System | Windows® XP Embedded, Windows® CE, Linux and others |
| Ethernet | 10/100/1000 MBit Ethernet, Realtek RTL8111C |
| Real Time Clock | Real Time Clock |
| Darkboot/Lanboot | LAN Boot |
Downloads
Datasheets
Datasheet COMe-bCD2
(Release Candidate)
[ datasheet_come-bcd2.pdf, 1.17 MB, Aug.31.2017 ]
Manuals
User's Guide
[ ccalm120.pdf, 1.94 MB, Sep.11.2017 ]
General Safety Instruction
[ general-safety-instructions.pdf, 560.72 KB, Jan.04.2021 ]
White Papers
COM Express® Design Guide by PICMG, Rev. 2.0
PICMG Guidelines for designing COM Express® Carrier Boards, Rev. 2.0
[ picmg_comdg_2-0-released-2013-12-06.pdf, 3.27 MB, Apr.20.2023 ]
Case Study: ETXexpress Infotainment
Discussion of how Kontron ETXexpress / COM Express modules are used in a home automoation/infotainment application.
[ wp_emd_infotainment_2006.pdf, 2.56 MB, Jun.26.2020 ]
Case Study: UL Certified COMs Deliver Quality
[ wp_ul_2007.pdf, 137.82 KB, Jun.26.2020 ]
Technology Paper about COM Express® Concept
Technology Paper about COM Express® Concept - COM Express® - One Concept, Ever Smaller.
[ com_expr_6seiter_11_2011_en_web.pdf, 2.91 MB, Nov.26.2020 ]
Whitepaper COM Express COM.0 Rev. 2.0
COM Express COM.0 Rev. 2.0 addresses the new functionalities that Intel®, AMD and other manufacturers are integrating in their upcoming processor families. Rev 2.0 adds two new pin-outs that make space for possible future technologies.
[ whitepaper_com-express-com-0-rev--2-0_en.pdf, 2.32 MB, Apr.20.2023 ]
Use Cases
Computer On Modules Magazine - 2007
With high scalability and Value-Add Service
for your customized solution
[ computer_on_modules_brochure2007.pdf, 7.01 MB, Nov.27.2013 ]
Services
Kontron Services Brochure
[ kontron-services-brochure.pdf, 8.9 MB, Dec.17.2020 ]
Weitere Downloads
Alle weiteren Downloads (Treiber, Downloads etc.) finden Sie auf Kontrons Customer Section
Zubehör
|
HSP COMe-bCD2 thread
38003-0000-99-0 |
Heatspreader for COMe-bCD2, threaded mounting holes | more | |
|
HSP COMe-bCD2 through
38003-0000-99-1 |
Heatspreader for COMe-bCD2, through holes | more | |
|
HSK COMe-bCD2 active thread
38003-0000-99-0C01 |
Active cooling solution for COMe-bCD2, threaded mounting holes | more | |
|
HSK COMe-bCD2 passive thread
38003-0000-99-0C02 |
Passive cooling solution for COMe-bCD2, threaded mounting holes | more |
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