COMe-bCD2 Dieses Produkt ist Legacy

COM Express® basic Type 2
with Intel® Core™ Duo Processors
Spezifikationen
  • Up to Intel® Core™ Duo (up to 1,66 GHz) processor
  • Up to 4 GB DDR2 SODIMM
  • 2x SerialATA for highspeed drives, 8x USB 2.0 for fast peripherals
  • Up to 4 PCI Express x1 and PCIe Graphic x16
  • Gigabit Ethernet for high connectivity

Das neue COM Express® basic Modul COMe-bCD2 basiert auf dem Intel® Core™ Duo Prozessor und Intel® 945GME Chipsatz. PCI-Express ist die wichtigste Datenschnittstelle für kommende x86 basierte Systeme. Komponenten, die nicht auf PCI-Express basieren, wie beispielsweise PCI basierte Erweiterungskarten werden weiterhin über das PCI 2.1 32 Bit Interface unterstützt.

Das COM Express® basic Computer-on-Modul COMe-bCD2 unterstützt 4 PCI-Express x1 und 1x PEG x16. 1x Gigabit Ethernet und 8x USB 2.0 bieten schnelle Interfaces für Netzanschluss und externe Peripherie. COM Express® basic COMs sind zudem mit folgenden Interfaces ausgestattet, die immer an der gleichen Stelle des Boards ausgeführt werden, sodass die Skalierbarkeit zwischen den Modulen garantiert ist: PCI-Express, PCI-, USB-, SerialATA-, ParallelATA-, LVDS-Multimedia-Schnittstellen sowie ein ACPI (Advanced Configuration and Power Interface) für optimiertes Lastmanagement. Sechs Befestigungslöcher auf dem Board gewährleisten eine sichere Montage und bieten erhöhte Schock- und Vibrationsresistenz.

Eigenschaften

CPU up to Intel® Core™ Duo processor up to 1,66 GHz
up to Intel® Celeron® M processor 1,86 GHz
Chipset Intel® 945GME, ICH7M-DH
Hard Disk 2x Serial ATA (AHCI/RAID 0,1), 1x Parallel ATA
USB 8x USB 2.0 ports
Main Memory Physical memory up to 4 GB (533/667) DDR2 SODIMM by dual channel memory support
PCI Express / PCI support 4 PCI Express x1 / 1 x4; 1 PEG x16
PCI PCI 2.3, 32 bit / 33 MHz PCI bus
Audio Controller Intel® High Definition Audio / AC' 97
Graphics Controller Integrated with Intel® Graphics Media Accelerator (GMA950) with DirectX® 9.0/SM3.0 and DVMT 3.0 support; Dual SDVO multiplexed with PEG
Resolution Resolution CRT: CRT up to 2048 x 1536
Resolution LVDS: LVDS up to 1600 x 1200
JILI3 / EDID support
Panel signal LVDS Panel Support: Single and Dual Channel LVDS 18/24 bit
TV out TV out: TV output Component , S-Video or composite HDTV support (480p / 720p / 1080i / 1080p)
Common Features LPC, JIDA Support, WakeOnLAN, I²C Bus, 8x GPIO, JRC support, Suspend states (S0/S3/S4/S5)
Watchdog Watchdog
Dimensions (H x W x D) 95 x 125 mm
Compliance Fully COMexpress™ Type 2 compliant
Power Consumption typ. Idle 14W @ Intel® Core™ Duo processor L2400 LV
Temperature Operation: 0° to 60°C
Storage: -30° to 85 °C
*Ask about extended temperature ranges
Humidity 93% relative Humidity at 40°C, non-condensing
(according to IEC 60068-2-78)
Power Management Power Management ACPI 2.0 (Advanced Configuration and Power Interface)
Operating System Windows® XP Embedded, Windows® CE, Linux and others
Ethernet 10/100/1000 MBit Ethernet, Realtek RTL8111C
Real Time Clock Real Time Clock
Darkboot/Lanboot LAN Boot

Downloads

Datasheets

Datasheet COMe-bCD2 (Release Candidate) 
[ datasheet_come-bcd2.pdf, 1.17 MB, Aug.31.2017 ]

Manuals

User's Guide
[ ccalm120.pdf, 1.94 MB, Sep.11.2017 ]

General Safety Instruction
[ general-safety-instructions.pdf, 628.88 KB, Aug.02.2024 ]

White Papers

COM Express® Design Guide by PICMG, Rev. 2.0
PICMG Guidelines for designing COM Express® Carrier Boards, Rev. 2.0
[ picmg_comdg_2-0-released-2013-12-06.pdf, 3.27 MB, Apr.20.2023 ]

Case Study: ETXexpress Infotainment
Discussion of how Kontron ETXexpress / COM Express modules are used in a home automoation/infotainment application.
[ wp_emd_infotainment_2006.pdf, 2.56 MB, Jun.26.2020 ]

Case Study: UL Certified COMs Deliver Quality
[ wp_ul_2007.pdf, 137.82 KB, Jun.26.2020 ]

Technology Paper about COM Express® Concept
Technology Paper about COM Express® Concept - COM Express® - One Concept, Ever Smaller.
[ com_expr_6seiter_11_2011_en_web.pdf, 2.91 MB, Nov.26.2020 ]

Whitepaper COM Express COM.0 Rev. 2.0
COM Express COM.0 Rev. 2.0 addresses the new functionalities that Intel®, AMD and other manufacturers are integrating in their upcoming processor families. Rev 2.0 adds two new pin-outs that make space for possible future technologies.
[ whitepaper_com-express-com-0-rev--2-0_en.pdf, 2.32 MB, Apr.20.2023 ]

Use Cases

Computer On Modules Magazine - 2007
With high scalability and Value-Add Service for your customized solution
[ computer_on_modules_brochure2007.pdf, 7.01 MB, Nov.27.2013 ]

Services

Kontron Services Brochure
[ kontron-services-brochure.pdf, 8.9 MB, Dec.17.2020 ]

Weitere Downloads

Alle weiteren Downloads (Treiber, Downloads etc.) finden Sie auf Kontrons Customer Section

Varianten

COMe-bCD2 L2400
38003-0000-17-5
COM Express® basic pin-out type 2 with Intel® Core™ Duo L2400 2x1.66GHz, 945GME chipset, ICH7M-DH more
COMe-bCD2 CM423
38003-0000-11-4
COM Express® basic pin-out type 2 with Intel® Celeron®M 423 1.06GHz, 945GME chipset, ICH7M-DH more
COMe-bCD2 CM440
38003-0000-19-4
COM Express® basic pin-out type 2 with Intel® Celeron®M 440 1.86GHz, 945GME chipset, ICH7M-DH more

Zubehör

HSP COMe-bCD2 thread
38003-0000-99-0
Heatspreader for COMe-bCD2, threaded mounting holes more
HSP COMe-bCD2 through
38003-0000-99-1
Heatspreader for COMe-bCD2, through holes more
HSK COMe-bCD2 active thread
38003-0000-99-0C01
Active cooling solution for COMe-bCD2, threaded mounting holes more
HSK COMe-bCD2 passive thread
38003-0000-99-0C02
Passive cooling solution for COMe-bCD2, threaded mounting holes more


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