COMe-bID7 Neu
COM Express® basic Type 7 with Intel® Xeon® D-1700 / D-1800 processor family
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Spezifikationen
- Server-grade platform based on Intel® Xeon® D-1700 / D-1800 processor family
- Quad 10 GbE interfaces
- High-speed connectivity 16x PCIe 4.0 + 16x PCIe 3.0, SATA, USB 3.0
- Up to 1 TByte NVMe SSD onboard
- Industrial grade versions
The COMe-bID7 (E2) with scalability from 4 to 10 cores on a small form factor and SKUs for industrial temperature range of -40°C up to +85° as well as 24x7 / 10 years reliability allows robust, space-constraint implementations in harsh environments and extreme conditions.
The module accommodates up to 4x SO-DIMM sockets for a max. of 128GB memory. As storage medium, a soldered NVMe SSD onboard with up to 1 TByte storage capacity is optionally available.
16x PCIe Gen4 plus 16x PCIe Gen3 lanes and 4x 10GBASE-KR interfaces provide an ideal support for high data throughput requirements in demanding I/O and network structures.
The 10GBASE-KR design allows for maximum flexibility by defining the physical interface – KR for backplane connectivity, Copper (RJ45) or fibre (SFP+) - on the base board.
Eigenschaften
| Compliance | COM Express® basic, Pin-out Type 7 - COM.0 R3.1 by default, COM.0 R3.0 on request |
| Dimensions (H x W x D) | 125 x 95 mm |
| CPU | Intel® Xeon® D-1749NT, 90W, 10 core, 3.0GHz Intel® Xeon® D-1735TR, 59W, 8 core, 2.2GHz Intel® Xeon® D-1712TR, 40W, 4 core, 2.0GHz Intel® Xeon® D-1747NTE, 80W, 10 core, 2.5GHz, ind. temp. Intel® Xeon® D-1746TER, 67/56W, 10 core, 2.0GHz, ind. temp. Intel® Xeon® D-1732TE, 52W, 8 core, 1.9GHz, ind. temp. Intel® Xeon® D-1715TER, 50W, 4 core, 2.4GHz, ind. temp. see complete list in COMe-bID7 datasheet |
| Chipset | Integrated in SoC |
| Main Memory | 2x DDR4 SODIMM for up to 64 GByte ECC (non ECC on request) on request: 4x DDR4 SODIMM for up to 128 GByte ECC (non ECC on request) |
| Graphics Controller | - |
| Ethernet Controller | Intel® I225LM/IT Intel® Quad 10GbE LAN integrated in SoC |
| Ethernet | 1x 1/2.5 Gb (1/2.5 GBASE-T) 4x 10Gb (10 GBASE-KR) |
| Storage | 2x SATA3, 6Gb/s |
| Flash Onboard | Up to 1 TByte NVMe SSD (on request) |
| PCI Express | 16x PCIe Gen4 (1 x16, 2 x8, 4 x4) 16x PCIe Gen3 (2 x8, 4 x4, 8 x2) |
| Display | - |
| USB | 4x USB 3.0 (4x USB 2.0) |
| Serial | 2x serial interface (RX/TX only) |
| Audio | - |
| Special Features | TPM 2.0, NVMe SSD, additional 3rd and 4th SODIMM socket |
| Power Management | ACPI 6.0 |
| Power Supply | Commercial temperature: 8.5 V - 20 V Wide Range Industrial temperature: 12 V DC +/- 5% |
| BIOS | AMI UEFI |
| Operating System | Linux, Windows 10 IoT Enterprise, Windows Server 2022 |
| Temperature | Commercial temperature: 0 °C to +60 °C operating, -30 °C to +85 °C non-operating Industrial temperature: -40 °C to +85 °C operating, -40 °C to +85 °C non-operating |
| Humidity | 93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78) |
| Supported Modules | COMe-bID7 xxxxx commercial grade COMe-bID7 E2 xxxxx industrial grade |
Downloads
Solution Brief
Intel Solution Brief: Computer-on-Module Flexibility at the Edge
Kontron COM Express® and COM-HPC® modules with 13th Gen Intel® Core™ mobile processors deliver powerful performance, AI, and graphics with portfolio flexibility for industrial-grade deployments.
[ 18933-1-intel-rpl-p-kontron-solution-brief-v4.pdf, 1.67 MB, Mar.03.2023 ]
Datasheets
Datasheet COMe-bID7
[ come-bid7_data-sheet.pdf, 517.06 KB, Feb.19.2024 ]
Manuals
COMe-bID7 User Guide
[ come-bid7_user-guide_rev-1-6_2024-0216_w2016.pdf, 3.64 MB, Feb.19.2024 ]
General Safety Instruction
[ general-safety-instructions.pdf, 628.88 KB, Aug.02.2024 ]
White Papers
Modules and Motherboards WP [eingeschränkter Download]
Robotic-Assisted Surgery White Paper [eingeschränkter Download]
Use Cases
Autonomes Fahren
Erfahren Sie wie perfekt unser COM Express® Modul für die Applikation unseres Kunden b-plus passt wegen seiner Flexibilität, Bandbreite, Zuverlässigkeit und der erforderlichen Grafik.
[ uc_b-plus_de.pdf, 1.9 MB, Jul.02.2024 ]
COM Express®: A RECIPE FOR IIOT SUCCESS
How Ectron is tapping into AI and machine learning to further modernize industrial baking, yielding greater efficiency for consistently delicious baked goods
[ ectron-case-study-resized.pdf, 3.93 MB, Apr.20.2023 ]
Die Qual der Prozessor-Wahl
Ein Leitfaden für die Auswahl von Computerboards und -modulen für IoT-Projekte. Mit diesem Leitfaden will Kontron Sie unterstützen die richtige Entscheidung für Ihre Applikation zu treffen: Den bestmöglichen Kompromiss finden zwischen Verarbeitungsleistung, Grafikfähigkeit und Konnektivität einerseits und Größe, Verlustleistung und Kosten andererseits.
[ artikel_processor-choice_de-1-.pdf, 4.43 MB, Apr.20.2023 ]
Autonomer Transport
Die Implementierung von Kontrons neuestem COMe® Basic auf Basis von Intels® Xeon® Prozessoren der 11. Generation und ECC-Speicher lieferte die optimale Leistung und Performance
[ adas_en_use-case_kontron.pdf, 1.54 MB, Oct.11.2022 ]
Tech Spec Sheet
Tech Specs COM EXPRESS®
[ tech-spec_comexpress.pdf, 7.08 MB, Apr.04.2024 ]
Services
Kontron Services Brochure
[ kontron-services-brochure.pdf, 8.9 MB, Dec.17.2020 ]
Weitere Downloads
Alle weiteren Downloads (Treiber, Downloads etc.) finden Sie auf Kontrons Customer Section
Zubehör
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COMe Eval Carrier T7 Gen2
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COM Express® Eval Carrier Type 7 | more |
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HSP COMe-bID7 (E2) THREAD 68009-0000-99-0 |
Heatspreader for COMe-bID7 commercial and E2, threaded mounting holes | ||
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HSP COMe-bID7 (E2) THROUGH 68009-0000-99-1 |
Heatspreader for COMe-bID7 commercial and E2, through holes | ||
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HSK COMe-basic active (w/o HSP) 38025-0000-99-0C05 |
Active Cooler for COMe-bxL6/bV26/bDV7/bID7 to be mounted on HSP | ||
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HSK COMe-basic passive (w/o HSP) 38025-0000-99-0C06 |
Passive Cooler for COMe-bxL6/bV26/bDV7/bID7 to be mounted on HSP | ||
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DDR4-3200 SODIMM 8GB ECC_BID7 97030-0832-BID7 |
DDR4-3200, 8GB, 260P, 1600MHz, PC4-3200 SODIMM, ECC | ||
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DDR4-3200 SODIMM 16GB ECC_BID7 97030-1632-BID7 |
DDR4-3200, 16GB, 260P, 1600MHz, PC4-3200 SODIMM, ECC | ||
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DDR4-3200 SODIMM 32GB ECC_BID7 97030-3232-BID7 |
DDR4-3200, 32GB, 260P, 1600MHz, PC4-3200 SODIMM, ECC | ||
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DDR4-3200 SODIMM 8GB ECC E2_BID7 97031-0832-BID7 |
DDR4-3200, 8GB, 260P, 1600MHz, PC4-3200 SODIMM, ECC, -40°C to + 85°C | ||
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DDR4-3200 SODIMM 16GB ECC E2_BID7 97031-1632-BID7 |
DDR4-3200, 16GB, 260P, 1600MHz, PC4-3200 SODIMM, ECC, -40°C to + 85°C | ||
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DDR4-3200 SODIMM 32GB ECC E2_BID7 97031-3232-BID7 |
DDR4-3200, 32GB, 260P, 1600MHz, PC4-3200 SODIMM, ECC, -40°C to + 85°C |
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