COMh-caRP
COM HPC/Client module size A mit der 13. Generation Intel® Core™ Prozessoren
Spezifikationen
- Bis zu 64 GByte DDR5 memory
- Bis zu 2.5Gb Ethernet mit TSN support
- Optional NVMe SSD onboard
- Industrietauglich
Das COMh-caRP basiert auf Intel® Core™ Prozessoren der 13. Generation (ehemaliger Codename Raptor Lake U/P/H). Sie bieten eine deutliche Leistungssteigerung gegenüber der Vorgängergeneration und sind mit 14 Kernen bis hin zu 24 Kernen mit Intel® Performance Hybridarchitektur. ausgestattet Die 13. Generation eignet sich besonders gut für vernetzte IoT-Anwendungen. Ein neuer eingebetteter Controller sorgt für verbesserte Verfügbarkeit, Flexibilität und Systemoffenheit. Das Modul bietet wesentliche, industrietaugliche Funktionen wie die Unterstützung von In-Band Error Correction Code (IBECC) Arbeitsspeicher, Intel® Time Coordinated Computing (Intel® TCC), Time-Sensitive Networking (TSN) und erweiterte Temperaturbereiche von -40 °C bis +85 °C Tjmax.
Alle Features sind perfekt für High Performance Computing in ressourcenintensiven und anspruchsvollen Bereichen wie Networking, Automation und Measurement und Kunden profitieren von der Langzeitverfügbarkeit
Eigenschaften
| Compliance | COM HPC® Client 2x 400 pin connector |
| CPU | Intel® 13th Generation Core™ family For details see table (CPU variants) given below |
| Chipset | lntel® 600/700 Series Chipset Family - On-Package Platform Controller Hub |
| Main Memory | 2x DDR5 SODIMM dual channel up to 64 GByte non ECC |
| Graphics Controller | Intel® Iris XeGraphics architecture with up to 96 EUs, 4 Independent Displays (up to 8K) |
| Ethernet Controller | Intel® i226 |
| Ethernet | Up to 2x 2.5 Gb Ethernet with TSN & WOL support (depending on SKU) |
| Flash Onboard | Up to 1 TByte NVMe SSD (on request) |
| PCI Express / PCI support | 1x 8 PCIe Gen 5.0 (Raptor Lake H-Series, 35-45 W) 2x 4 PCIe Gen 4.0 -> 1x4 shared with onboard NVMe 8x PCIe Gen3.0 Optional 1x PCIe for BMC |
| Display | DDI1: DP++, DDI2: DP++, DDI3: DP++, eDP (DSI, BIOS option), MIPI DSI |
| USB | 2x USB 4.0/ Thunderbolt™ ; 2x USB 3.2; 8x USB 2.0 |
| Serial | 2x serial interface (RX/TX only) |
| Audio | 4x Sound wire, I2S (HW option: Option HD Audio instead of 2x sound wire) |
| Special Features | Trusted Platform Module TPM 2.0 |
| Power Management | ACPI 6.0 |
| Power Supply | Commercial Temperature: 8.0 V – 20 V Wide Range, Single Supply Power Industrial Temperature: 12 V ± 5% |
| BIOS | AMI UEFI |
| Operating System | Windows®10, Linux, VxWorks |
| Temperature | Industrial temperature: -40 °C to +85 °C operating, -40 °C to +85 °C non-operating |
| Humidity | 93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78) |
Downloads
Solution Brief
Intel Solution Brief: Computer-on-Module Flexibility at the Edge
Kontron COM Express® and COM-HPC® modules with 13th Gen Intel® Core™ mobile processors deliver powerful performance, AI, and graphics with portfolio flexibility for industrial-grade deployments.
[ 18933-1-intel-rpl-p-kontron-solution-brief-v4.pdf, 1.67 MB, Mar.03.2023 ]
Datasheets
COMh-caRP
[ comh-carp_datasheet.pdf, 536.44 KB, Jun.26.2024 ]
Manuals
COMh-caRP User Guide
[ comh-carp_userguide_0-3.pdf, 1.46 MB, Aug.02.2023 ]
General Safety Instruction
[ general-safety-instructions.pdf, 628.88 KB, Aug.02.2024 ]
White Papers
Modules and Motherboards WP [eingeschränkter Download]
Robotic-Assisted Surgery White Paper [eingeschränkter Download]
The new Standard COM-HPC – Delivering future proofed power and connectivity
[eingeschränkter Download]
In response to the growing high performance computing requirements and to ensure Computer-on-Modules remain fit-for-purpose long into the future, a new High Performance Computing standard for Modules has been defined by the PICMG: COM-HPC®. This enables more powerful COMs that extend beyond the limits and capabilities of COM Express® (Type 6 and 7) and other COM standards.
While complementary, COM-HPC® is distinct from COM Express®, directly supporting the growing need for more powerful future-proofed compute, scalability, transmission, and network performance.
Tech Spec Sheet
COM-HPC Tech Specs
[ techspec_com-hpc.pdf, 2.02 MB, Apr.04.2024 ]
Services
Kontron Services Brochure
[ kontron-services-brochure.pdf, 8.9 MB, Dec.17.2020 ]
Zubehör
|
COMh Mounting Kit HXX17-0000-00-0 |
COM-HPC Universal Mounting Kit |
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