COMe-bKL6
COM Express® basic Type 6 with 7th Generation Intel® Core™ / Xeon® E3 v6 Processor Family
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Specifications
- Intel® 7th Generation Core™ series / Xeon® E3 v6 family with CM238/QM175 PCH
- Up to 32 GByte DDR4 non-ECC/ECC memory
- Three independent displays with up to 4k@60Hz resolution
- TPM2.0 and built in Hardware Security Device
- Support of Intel® Optane™ memory technology via PCIe
- Industrial grade versions
COMe-bKL6 and COMe-bKL6R E2S deliver a new generation of high performance, feature-rich COM-modules based on the COM Express® basic standard form factor (125 x 95mm) and Intel® 7th Generation Core™ / Xeon® E3 v6 Family processors. These new application-ready modules feature increased CPU and graphics performance compared to its predecessors. Integrated high performance Intel® HD Graphics can support three independent displays with up to 4K resolution, enable developers to create applications that provide excellent user experiences. In addition, the broad scalability of CPU performance grades gives users full flexibility to choose the optimal performance solution that matches their operational requirements.
Both models support up to 32 GB of ECC/non-ECC DDR4 memory, resulting in a reduction in overall power consumption compared to DDR3-based COMs. The Kontron COMe-bKL6R E2S offers industrial grade features making it an ideal platform for applications in harsh and rugged environments.
The COMe-bKL6 and COMe-bKL6R E2S modules are equipped with Kontron’s standard hardware-based embedded Security Solution Approtect, so developers integrating the COMe-bKL6 / COMe-bKL6R E2S can more easily harden their application against a wide variety of security risks.
Learn more about the security solution APPROTECT here: Security Solution - APPROTECT
Features
| Dimensions (H x W x D) | 125 x 95 mm |
| CPU | Intel® Xeon® E3-1505M v6, 4x 3.0GHz (4.0GHz), GT2, 45/35W Intel® Xeon® E3-1505L v6, 4x 2.2GHz (3.0GHz), GT2, 25W Intel® i7-7820EQ Core™ i7, 4x 3.0GHz (3.7GHz), GT2, 45/35W Intel® i5-7440EQ Core™ i5, 4x 2.9GHz (3.6GHz), GT2, 45/35W Intel® i5-7442EQ Core™ i5, 4x 2.1GHz (2.9GHz), GT2, 25W Intel® i3-7100E Core™ i3, 2x 2.9GHz, GT2, 35W Intel® i3-7102E Core™ i3, 2x 2.1GHz, GT2, 25W |
| Chipset | Intel® Mobile CM238 / Intel® Mobile QM175 (Core™ i5 & Core™ i7) |
| Main Memory | 2x DDR4-2400 SO-DIMM up to 2x 16 GByte (non-ECC/ECC) |
| Graphics Controller | Intel® HD Graphics P630 (GT2) |
| Ethernet Controller | Intel® I219LM |
| Ethernet | 10/100/1000 MBit Ethernet |
| Hard Disk | 4x SATA3 6Gb/s |
| PCI Express / PCI support | 8x PCIe x1, 1x PEG x16 |
| Panel signal | DDI1: DP++, DDI2: DP++, DDI3: DP++, VGA: -, LVDS: Dual Channel 18/24bit |
| USB | 4x USB 3.0 (incl. USB 2.0) + 4x USB 2.0 |
| Serial | 2x serial interface (RX/TX only) |
| Audio | Intel® High Definition Audio |
| Common Features | SPI, LPC, SMB, Fast I²C, Staged Watchdog, RTC |
| BIOS | AMI Aptio V |
| Humidity | 93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78) |
| Options | vPRO (AMT/TXT/AES Support), eDP instead of LVDS, VGA, Intel® Mobile HM175 Chipset |
| Power Management | ACPI 4.0, S5 Eco |
| Power Supply | 8.5 V - 20 V Wide Range, Single Supply Power |
| Compliance | COM Express® basic, Pin-out Type 6 |
| Special Features | POSCAP capacitors, Trusted Platfom Module TPM 2.0, Security Chip, 4k Resolutions, Flexible PEG lane configuration by Setup Option, Rapid Shutdown |
| Operating System | Windows® 10, Linux, VxWorks |
| Temperature | COMe-bKL6 - commercial temperature: 0° C to +60° C operating, -30° C to +85° C non-operating COMe-bKL6R E2S - industrial temperature: -40° C to +85° C operating, -40° C to +85° C non-operating |
| Supported Modules | COMe-bKL6 xx-xxxxxx CM238/QM175: commercial temperature COMe-bKL6R E2S xx-xxxxxx CM238: industrial temperature |
Downloads
Solution Brief
Intel Solution Brief: Computer-on-Module Flexibility at the Edge
Kontron COM Express® and COM-HPC® modules with 13th Gen Intel® Core™ mobile processors deliver powerful performance, AI, and graphics with portfolio flexibility for industrial-grade deployments.
[ 18933-1-intel-rpl-p-kontron-solution-brief-v4.pdf, 1.67 MB, Mar.03.2023 ]
Datasheets
Datasheet COMe-bKL6
[ come-bkl6_datasheet.pdf, 2.96 MB, Feb.28.2022 ]
Datasheet COMe-bKL6R E2S
[ come-bkl6r-e2s_datasheet.pdf, 2.95 MB, Feb.28.2022 ]
Manuals
COMe-bKL6 User Guide
Rev 1.7
Jul. 28, 2022
[ come-bkl6-user-guide-rev-1-7-2022-07-28.pdf, 2.32 MB, Sep.11.2024 ]
General Safety Instruction
[ general-safety-instructions.pdf, 628.88 KB, Aug.02.2024 ]
White Papers
Modules and Motherboards WP [restrictions apply]
Robotic-Assisted Surgery White Paper [restrictions apply]
Use Cases
Autonomous Driving
Read how our COM Express® Module is working perfect for application from b-plus with its flexibility, bandwith, reliability and the required graphics.
[ uc_b-plus_eu.pdf, 4.78 MB, May.26.2021 ]
COM Express®: A RECIPE FOR IIOT SUCCESS
How Ectron is tapping into AI and machine learning to further modernize industrial baking, yielding greater efficiency for consistently delicious baked goods
[ ectron-case-study-resized.pdf, 3.93 MB, Apr.20.2023 ]
The tough choice of Processors
Solving challenges in selecting computer boards & modules for IIoT projects. In this article we support you to make the right choice for your application: To find the best balance of processing power, graphics capabilities and connectivity on the one hand and size, power consumption, and cost on the other.
[ artikel_processor-choice_eu-1-.pdf, 4.42 MB, Apr.20.2023 ]
Tech Spec Sheet
Tech Specs COM EXPRESS®
[ tech-spec_comexpress.pdf, 7.08 MB, Apr.04.2024 ]
Services
Kontron Services Brochure
[ kontron-services-brochure.pdf, 8.9 MB, Dec.17.2020 ]
More Downloads
All other downloads such as drivers, bios, drawings etc. are available on Kontron’s Customer Section
Accessories
|
COMe Eval Carrier2 T6
38116-0000-00-5 |
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COM Express® Eval Carrier2 Type 6 with 5mm COMe connector | more |
|
COMe Ref.Carrier T6
38114-0000-00-0 |
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COM Express® Reference Carrier Type 6 | more |
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HSP COMe-bSL6/bKL6/bCL6 Cu-core threaded 38030-0000-99-0 |
Heatspreader for COMe-bSL6/COMe-bKL6/COMe-bCL6 Cu-core threaded mounting holes | ||
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HSP COMe-bSL6/bKL6/bCL6 Cu-core through 38030-0000-99-1 |
Heatspreader for COMe-bSL6/COMe-bKL6/COMe-bCL6 Cu-core through holes | ||
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HSK COMe-basic active (w/o HSP) 38025-0000-99-0C05 |
Active Cooler for COMe-bxL6/bV26/bDV7/bID7 to be mounted on HSP | ||
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HSK COMe-basic passive (w/o HSP) 38025-0000-99-0C06 |
Passive Cooler for COMe-bxL6/bV26/bDV7/bID7 to be mounted on HSP | ||
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DDR4-2400 SODIMM 4GB_COM 97017-4096-24-0 |
DDR4-2400, 4GB, 260P, 1200MHz, PC4-2400 SODIMM | ||
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DDR4-2400 SODIMM 4GB ECC_COM 97018-4096-24-0 |
DDR4-2400, 4GB, ECC, 260P, 1200MHz, PC4-2400 SODIMM | ||
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DDR4-2400 SODIMM 8GB_COM 97017-8192-24-0 |
DDR4-2400, 8GB, 260P, 1200MHz, PC4-2400 SODIMM | ||
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DDR4-2400 SODIMM 8GB ECC_COM 97018-8192-24-0 |
DDR4-2400, 8GB, ECC, 260P, 1200MHz, PC4-2400 SODIMM | ||
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DDR4-2400 SODIMM 16GB_COM 97017-1600-24-0 |
DDR4-2400, 16GB, 260P, 1200MHz, PC4-2400 SODIMM | ||
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DDR4-2400 SODIMM 16GB ECC_COM 97018-1600-24-0 |
DDR4-2400, 16GB, ECC, 260P, 1200MHz, PC4-2400 SODIMM | ||
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DDR4-2400 SODIMM 4GB E2_COM 97017-4096-24-2 |
DDR4-2400, 4GB, E2, 260P, 1200MHz, PC4-2400 SODIMM | ||
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DDR4-2400 SODIMM 4GB ECC E2_COM 97018-4096-24-2 |
DDR4-2400, 4GB, ECC, E2, 260P, 1200MHz, PC4-2400 | ||
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DDR4-2400 SODIMM 8GB E2_COM 97017-8192-24-2 |
DDR4-2400, 8GB, E2, 260P, 1200MHz, PC4-2400 SODIMM | ||
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DDR4-2400 SODIMM 8GB ECC E2_COM 97018-8192-24-2 |
DDR4-2400, 8GB, ECC, E2, 260P, 1200MHz, PC4-2400 SODIMM | ||
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DDR4-2400 SODIMM 16GB E2_COM 97017-1600-24-2 |
DDR4-2400, 16GB, E2, 260P, 1200MHz, PC4-2400 SODIMM | ||
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DDR4-2400 SODIMM 16GB ECC E2_COM 97018-1600-24-2 |
DDR4-2400, 16GB, ECC, E2, 260P, 1200MHz, PC4-2400 SODIMM |
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