COMe-bAI# Dieses Produkt ist Legacy
COM Express® basic Type 2 and 6
with 1st Generation Intel® Core™ Processors
Spezifikationen
- Prozessor Performance bis zu Intel® Core™ i7 SV (2,53GHz) #Unterstützt bis zu 8GB Systemspeicher (DDR3 mit ECC Support) #COM Express® Pin-out Type 2 oder Type 6 #Bis zu 2,6-fache Grafikperformance Verbesserung gegenüber vorherigen Lösungen (gem. 3D Mark06)
Das Kontron COM Express® Computer-on-Module COMe-bAI# bietet OEMs ein neues Niveau an Flexibilität dank 32 nm Intel® Core™ i7 / i5 Prozessor Technologie, hoher Energieeffizienz, umfangreichem Grafiksupport, variablen PCI-Express Konfigurationen sowie zwei Kanäle für RAM inklusive ECC für hohe Datenintegrität. Das COMe-bAI# Computer-on-Module bietet verbesserte Rechen- und Grafikperformance und kommt in vielfältigen High-Performance-Applikationen zur Anwendung.
Eigenschaften
| CPU | Intel® Core™ i7 and i5 processors |
| CPU Clock | up to 2.53 GHz |
| Cache | up to 4M L2 |
| Chipset | Intel® Mobile QM57 Platform Controller Hub |
| Bus Speed | 800/1066 FSB |
| DRAM | Up to 8GBytes (DDR3-RAM), Dual Channel with ECC support. Select non-ECC versions available upon request. |
| DRAM socket | 2x DDR3 SO-DIMM socket up to 8 GByte |
| SM Bus Support | Yes |
| Hard Disk | 4x SerialATA (3Gb/Sec) and PATA |
| USB | USB 2.0, 8 ports |
| Ethernet | 10/100/1000 MBit |
| Ethernet Controller | Intel® 82557 |
| Audio Controller | Intel® High Definition Audio |
| Flat Panel Interface | VGA, LVDS, 3x DDI (SDVO/DP/DVI/HDMI), PEG multiplexed |
| Power Management | ACPI 3.0 |
| Power Supply | 8 V - 18 V |
| Temperature/Humidity | 93% relative Humidity at 40°C, non-condensing (according to IEC 60068-2-78) |
| Power Consumption | 20W-40W (estimate) |
| Dimensions (H x W x D) | 95 x 125 mm |
| PCI Express / PCI support | 6 (x1) lanes on Type 2, 1 PEG x16 / PCI Rev 2.3 @ 33MHz |
Downloads
Datasheets
Datasheet COMe-bAI#
(Release Candidate)
[ datasheet-come-bai-.pdf, 1.63 MB, Aug.31.2017 ]
Manuals
User Guide - ETXexpress-AI (v 1.3)
[ etxe-ai_ug_v1-3.pdf, 2.92 MB, Apr.20.2023 ]
General Safety Instruction
[ general-safety-instructions.pdf, 628.88 KB, Aug.02.2024 ]
White Papers
Whitepaper COM Express COM.0 Rev. 2.0
(Release Candidate)
COM Express COM.0 Rev. 2.0 addresses the new functionalities that Intel®, AMD and other manufacturers are integrating in their upcoming processor families. Rev 2.0 adds two new pin-outs that make space for possible future technologies.
[ whitepaper_com-express-com-0-rev--2-0_en.pdf, 2.32 MB, Apr.20.2023 ]
Whitepaper COM Express COM.0 Rev. 2.0
COM Express COM.0 Rev. 2.0 addresses the new functionalities that Intel®, AMD and other manufacturers are integrating in their upcoming processor families. Rev 2.0 adds two new pin-outs that make space for possible future technologies.
[ whitepaper_com-express-com-0-rev--2-0_en.pdf, 2.32 MB, Apr.20.2023 ]
COM Express® Design Guide by PICMG, Rev. 2.0
PICMG Guidelines for designing COM Express® Carrier Boards, Rev. 2.0
[ picmg_comdg_2-0-released-2013-12-06.pdf, 3.27 MB, Apr.20.2023 ]
Technology Paper about COM Express® Concept
Technology Paper about COM Express® Concept - COM Express® - One Concept, Ever Smaller.
[ com_expr_6seiter_11_2011_en_web.pdf, 2.91 MB, Nov.26.2020 ]
Services
Kontron Services Brochure
[ kontron-services-brochure.pdf, 8.9 MB, Dec.17.2020 ]
Weitere Downloads
Alle weiteren Downloads (Treiber, Downloads etc.) finden Sie auf Kontrons Customer Section
Zubehör
|
HSK COMe-bAI# active thread
38010-0000-99-0C01 |
Active cooling solution for COMe-bAI#, threaded mounting holes | more | |
|
HSK COMe-bAI# passive thread
38010-0000-99-0C02 |
Passive cooling solution for COMe-bAI# pin-out Type 2 and type 6, threaded mounting holes | more | |
|
HSP COMe-bAI# thread
38010-0000-99-0 |
Heatspreader for COMe-bAI#, threaded mounting holes | more | |
|
HSP COMe-bAI# through
38010-0000-99-1 |
Heatspreader for COMe-bAI#, through holes | more |
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Services
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