COMe-bDV7
COM Express® basic Type 7 with Intel® Atom® processor C3000 product family
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Spezifikationen
- Entry level server-grade platform
- Quad 10 GbE interfaces
- High-speed connectivity PCIe 3.0, SATA3, USB 3.0
- Up to 128GB DDR4 memory
- Industrial grade versions
The COM Express® module COMe-bDV7 based on the Intel® Atom® processor C3000 series extends Kontron’s product family of server-grade COM platforms. The COMe-bDV7 as an entry level platform is as a complementary product to the high performance class COMe-bBD7 equipped with the Intel® Xeon® processor D-1500 series. The COMe-bDV7 module features scalable CPU performance with up to 16 cores. This robust performance is combined with support for up to four 10GbE-KR ports making it ideal for network intensive implementations. The KR design allows for maximum flexibility by defining the physical interface – KR for backplane connectivity, Copper (RJ45) or fibre (SFP+) on the base board in conjunction with a suitable PHY. Furthermore the available NC-SI signals allow for the connection of a Baseboard Management Controller (BMC) on the baseboard for the purpose of enabling out-of-band remote manageability. This enhances reliability and helps reducing the overall operating cost in general.
In addition, the COMe-bDV7 offers high-speed connectivity from configurable PCIe Gen3.0 lanes for high I/O performance demands. Offering a well-balanced multi-core CPU versus memory-size approach, it supports up to 64GB ECC or non-ECC DDR4 memory via two SODIMM sockets, optionally up to 128 GB via 4 SODIMM sockets .
Eigenschaften
| Compliance | COM Express® basic, Pin-out Type 7 - COM.0 R3.0 |
| Dimensions (H x W x D) | 125 x 95 mm |
| CPU | Commercial temperature: Intel® Atom® Processor C3958, 16C, 2.0GHz, 31W TDP Intel® Atom® Processor C3858, 12C, 2.0GHz, 25W TDP Intel® Atom® Processor C3758, 8C, 2.2GHz, 25W TDP Intel® Atom® Processor C3558, 4C, 2.2GHz, 16W TDP Industrial temperature: Intel® Atom® Processor C3808, 12C, 2.0 GHz, 25 W TDP Intel® Atom® Processor C3708, 8C, 1.7 GHz, 17 W TDP Intel® Atom® Processor C3508, 4C, 1.5 GHz, 11 W TDP Intel® Atom® Processor C3308, 2C, 1.6 GHz, 9 W TDP |
| Panel signal | - |
| Audio | - |
| Main Memory | 2x DDR4 SODIMM for up to 64 GByte ECC / non ECC on request: 4x DDR4 SODIMM for up to 128 GByte ECC / non ECC |
| Graphics Controller | - |
| Chipset | Integrated in SoC |
| Ethernet | 1x 10/100/1000 MBit Ethernet Up to 4x 10GbE Interfaces (KR) – depending on C3000 SKU NC-SI support |
| Ethernet Controller | Intel® I210IT (uses one lane of PCIe 3.0) - 1 GbE Intel® Quad LAN integrated in SoC - up to 4x 10 GbE |
| Hard Disk | Up to 2x SATA3, 6Gb/s |
| Options | eMMC 5.1 (build option) |
| PCI Express / PCI support | Up to 14x PCIe 3.0 lanes - depending on C3000 SKU |
| USB | Up to 3x USB3.0 / 4x USB2.0 |
| Serial | 2x serial interface (RX/TX only) |
| Common Features | SPI, LPC, SMB, Fast I²C, Staged Watchdog, RTC |
| BIOS | AMI UEFI |
| Humidity | 93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78) |
| Power Management | ACPI 5.0 |
| Power Supply | ATX, 8.5 V – 20 V Wide Range, Single Supply Power |
| Special Features | Trusted Platfom Module TPM 2.0 |
| Operating System | Linux, Windows® Server 2012 / 2012 R2 / 2016, Windows® 7, VxWorks 7 |
| Temperature | Commercial temperature 0 - 60 °C Industrial temperature -40 °C to +85 °C (specified SKUs only) |
| Supported Modules | COMe-bDV7 COMe-bDV7 E2 |
Downloads
Solution Brief
Intel Solution Brief: Computer-on-Module Flexibility at the Edge
Kontron COM Express® and COM-HPC® modules with 13th Gen Intel® Core™ mobile processors deliver powerful performance, AI, and graphics with portfolio flexibility for industrial-grade deployments.
[ 18933-1-intel-rpl-p-kontron-solution-brief-v4.pdf, 1.67 MB, Mar.03.2023 ]
Datasheets
Datasheet COMe-bDV7
[ come-bdv7_20210125_datasheet.pdf, 1.89 MB, Feb.02.2021 ]
Manuals
COMe-bDV7 user guide
Rev 1.9
Jul. 28. 2022
[ come-bdv7_user-guide_rev-1-9_2021-07-26.pdf, 2.26 MB, Oct.18.2024 ]
General Safety Instruction
[ general-safety-instructions.pdf, 628.88 KB, Aug.02.2024 ]
White Papers
Modules and Motherboards WP [eingeschränkter Download]
Robotic-Assisted Surgery White Paper [eingeschränkter Download]
Use Cases
Autonomes Fahren
Erfahren Sie wie perfekt unser COM Express® Modul für die Applikation unseres Kunden b-plus passt wegen seiner Flexibilität, Bandbreite, Zuverlässigkeit und der erforderlichen Grafik.
[ uc_b-plus_de.pdf, 1.9 MB, Jul.02.2024 ]
COM Express®: A RECIPE FOR IIOT SUCCESS
How Ectron is tapping into AI and machine learning to further modernize industrial baking, yielding greater efficiency for consistently delicious baked goods
[ ectron-case-study-resized.pdf, 3.93 MB, Apr.20.2023 ]
Die Qual der Prozessor-Wahl
Ein Leitfaden für die Auswahl von Computerboards und -modulen für IoT-Projekte. Mit diesem Leitfaden will Kontron Sie unterstützen die richtige Entscheidung für Ihre Applikation zu treffen: Den bestmöglichen Kompromiss finden zwischen Verarbeitungsleistung, Grafikfähigkeit und Konnektivität einerseits und Größe, Verlustleistung und Kosten andererseits.
[ artikel_processor-choice_de-1-.pdf, 4.43 MB, Apr.20.2023 ]
Autonomer Transport
Die Implementierung von Kontrons neuestem COMe® Basic auf Basis von Intels® Xeon® Prozessoren der 11. Generation und ECC-Speicher lieferte die optimale Leistung und Performance
[ adas_en_use-case_kontron.pdf, 1.54 MB, Oct.11.2022 ]
Tech Spec Sheet
Tech Specs COM EXPRESS®
[ tech-spec_comexpress.pdf, 7.08 MB, Apr.04.2024 ]
Services
Kontron Services Brochure
[ kontron-services-brochure.pdf, 8.9 MB, Dec.17.2020 ]
Weitere Downloads
Alle weiteren Downloads (Treiber, Downloads etc.) finden Sie auf Kontrons Customer Section
Zubehör
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COMe Eval Carrier T7 Gen2
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COM Express® Eval Carrier Type 7 | more |
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COMe Eval Carrier T7
68300-0000-00-0 |
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COM Express® Eval Carrier Type 7 | more |
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HSP COMe-bDV7 thread 68007-0000-99-0 |
Heatspreader for COMe-bDV7 threaded mounting holes | ||
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HSP COMe-bDV7 through 68007-0000-99-1 |
Heatspreader for COMe-bDV7 through mounting holes | ||
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HSK COMe-bDV7 125x95 passive thread 68007-0000-99-0C01 |
Passive heat sink for COMe-bDV7 - threaded, all-in-one cooler | ||
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HSK COMe-bDV7 passive through 68007-0000-99-1C01 |
Passive heat sink for COMe-bDV7 - through, all-in-one cooler | ||
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HSK COMe-basic active (w/o HSP) 38025-0000-99-0C05 |
Active Cooler for COMe-bxL6/bV26/bDV7/bID7 to be mounted on HSP | ||
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HSK COMe-basic passive (w/o HSP) 38025-0000-99-0C06 |
Passive Cooler for COMe-bxL6/bV26/bDV7/bID7 to be mounted on HSP | ||
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DDR4-2400 SODIMM 4GB_COM7 97020-0424-COM7 |
DDR4-2400, 4GB, 260P, 1200MHz, PC4-2400 SODIMM for COMe-cDV7, COMe-bDV7, COMe-bBD7 | ||
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DDR4-2400 SODIMM 4GB E2_COM7 97021-0424-COM7 |
DDR4-2400, 4GB, E2, 260P, 1200MHz, PC4-2400 SODIMM for COMe-cDV7, COMe-bDV7, COMe-bBD7 | ||
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DDR4-2400 SODIMM 4GB ECC E2_COM7 97031-0424-COM7 |
DDR4-2400, 4GB, ECC, E2, 260P, 1200MHz, PC4-2400 SODIMM for COMe-cDV7, COMe-bDV7, COMe-bBD7 | ||
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DDR4-2400 SODIMM 4GB ECC_COM7 97030-0424-COM7 |
DDR4-2400, 4GB, ECC, 260P, 1200MHz, PC4-2400 SODIMM for COMe-cDV7, COMe-bDV7, COMe-bBD7 | ||
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DDR4-2400 SODIMM 8GB_COM7 97020-0824-COM7 |
DDR4-2400, 8GB, 260P, 1200MHz, PC4-2400 SODIMM for COMe-cDV7, COMe-bDV7, COMe-bBD7 | ||
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DDR4-2400 SODIMM 8GB E2_COM7 97021-0824-COM7 |
DDR4-2400, 8GB, E2, 260P, 1200MHz, PC4-2400 SODIMM for COMe-cDV7, COMe-bDV7, COMe-bBD7 | ||
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DDR4-2400 SODIMM 8GB ECC_COM7 97030-0824-COM7 |
DDR4-2400, 8GB, ECC, 260P, 1200MHz, PC4-2400 SODIMM for COMe-cDV7, COMe-bDV7, COMe-bBD7 | ||
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DDR4-2400 SODIMM 8GB ECC E2_COM7 97031-0824-COM7 |
DDR4-2400, 8GB, ECC, E2, 260P, 1200MHz, PC4-2400 SODIMM for COMe-cDV7, COMe-bDV7, COMe-bBD7 | ||
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DDR4-2400 SODIMM 16GB_COM7 97020-1624-COM7 |
DDR4-2400, 16GB, 260P, 1200MHz, PC4-2400 SODIMM for COMe-cDV7, COMe-bDV7, COMe-bBD7 | ||
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DDR4-2400 SODIMM 16GB E2_COM7 97021-1624-COM7 |
DDR4-2400, 16GB, E2, 260P, 1200MHz, PC4-2400 SODIMM for COMe-cDV7, COMe-bDV7, COMe-bBD7 | ||
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DDR4-2400 SODIMM 16GB ECC_COM7 97030-1624-COM7 |
DDR4-2400, 16GB, ECC, 260P, 1200MHz, PC4-2400 SODIMM for COMe-cDV7, COMe-bDV7, COMe-bBD7 | ||
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DDR4-2400 SODIMM 16GB ECC E2_COM7 97031-1624-COM7 |
DDR4-2400, 16GB, ECC, E2, 260P, 1200MHz, PC4-2400 SODIMM for COMe-cDV7, COMe-bDV7, COMe-bBD7 | ||
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DDR4-2400 SODIMM 32GB_COM7 97020-3224-COM7 |
DDR4-2400, 32GB, 260P, 1200MHz, PC4-2400 SODIMM for COMe-cDV7, COMe-bDV7, COMe-bBD7 | ||
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DDR4-2400 SODIMM 32GB E2_COM7 97021-3224-COM7 |
DDR4-2400, 32GB, E2, 260P, 1200MHz, PC4-2400 SODIMM for COMe-cDV7, COMe-bDV7, COMe-bBD7 | ||
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DDR4-2400 SODIMM 32GB ECC_COM7 97030-3224-COM7 |
DDR4-2400, 32GB, ECC, 260P, 1200MHz, PC4-2400 SODIMM for COMe-cDV7, COMe-bDV7, COMe-bBD7 | ||
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DDR4-2400 SODIMM 32GB ECC E2_COM7 97031-3224-COM7 |
DDR4-2400, 32GB, ECC, E2, 260P, 1200MHz, PC4-2400 SODIMM for COMe-cDV7, COMe-bDV7, COMe-bBD7 |
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