COMe-cEL6 (E2) Neu
COM Express® compact Type 6 with Intel Atom® x6000E, Pentium® and Celeron® Series
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Spezifikationen
- Low-power – performance/watt optimized form factor solution
- Up to 32 GByte DDR4-3200 Memory via 2x SODIMM sockets (In-Band ECC)
- Triple display support
- 6x PCIe 3.0 lanes
- Up to 4x USB 3.1/2.0, 4x USB 2.0, 2x SATA, eMMC Flash
- 1GbE (optional 2.5GbE) with TSN support
- Industrial grade temperature
The COMe-cEL6 COM Express compact Type 6 module is highly scalable and covers the entire range of Intel's x6000 IoT-ready embedded processors. The COMe-cEL6 portfolio range from a cost optimized dual-core Intel Celeron (2x 1.2 GHz with 6W TDP) iteration optimized for energy-sensitive applications to genuine quad-core Intel Atom (4x 1.9 with 12W TDP) versions for high-end real-time applications.
Users benefit from a significantly improved computing performance, an impressive performance-per-watt ratio and the long-term availability inherent in all Kontron embedded solutions.
Eigenschaften
| Compliance | COM Express® compact, Pin-out Type 6 - COM.0 R3.0 |
| Dimension (H x W) | 95 x 95 mm |
| CPU | COMe-cEL6: Intel® Celeron® J6413, 4C, 1.8/3.0GHz, 16EU, 10W Intel® Pentium® J6426, 4C, 2.0/3.0GHz, 32EU, 10W Intel® Celeron® N6211, 2C, 1.2/3.0GHz, 16EU, 6.5W Intel® Pentium® N6415, 4C, 1.2/3.0GHz, 16EU, 6.5W COMe-cEL6 E2: Intel® Atom® x6211E, 2C, 1.3/3.0GHz, 16EU, 6W Intel® Atom® x6413E, 4C, 1.5/3.0GHz, 16EU, 9W Intel® Atom® x6425E, 4C, 2.0/3.0GHz, 32EU, 12W Intel® Atom® x6212RE, 2C, 1.2GHz/-, 16EU, 6W Intel® Atom® x6214RE, 2C, 1.4GHz/-, 16EU, 6W Intel® Atom® x6414RE, 4C, 1.5GHz/-, 16EU, 9W Intel® Atom® x6416RE, 4C, 1.7GHz/-, 16EU, 9W Intel® Atom® x6425RE, 4C, 1.8GHz/-, 32EU, 12W |
| Chipset | Integrated in SOC |
| Main Memory | Up to 32 GByte DDR4-3200 via 2x SODIMM sockets (In-Band ECC) |
| Graphics Controller | SOC: Intel® HD Gfx Gen11: 1x LVDS/eDP (3840 x 2160 @ 60 Hz) 2x DP (++) on DDI1/DDI2 up to 4K |
| Ethernet Controller | SOC + LAN PHY GPY115 (GPY215 on request) |
| Ethernet | 1GBit Ethernet (2.5GBit on request with GPY215) |
| Storage | 2x SATA 6Gb/s |
| Flash Onboard | Build option: - up to 84 GByte eMMC pSLC - up to 256 GByte eMMC TLC |
| PCI Express | 6x PCIe Gen 3.0 lanes - PCIe lane configurations: 1 x4 /2 x2 / 4 x1 + 1 x2 / 2 x1 |
| Display | DDI 1/2: DP++, LVDS: Dual Channel up to 48-bit or eDP on request |
| USB | Default: 2x USB 3.1 (incl. USB 2.0) + 6x USB 2.0 Option: 4x USB 3.1 (incl. USB 2.0) + 4x USB 2.0 USB 2.0 port7 does support dual role (Client/Host) |
| Serial | 2x serial interface (RX/TX only) |
| Audio | Intel® High Definition Audio |
| Common Features | SPI, LPC, SMB, Fast I²C, Staged Watchdog, RTC |
| Special Features | Industrial grade temperature |
| Options | eMMC Flash option (up to 84 GByte pSLC, up to 256 GByte MLC) eDP instead of LVDS General Purpose SPI instead of Boot SPI eSPI instead of LPC to the COMe connector 4x USB3.1 w/ add USB-Hub instead of 2x USB 3.1 USB client, Trusted Platform Module TPM 2.0, de-populated LAN PHY |
| Power Management | ACPI 6.0 |
| Power Supply | 8.5 V – 20 V Wide Range, Single Supply Power |
| BIOS | AMI Aptio V |
| Operating System | Windows® 10, Linux, VxWorks |
| Temperature | COMe-cEL6- commercial temperature: 0° C to +60° C operating -30° C to +85° C non-operating COMe-cEL6 E2 - industrial temperature: -40° C to +85° C operating -40° C to +85° C non-operating |
| Humidity | 93% relative Humidity at 40°C, non-condensing (according to IEC 60068-2-78) |
| Supported Modules | commercial temperature: COMe-cEL6 (36033-xxxx-xx-x) industrial temperature: COMe-cEL6 E2 (36034-xxxx-xx-x) |
Downloads
Solution Brief
Intel Solution Brief: Computer-on-Module Flexibility at the Edge
Kontron COM Express® and COM-HPC® modules with 13th Gen Intel® Core™ mobile processors deliver powerful performance, AI, and graphics with portfolio flexibility for industrial-grade deployments.
[ 18933-1-intel-rpl-p-kontron-solution-brief-v4.pdf, 1.67 MB, Mar.03.2023 ]
Datasheets
Datasheet COMe-cEL6
[ come-cel6_datasheet.pdf, 449.37 KB, Nov.15.2024 ]
Manuals
COMe-cEL6 (E2) User Guide
Rev 1.5
[ come-cel6_user-guide_rev-1-5_2024-1028.pdf, 3.64 MB, Oct.28.2024 ]
General Safety Instruction
[ general-safety-instructions.pdf, 628.88 KB, Aug.02.2024 ]
White Papers
Modules and Motherboards WP [eingeschränkter Download]
Robotic-Assisted Surgery White Paper [eingeschränkter Download]
Use Cases
Autonomes Fahren
Erfahren Sie wie perfekt unser COM Express® Modul für die Applikation unseres Kunden b-plus passt wegen seiner Flexibilität, Bandbreite, Zuverlässigkeit und der erforderlichen Grafik.
[ uc_b-plus_de.pdf, 1.9 MB, Jul.02.2024 ]
Autonomer Transport
Die Implementierung von Kontrons neuestem COMe® Basic auf Basis von Intels® Xeon® Prozessoren der 11. Generation und ECC-Speicher lieferte die optimale Leistung und Performance
[ adas_en_use-case_kontron.pdf, 1.54 MB, Oct.11.2022 ]
Die Qual der Prozessor-Wahl
Ein Leitfaden für die Auswahl von Computerboards und -modulen für IoT-Projekte. Mit diesem Leitfaden will Kontron Sie unterstützen die richtige Entscheidung für Ihre Applikation zu treffen: Den bestmöglichen Kompromiss finden zwischen Verarbeitungsleistung, Grafikfähigkeit und Konnektivität einerseits und Größe, Verlustleistung und Kosten andererseits.
[ artikel_processor-choice_de-1-.pdf, 4.43 MB, Apr.20.2023 ]
Tech Spec Sheet
COM EXPRESS® compact
[ tech-spec_comexpress.pdf, 7.08 MB, Apr.04.2024 ]
Services
Kontron Services Brochure
[ kontron-services-brochure.pdf, 8.9 MB, Dec.17.2020 ]
Weitere Downloads
Alle weiteren Downloads (Treiber, Downloads etc.) finden Sie auf Kontrons Customer Section
Zubehör
|
COMe Eval Carrier2 T6
38116-0000-00-5 |
|
COM Express® Eval Carrier2 Type 6 with 5mm COMe connector | more |
|
HSP COMe-cEL6 (E2) THREAD 36034-0000-99-0 |
Heatspreader for COMe-cEL6 commercial and E2, threaded mounting holes | ||
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HSP COMe-cEL6 (E2) THROUGH 36034-0000-99-1 |
Heatspreader for COMe-cEL6 commercial and E2, through holes | ||
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COMe Active Uni Cooler (w/o HSP) 36099-0000-99-0 |
COM Express® Universal Active Cooler for Heatspreader Mounting (87x78x14.3mm) (for CPU's <20W) | ||
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COMe Passive Uni Cooler (w/o HSP) 36099-0000-99-1 |
COM Express® Universal Passive Cooler for Heatspreader Mounting (87x78x14.3mm) (for CPU's <10W) | ||
|
COMe Passive Uni Cooler Slim (w/o HSP) 36099-0000-99-3 |
COM Express® Universal Passive Cooler low profile for Heatspreader Mounting (95x95x10 mm) 90° fin direction mounting option | ||
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DDR4-3200 SODIMM 4G_CEL6 97020-0432-CEL6 |
Memory for Computer-on-Module; min. specification: DDR4-3200, 4GB, 260P, 1600MHz, PC4-3200 SODIMM | ||
|
DDR4-3200 SODIMM 8GB_CEL6 97020-0832-CEL6 |
Memory for Computer-on-Module; min. specification: DDR4-3200, 8GB, 260P, 1600MHz, PC4-3200 SODIMM | ||
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DDR4-3200 SODIMM 16GB_CEL6 97020-1632_cel6 |
Memory for Computer-on-Module; min. specification: DDR4-3200, 16GB, 260P, 1600MHz, PC4-3200 SODIMM | ||
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DDR4-3200 SODIMM 32GBCEL6 97020-3232-CEL6 |
Memory for Computer-on-Module; min. specification: DDR4-3200, 32GB, 260P, 1600MHz, PC4-3200 SODIMM | ||
|
DDR4-3200 SODIMM 4GB_CEL6 97021-0432-CEL6 |
Memory for Computer-on-Module; min. specification: DDR4-3200, 4GB, 260P, 1600MHz, PC4-3200 SODIMM, industrial temperature | ||
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DDR4-3200 SODIMM 8GB_CEL6 97021-0832-CEL6 |
Memory for Computer-on-Module; min. specification: DDR4-3200, 8GB, 260P, 1600MHz, PC4-3200 SODIMM, industrial temperature | ||
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DDR4-3200 SODIMM 16GB E2_CEL6 97021-1632-CEL6 |
Memory for Computer-on-Module; min. specification: DDR4-3200, 16GB, 260P, 1600MHz, PC4-3200 SODIMM, industrial temperature | ||
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DDR4-3200 SODIMM 32GB_CEL6 97021-3232-CEL6 |
Memory for Computer-on-Module; min. specification: DDR4-3200, 32GB, 260P, 1600MHz, PC4-3200 SODIMM, industrial temperature |
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