COMe-cTL6 (E2)
COM Express® Compact Type 6 with 11th Generation Intel® Core™/ Celeron® Processors
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Spezifikationen
- Up to 48 GByte DDR4 memory (16 GByte DDR4 memory down)
- Up to 2.5 Gb Ethernet with TSN support
- Optional NVMe SSD onboard
- Industrial grade versions
Eigenschaften
| Compliance | COM Express® Compact Pin-out Type 6 |
| Dimensions (H x W x D) | 95 x 95 mm |
| CPU | Intel® 11th Generation CoreTM / Celeron® family For details see table (CPU variants) given below |
| Chipset | Integrated SoC |
| Main Memory | 1x DDR4 SO-DIMM up to 32 GByte, 2nd channel DDR4 memory down up to 16 GByte |
| Graphics Controller | Intel® Iris®Xe Graphics on i7/i5 processors Intel® UHD Graphics on i3 processors |
| Ethernet Controller | Intel® I225LM/I225IT |
| Ethernet | Up to 2.5Gb Ethernet with TSN support (depending on SKU) |
| Storage | 2x SATA 6Gb/s |
| Flash Onboard | Up to 1 TByte NVMe SSD (on request) |
| PCI Express | 5x PCIe 3.0 (On request: 6x without Ethernet, up to 8x without Ethernet & SATA) 1x4 PCIe 4.0 on PEG Lanes #0-3 |
| Display | DDI1: DP++, DDI2: DP++, DDI3: DP++, VGA: -, LVDS: Dual Channel 18/24bit |
| USB | 4x USB 3.1 (incl. USB 2.0) + 4x USB 2.0 |
| Serial | 2x serial interface (RX/TX only) |
| Audio | High Definition Audio interface |
| Special Features | POSCAP capacitors, Trusted Platform Module TPM 2.0 |
| Power Management | ACPI 6.0 |
| Power Supply | 8.5 V – 20 V Wide Range, Single Supply Power |
| BIOS | AMI Aptio V |
| Operating System | Windows®10, Linux, VxWorks |
| Temperature | Commercial temperature: 0 °C to +60 °C operating, -30 °C to +85 °C non-operating Extended temperature: -25 °C to +75 °C operating, -30 °C to +85 °C non-operating Industrial temperature: -40 °C to +85 °C operating, -40 °C to +85 °C non-operating |
| Humidity | 93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78) |
Downloads
Solution Brief
Intel Solution Brief: Computer-on-Module Flexibility at the Edge
Kontron COM Express® and COM-HPC® modules with 13th Gen Intel® Core™ mobile processors deliver powerful performance, AI, and graphics with portfolio flexibility for industrial-grade deployments.
[ 18933-1-intel-rpl-p-kontron-solution-brief-v4.pdf, 1.67 MB, Mar.03.2023 ]
Use Cases
Autonomes Fahren
Erfahren Sie wie perfekt unser COM Express® Modul für die Applikation unseres Kunden b-plus passt wegen seiner Flexibilität, Bandbreite, Zuverlässigkeit und der erforderlichen Grafik.
[ uc_b-plus_de.pdf, 1.9 MB, Jul.02.2024 ]
Autonomer Transport
Die Implementierung von Kontrons neuestem COMe® Basic auf Basis von Intels® Xeon® Prozessoren der 11. Generation und ECC-Speicher lieferte die optimale Leistung und Performance
[ adas_en_use-case_kontron.pdf, 1.54 MB, Oct.11.2022 ]
Die Qual der Prozessor-Wahl
Ein Leitfaden für die Auswahl von Computerboards und -modulen für IoT-Projekte. Mit diesem Leitfaden will Kontron Sie unterstützen die richtige Entscheidung für Ihre Applikation zu treffen: Den bestmöglichen Kompromiss finden zwischen Verarbeitungsleistung, Grafikfähigkeit und Konnektivität einerseits und Größe, Verlustleistung und Kosten andererseits.
[ artikel_processor-choice_de-1-.pdf, 4.43 MB, Apr.20.2023 ]
Datasheets
COME-CTL6 (E2) - Datasheet
[ come-ctl6_datasheet.pdf, 1.62 MB, May.19.2022 ]
Manuals
COMe-cTL6 (E2) User Guide
Rev. 2.2,
May. 24, 2024
[ come-ctl6_user-guide_rev2-2_2024-05-24.pdf, 3.49 MB, May.24.2024 ]
General Safety Instruction
[ general-safety-instructions.pdf, 628.88 KB, Aug.02.2024 ]
White Papers
Modules and Motherboards WP [eingeschränkter Download]
Robotic-Assisted Surgery White Paper [eingeschränkter Download]
Tech Spec Sheet
COM EXPRESS® compact
[ tech-spec_comexpress.pdf, 7.08 MB, Apr.04.2024 ]
Services
Kontron Services Brochure
[ kontron-services-brochure.pdf, 8.9 MB, Dec.17.2020 ]
Zubehör
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COMe Eval Carrier2 T6
38116-0000-00-5 |
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COM Express® Eval Carrier2 Type 6 with 5mm COMe connector | more |
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HSP COMe-cTL6 Cu-core threaded 36030-0000-99-0 |
Heatspreader for COMe-cTL6, Cu-core, threaded mounting holes | ||
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HSP COMe-cTL6 Cu-core through 36030-0000-99-1 |
Heatspreader for COMe-cTL6, Cu-core, through mounting holes | ||
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COMe Active Uni Cooler2 (w/o HSP) 36099-0000-99-4 |
COM Express® Universal Active Cooler2 for Heatspreader Mounting (95x95x14.3) - 90° turnable | ||
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COMe Passive Uni Cooler2 (w/o HSP) 36099-0000-99-5 |
COM Express® Universal Passive Cooler for Heatspreader Mounting (95x95x14.3) - 90° turnable | ||
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DDR4-3200 SODIMM 32GB_CTL6 97020-3232-CTL6 |
Memory for Computer-on-Module COMe-cTL6; min. specification: DDR4-3200, 32GB, 260P, 1600MHz, PC4-3200 SODIMM; validated for: COMe-cTL6 | ||
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DDR4-3200 SODIMM 16GB_CTL6 97020-1632-CTL6 |
Memory for Computer-on-Module COMe-cTL6; min. specification: DDR4-3200, 16GB, 260P, 1600MHz, PC4-3200 SODIMM; validated for: COMe-cTL6 | ||
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DDR4-3200 SODIMM 8GB_CTL6 97020-0832-CTL6 |
Memory for Computer-on-Module COMe-cTL6; min. specification: DDR4-3200, 8GB, 260P, 1600MHz, PC4-3200 SODIMM; validated for: COMe-cTL6 | ||
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DDR4-3200 SODIMM 4GB_CTL6 97020-0432-CTL6 |
Memory for Computer-on-Module COMe-cTL6; min. specification: DDR4-3200, 4GB, 260P, 1600MHz, PC4-3200 SODIMM; validated for: COMe-cTL6 | ||
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DDR4-3200 SODIMM 32GB E2_CTL6 97021-3232-CTL6 |
Memory for Computer-on-Module COMe-cTL6; min. specification: DDR4-3200, 32GB, 260P, 1600MHz, PC4-3200 SODIMM; validated for: COMe-cTL6 E2 | ||
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DDR4-3200 SODIMM 16GB E2_CTL6 97021-1632-CTL6 |
Memory for Computer-on-Module COMe-cTL6; min. specification: DDR4-3200, 16GB, 260P, 1600MHz, PC4-3200 SODIMM; validated for: COMe-cTL6 E2 | ||
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DDR4-3200 SODIMM 8GB E2_CTL6 97021-0832-CTL6 |
Memory for Computer-on-Module COMe-cTL6; min. specification: DDR4-3200, 8GB, 260P, 1600MHz, PC4-3200 SODIMM; validated for: COMe-cTL6 E2 | ||
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DDR4-3200 SODIMM 4GB E2_CTL6 97021-0432-CTL6 |
Memory for Computer-on-Module COMe-cTL6; min. specification: DDR4-3200, 4GB, 260P, 1600MHz, PC4-3200 SODIMM; validated for: COMe-cTL6 E2 |
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