COMh-sdIL E2 Neu
COM-HPC®/Server with Intel® Xeon® D-1700 / D-1800 processor family
Spezifikationen
- Size D "small" form factor – 120 x 160 mm
- Intel Xeon D-1700 / D-1800 Server platform
- Up to 10 cores, processor TDP up to 67W
- 16x PCIe Gen 4.0 lanes + 16x PCIe Gen 3.0 lanes
- 8x LAN Ports for various configurations - up to 100GbE
- Memory: Max 64GB soldered memeory with ECC support
- Optional onboard storage NVMe
- Industrial temperature versions
- Embedded management controller
The COMh-sdIL with scalability from 4 to 10 cores, SKUs for an extended temperature range and 24x7 / 10 years reliability allows very robust implementations for harsh environments and extreme conditions in a small mechanical footprint.
The module accommodates up to 64GB DDR4-ECC soldered memory, as storage medium, a soldered NVMe SSD onboard with up to 1 TByte storage capacity is optionally available.
With 32x PCIe lanes (16x PCIe Gen4 plus 16x PCIe Gen3 lanes) and 2x Quad LAN interfaces supporting 100Gb Ethernet, the COMh-sdIL is an ideal platform for high data throughput requirements in demanding I/O and network structures.
Downloads
Datasheets
Datasheet COMh-sdIL
[ comh-sdil_datasheet.pdf, 752.12 KB, Sep.04.2024 ]
Manuals
COMh-sdIL User Guide
[ comh-sdil-user-guide_rev-1-0_2024-1122.pdf, 2.75 MB, Nov.22.2024 ]
General Safety Instruction
[ general-safety-instructions.pdf, 628.88 KB, Aug.02.2024 ]
White Papers
Modules and Motherboards WP [eingeschränkter Download]
Robotic-Assisted Surgery White Paper [eingeschränkter Download]
The new Standard COM-HPC – Delivering future proofed power and connectivity
[eingeschränkter Download]
In response to the growing high performance computing requirements and to ensure Computer-on-Modules remain fit-for-purpose long into the future, a new High Performance Computing standard for Modules has been defined by the PICMG: COM-HPC®. This enables more powerful COMs that extend beyond the limits and capabilities of COM Express® (Type 6 and 7) and other COM standards.
While complementary, COM-HPC® is distinct from COM Express®, directly supporting the growing need for more powerful future-proofed compute, scalability, transmission, and network performance.
Tech Spec Sheet
COM-HPC Tech Specs
[ techspec_com-hpc.pdf, 2.02 MB, Apr.04.2024 ]
Services
Kontron Services Brochure
[ kontron-services-brochure.pdf, 8.9 MB, Dec.17.2020 ]
Weitere Downloads
Alle weiteren Downloads (Treiber, Downloads etc.) finden Sie auf Kontrons Customer Section
Zubehör
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COMh Eval Carrier Server
HST01-0000-10-0 |
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COMh Eval Carrier Server | more |
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HSP COMh-sdIL (E2) thread HSD04-0000-99-0 |
Heatspreader for COMh-sdIL commercial and E2, threaded mounting holes | ||
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HSP COMh-sdIL (E2) through HSD04-0000-99-1 |
Heatspreader for COMh-sdIL commercial and E2, through holes | ||
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COMh Size D Active Uni Cooler (w/o HSP) HSD99-0000-99-0 |
COM-HPC Size D Universal Active Cooler for Heatspreader Mounting (160 x 100 x 46 mm) | ||
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COMh Size D Passive Uni Cooler (w/o HSP) HSD99-0000-99-1 |
COM-HPC Size D Universal Passive Cooler for Heatspreader Mounting (160 x 100 x 46 mm) | ||
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COMh Mounting Kit HXX17-0000-00-0 |
COM-HPC Universal Mounting Kit |
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