COMe-bSL6
COM Express® basic Type 6
with 6th Generation Intel® Core™ Processors
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Spezifikationen
- Intel® 6th Generation Core™ series / Xeon® E3 v5 family with CM236/QM170 PCH
- Up to 32 GByte DDR4 non-ECC/ECC memory
- Industrial grade versions
- Support of Kontron’s Embedded Security Solution (Approtect)
COMe-bSL6 and COMe-bSL6R E2S deliver a new generation of high performance, feature-rich COM-modules based on the COM Express® basic standard form factor (125 x 95mm) and Intel® 6th Generation Core™ / Xeon® E3 v5 Family processors. These new application-ready modules feature increased CPU and graphics performance compared to its predecessors. Integrated high performance Intel® HD Graphics or Intel® Iris™ Pro Graphics with 128M of on-package cache memory, can support three independent displays with up to 4K resolution, enable developers to create applications that provide excellent user experiences. In addition, the broad scalability of CPU performance grades gives users full flexibility to choose the optimal performance solution that matches their operational requirements.
Both models support up to 32 GB of ECC/non-ECC DDR4 memory, resulting in a reduction in overall power consumption compared to DDR3-based COMs. The Kontron COMe-bSL6R E2S offers industrial grade features making it an ideal platform for applications in harsh and rugged environments.
The COMe-bSL6 and COMe-bSL6R E2S modules are equipped with Kontron’s standard hardware-based embedded Security Solution Approtect, so developers integrating the COMe-bSL6 / COMe-bSL6R E2S can more easily harden their application against a wide variety of security risks.
Learn more about the security solution Approtect here: Security Solution - Approtect
Eigenschaften
| Compliance | COM Express® basic, Pin-out Type 6 |
| Dimensions (H x W x D) | 125 x 95 mm |
| CPU | Intel® Xeon® E3-1515M, Intel® Xeon® E3-1505M, Intel® Xeon® E3-1505L, Intel® Core™ i7-6820EQ, Intel® Core™ i7-6822EQ, Intel® Core™ i5-6440EQ, Intel® Core™ i5-6442EQ, Intel® Core™ i3-6100E, Intel® Core™ i3-6102E, Intel® Celeron™ G3900E, Intel® Celeron™ G3902E |
| Chipset | Intel® Mobile CM236 / Intel® Mobile QM170 (Core™ i5 & Core™ i7) |
| Main Memory | 2x DDR4-2133 SO-DIMM up to 2x 16 GByte (non-ECC/ECC) |
| Graphics Controller | Intel® Iris™ Pro Graphics P580 (GT4e) Intel® HD Graphics P530 (GT2) Intel® HD Graphics P510 (GT1) |
| Ethernet Controller | Intel® I219LM |
| Ethernet | 10/100/1000 MBit Ethernet |
| Hard Disk | 4x SATA3 6Gb/s |
| PCI Express / PCI support | 8x PCIe x1, 1x PEG x16 |
| Panel signal | DDI1: DP++, DDI2: DP++, DDI3: DP++, VGA: -, LVDS: Dual Channel 18/24bit |
| USB | 4x USB 3.0 (incl. USB 2.0) + 4x USB 2.0 |
| Serial | 2x serial interface (RX/TX only) |
| Audio | Intel® High Defi nition Audio |
| Common Features | SPI, LPC, SMB, Fast I²C, Staged Watchdog, RTC, MARS |
| BIOS | AMI Aptio V |
| Humidity | 93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78) |
| Options | vPRO (AMT/TXT/AES Support), eDP instead of LVDS, VGA, Intel® Mobile HM170 Chipset |
| Power Management | ACPI 4.0, S5 Eco |
| Power Supply | 8.5 V - 20 V Wide Range, Single Supply Power |
| Special Features | POSCAP capacitors, Trusted Platfom Module TPM 2.0, Security Chip, 4k Resolutions, Flexible PEG lane configuration by Setup Option |
| Operating System | Windows® 10, Windows® 8.1, Windows® 7, WEI8, WE8S, WES7, Linux, VxWorks |
| Temperature | Commercial temperature: 0° C to +60° C operating, -30° C to +85° C non-operating Extended temperature: -25° C to +75° C operating, -30° C to +85° C non-operating Industrial temperature: -40° C to +85° C operating, -40° C to +85° C non-operating |
| Supported Modules | COMe-bSL6 xx-xxxxxx CM236/QM170 COMe-bSL6R E2S xx-xxxxxx CM236 |
Downloads
Solution Brief
Intel Solution Brief: Computer-on-Module Flexibility at the Edge
Kontron COM Express® and COM-HPC® modules with 13th Gen Intel® Core™ mobile processors deliver powerful performance, AI, and graphics with portfolio flexibility for industrial-grade deployments.
[ 18933-1-intel-rpl-p-kontron-solution-brief-v4.pdf, 1.67 MB, Mar.03.2023 ]
Datasheets
Datasheet COMe-bSL6
[ come-bsl6_datasheet.pdf, 3.08 MB, Feb.28.2022 ]
Datasheet COMe-bSL6R E2S
[ come-bsl6-e2s_datasheet.pdf, 3.08 MB, Feb.28.2022 ]
Manuals
COMe-bSL6 user manual
Rev. 1.8
Jul. 28, 2022
[ come-bsl6-user-guide_rev-1-8_2022-07-28.pdf, 2.11 MB, Apr.20.2023 ]
General Safety Instruction
[ general-safety-instructions.pdf, 628.88 KB, Aug.02.2024 ]
White Papers
Modules and Motherboards WP [eingeschränkter Download]
Robotic-Assisted Surgery White Paper [eingeschränkter Download]
Use Cases
Autonomes Fahren
Erfahren Sie wie perfekt unser COM Express® Modul für die Applikation unseres Kunden b-plus passt wegen seiner Flexibilität, Bandbreite, Zuverlässigkeit und der erforderlichen Grafik.
[ uc_b-plus_de.pdf, 1.9 MB, Jul.02.2024 ]
COM Express®: A RECIPE FOR IIOT SUCCESS
How Ectron is tapping into AI and machine learning to further modernize industrial baking, yielding greater efficiency for consistently delicious baked goods
[ ectron-case-study-resized.pdf, 3.93 MB, Apr.20.2023 ]
Die Qual der Prozessor-Wahl
Ein Leitfaden für die Auswahl von Computerboards und -modulen für IoT-Projekte. Mit diesem Leitfaden will Kontron Sie unterstützen die richtige Entscheidung für Ihre Applikation zu treffen: Den bestmöglichen Kompromiss finden zwischen Verarbeitungsleistung, Grafikfähigkeit und Konnektivität einerseits und Größe, Verlustleistung und Kosten andererseits.
[ artikel_processor-choice_de-1-.pdf, 4.43 MB, Apr.20.2023 ]
Autonomer Transport
Die Implementierung von Kontrons neuestem COMe® Basic auf Basis von Intels® Xeon® Prozessoren der 11. Generation und ECC-Speicher lieferte die optimale Leistung und Performance
[ adas_en_use-case_kontron.pdf, 1.54 MB, Oct.11.2022 ]
Tech Spec Sheet
Tech Specs COM EXPRESS®
[ tech-spec_comexpress.pdf, 7.08 MB, Apr.04.2024 ]
Services
Kontron Services Brochure
[ kontron-services-brochure.pdf, 8.9 MB, Dec.17.2020 ]
Weitere Downloads
Alle weiteren Downloads (Treiber, Downloads etc.) finden Sie auf Kontrons Customer Section
Varianten
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COMe-bSL6 E3-1505L CM236 38030-0000-20-4 |
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Xeon® E3-1505L v5, 4x2,0GHz, CM236 PCH, GT2, 2x DDR4 non-ECC/ECC SO-DIMM | ||
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COMe-bSL6 E3-1505M CM236 38030-0000-28-4 |
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COM Express® basic pin-out type 6 Computer-on-Module with Intel® Xeon® E3-1505M v5, 4x2,8GHz, CM236 PCH, 2x DDR4 non-ECC/ECC SO-DIMM | |
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COMe-bSL6 E3-1515M CM236 38030-0000-28-8 |
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COM Express® basic pin-out type 6 Computer-on-Module with Intel® Xeon® E3-1515M v5, 4x2,8GHz, CM236 PCH, GT4e, 2x DDR4 non-ECC/ECC SO-DIMM | |
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COMe-bSL6 G3900E CM236 38030-0000-24-2 |
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COM Express® basic pin-out type 6 Computer-on-Module with Intel® Celeron® G3900E, 2x2.4GHz, CM236 PCH, GT1, 2x DDR4 non-ECC/ECC SO-DIMM | |
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COMe-bSL6 G3902E CM236 38030-0000-16-2 |
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COM Express® basic pin-out type 6 Computer-on-Module with Intel® Celeron® G3902E, 2x1.6GHz, CM236 PCH, GT1, 2x DDR4 non-ECC/ECC SO-DIMM | |
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COMe-bSL6 i3-6100E CM236 38030-0000-27-3 |
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COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i3-6100E, 2x2,7GHz, CM236 PCH, GT2, 2x DDR4 non-ECC/ECC SO-DIMM | |
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COMe-bSL6 i3-6102E CM236 38030-0000-19-3 |
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COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i3-6102E, 2x1.9GHz, CM236 PCH, GT2, 2x DDR4 non-ECC/ECC SO-DIMM | |
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COMe-bSL6 i5-6440EQ QM170 38030-0000-27-5 |
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COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i5-6440EQ, 4x2,7GHz, QM170 PCH, GT2, 2x DDR4 non-ECC SO-DIMM | |
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COMe-bSL6 i5-6442EQ QM170 38030-0000-19-5 |
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COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i5-6442EQ, 4x1,9GHz, QM170 PCH, GT2, 2x DDR4 non-ECC SO-DIMM | |
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COMe-bSL6 i7-6820EQ QM170 38030-0000-28-7 |
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i7-6820EQ, 4x2,8GHz, QM170 PCH, GT2, 2x DDR4 non-ECC SO-DIMM | ||
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COMe-bSL6 i7-6822EQ QM170 38030-0000-20-7 |
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i7-6822EQ, 4x2,0GHz, QM170 PCH, GT2, 2x DDR4 non-ECC SO-DIMM | ||
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COMe-bSL6R E2S E3-1505L CM236 38031-0000-20-4 |
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COM Express® basic pin-out type 6 Computer-on-Module with Intel® Xeon® E3-1505L v5, 4x2,0GHz, CM236 PCH, GT2, 2x DDR4 non-ECC/ECC SO-DIMM, Rapid Shutdown, industrial temperature grade | |
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COMe-bSL6R E2S E3-1505M CM236 38031-0000-28-4 |
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Xeon® E3-1505M v5, 4x2,8GHz, CM236 PCH, GT2, 2x DDR4 non-ECC/ECC SO-DIMM, Rapid Shutdown, industrial temperature grade | ||
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COMe-bSL6R E2S E3-1515M CM236 38031-0000-28-8 |
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COM Express® basic pin-out type 6 Computer-on-Module with Intel® Xeon® E3-1515M v5, 4x2,8GHz, CM236 PCH, GT4e, 2x DDR4 non-ECC/ECC SO-DIMM, Rapid Shutdown, industrial temperature grade | |
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COMe-bSL6R E2S G3900E CM236 38031-0000-24-2 |
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Celeron® G3900E, 2x2.4GHz, CM236 PCH, GT1, 2x DDR4 non-ECC/ECC SO-DIMM, Rapid Shutdown, industrial temperature grade | ||
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COMe-bSL6R E2S G3902E CM236 38031-0000-16-2 |
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COM Express® basic pin-out type 6 Computer-on-Module with Intel® Celeron® G3902E, 2x1.6GHz, CM236 PCH, GT1, 2x DDR4 non-ECC/ECC SO-DIMM, Rapid Shutdown, industrial temperature grade | |
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COMe-bSL6R E2S i3-6100E CM236 38031-0000-27-3 |
COM Express® basic pin-out type 6 Computer-on-Module with Intel® Core™ i3-6100E, 2x2,7GHz, CM236 PCH, GT2, 2x DDR4 non-ECC/ECC SO-DIMM, Rapid Shutdown, industrial temperature grade |
Zubehör
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COMe Eval Carrier2 T6
38116-0000-00-5 |
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COM Express® Eval Carrier2 Type 6 with 5mm COMe connector | more |
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COMe Ref.Carrier T6
38114-0000-00-0 |
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COM Express® Reference Carrier Type 6 | more |
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HSP COMe-bSL6/bKL6/bCL6 Cu-core threaded 38030-0000-99-0 |
Heatspreader for COMe-bSL6/COMe-bKL6/COMe-bCL6 Cu-core threaded mounting holes | ||
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HSP COMe-bSL6/bKL6/bCL6 Cu-core through 38030-0000-99-1 |
Heatspreader for COMe-bSL6/COMe-bKL6/COMe-bCL6 Cu-core through holes | ||
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HSK COMe-basic active (w/o HSP) 38025-0000-99-0C05 |
Active Cooler for COMe-bxL6/bV26/bDV7/bID7 to be mounted on HSP | ||
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HSK COMe-basic passive (w/o HSP) 38025-0000-99-0C06 |
Passive Cooler for COMe-bxL6/bV26/bDV7/bID7 to be mounted on HSP | ||
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DDR4-2400 SODIMM 4GB_COM 97017-4096-24-0 |
DDR4-2400, 4GB, 260P, 1200MHz, PC4-2400 SODIMM | ||
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DDR4-2400 SODIMM 4GB E2_COM 97017-4096-24-2 |
DDR4-2400, 4GB, E2, 260P, 1200MHz, PC4-2400 SODIMM | ||
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DDR4-2400 SODIMM 4GB ECC_COM 97018-4096-24-0 |
DDR4-2400, 4GB, ECC, 260P, 1200MHz, PC4-2400 SODIMM | ||
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DDR4-2400 SODIMM 4GB ECC E2_COM 97018-4096-24-2 |
DDR4-2400, 4GB, ECC, E2, 260P, 1200MHz, PC4-2400 | ||
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DDR4-2400 SODIMM 8GB_COM 97017-8192-24-0 |
DDR4-2400, 8GB, 260P, 1200MHz, PC4-2400 SODIMM | ||
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DDR4-2400 SODIMM 8GB E2_COM 97017-8192-24-2 |
DDR4-2400, 8GB, E2, 260P, 1200MHz, PC4-2400 SODIMM | ||
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DDR4-2400 SODIMM 8GB ECC_COM 97018-8192-24-0 |
DDR4-2400, 8GB, ECC, 260P, 1200MHz, PC4-2400 SODIMM | ||
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DDR4-2400 SODIMM 8GB ECC E2_COM 97018-8192-24-2 |
DDR4-2400, 8GB, ECC, E2, 260P, 1200MHz, PC4-2400 SODIMM | ||
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DDR4-2400 SODIMM 16GB_COM 97017-1600-24-0 |
DDR4-2400, 16GB, 260P, 1200MHz, PC4-2400 SODIMM | ||
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DDR4-2400 SODIMM 16GB E2_COM 97017-1600-24-2 |
DDR4-2400, 16GB, E2, 260P, 1200MHz, PC4-2400 SODIMM | ||
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DDR4-2400 SODIMM 16GB ECC_COM 97018-1600-24-0 |
DDR4-2400, 16GB, ECC, 260P, 1200MHz, PC4-2400 SODIMM | ||
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DDR4-2400 SODIMM 16GB ECC E2_COM 97018-1600-24-2 |
DDR4-2400, 16GB, ECC, E2, 260P, 1200MHz, PC4-2400 SODIMM | ||
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KAB-HSP 200mm 96079-0000-00-0 |
Fan cable adapter for 3pin standard FAN connector to 3pin molex connector, cable length 200mm | ||
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KAB-HSP 40mm 96079-0000-00-2 |
Fan cable adapter for 3pin standard FAN connector to 3pin molex connector, cable length 40mm | ||
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COMe Mount Kit 5mm 1set 38017-0000-00-5 |
COM Express® Mounting Kit 5mm 1set for threaded HSP and Cooling Solutions | ||
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COMe Mount Kit 5mm 100sets 38017-0100-00-5 |
COM Express® Mounting Kit 5mm 100 sets | ||
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COMe Mount KIT 8mm 1set 38017-0000-00-0 |
COM Express® Mounting Kit 8mm 1set for threaded HSP and Cooling Solutions | ||
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COMe Mount Kit 8mm 100sets 38017-0100-00-0 |
COM Express® Mounting Kit 8mm 100sets |
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